A silicon wafer cleaning device and coating equipment

Abstract

The utility model relates to photovoltaic cell technical field especially relates to a kind of silicon wafer cleaning device and coating equipment, including scraper, reciprocating mechanism and telescopic mechanism;Reciprocating mechanism includes first driving part, transmission assembly and swing arm, first driving part is connected with transmission assembly, transmission assembly is connected with the one end of swing arm, scraper is fixed to the other end of swing arm, first driving part can drive swing arm reciprocating swing around its one end with transmission assembly connection;Telescopic mechanism is connected with reciprocating mechanism, to drive reciprocating mechanism movement along vertical direction;By telescopic mechanism, scraper can be sent to the lower of carrier plate, and by first driving part drive transmission assembly drive swing arm swing around its one end, to make the scraper fixed to the other end of swing arm can repeatedly scratch target material above, to complete the cleaning of scraper, solve the technical problem that silicon wafer deviates due to carrier plate deformation in prior art, further lead to abnormal technical problem of starting.

Description

Technical Field

[0001] This utility model relates to the field of photovoltaic cell technology, and in particular to a silicon wafer cleaning device and coating equipment. Background Technology

[0002] Physical vapor deposition (PVD) is a technology that uses physical methods such as evaporation and sputtering to vaporize the coating material and deposit it onto the substrate surface to form a film. PVD equipment in the heterojunction industry mainly consists of automated feeding, a main unit, and automated unloading.

[0003] Automated feeding involves a carrier plate positioning camera gripping the positioning holes on the carrier plate. When the feeding gantry picks up the silicon wafers on the track and they reach the placement position, the parameters are fed back to achieve precise placement of the silicon wafers on the carrier plate.

[0004] However, during the coating process, the substrate is continuously bombarded by target atoms, negative ions, electrons, etc., which causes the temperature to rise continuously and generate thermal stress. When the thermal stress cannot be released in time, it will cause the substrate to deform, resulting in the silicon wafer being offset after being placed on the substrate. This makes it easy for the silicon wafer to fall onto the target during the back coating process, leading to ignition abnormalities. Utility Model Content

[0005] The purpose of this invention is to provide a silicon wafer cleaning device and a coating equipment to solve the technical problem in the prior art where silicon wafers are misaligned due to carrier plate deformation, causing them to easily fall onto the target material during back-side coating, thus leading to abnormal ignition.

[0006] In a first aspect, the present invention provides a silicon wafer cleaning device, comprising: scraper; A reciprocating mechanism, comprising a first driving member, a transmission assembly, and a swing arm, wherein the first driving member is connected to the transmission assembly, the transmission assembly is connected to one end of the swing arm, the scraper is fixed to the other end of the swing arm, and the first driving member is capable of driving the swing arm to reciprocate around the end connected to the transmission assembly. A telescopic mechanism is connected to the reciprocating mechanism to drive the reciprocating mechanism to move in the vertical direction.

[0007] Furthermore, the transmission assembly includes a mounting bracket, a rocker arm, a connecting rod, a first transmission gear, and a residual gear; The first driving component is fixed to the mounting bracket. One end of the connecting rod is connected to the driving end of the first driving component. The other end of the connecting rod is movably connected to one end of the swing arm. The other end of the swing arm is connected to the residual gear. The residual gear is rotatably mounted on the mounting bracket. The residual gear meshes with the first transmission gear. The first transmission gear is connected to one end of the swing arm.

[0008] Furthermore, the telescopic mechanism includes a mounting box, a second driving component, a transmission screw, a guide rod, and a telescopic component; The mounting box has a cavity for receiving, the guide rod is fixedly installed in the cavity, the transmission screw is parallel to the guide rod, the telescopic member is slidably installed on the guide rod and is threadedly connected to the transmission screw, the second driving member is connected to the transmission screw and drives the transmission screw to rotate around its own axis so that the telescopic member can extend into or retract into the cavity, and the mounting bracket is fixed to the telescopic end of the telescopic member.

[0009] Furthermore, the silicon wafer cleaning device also includes a fixing bracket and connecting bolts; The fixed bracket has a fixed plate and a clamping plate that can move closer to or further away from each other. The fixed plate and the clamping plate are arranged parallel to each other. The connecting bolt passes through the fixed plate and is bolted to the clamping plate so that the fixed bracket can clamp the carrier plate in the coating chamber. The mounting box is connected to the clamping plate.

[0010] Furthermore, the silicon wafer cleaning device also includes two gaskets; One of the gaskets is disposed on the side of the fixing plate near the clamping plate and connected to the fixing plate, and the other gasket is disposed on the side of the clamping plate near the fixing plate and connected to the clamping plate. The gaskets are made of an elastic material.

[0011] Furthermore, the silicon wafer cleaning device also includes an adjustment component and a third driving component; One end of the adjusting member is fixed to the clamping plate, and the other end of the adjusting member is hinged to the mounting box. The third driving member is fixed to the adjusting member and is hinged to the mounting box to drive the mounting box to rotate.

[0012] Furthermore, the silicon wafer cleaning mechanism also includes a scraper mechanism; The scraper mechanism is located at the swing end of the swing arm, and the scraper mechanism has a scraper arranged in a horizontal direction.

[0013] Furthermore, the silicon wafer cleaning mechanism also includes auxiliary mounting components and a locking mechanism; The auxiliary mounting component is fixed horizontally to the swing end of the swing arm. The bottom of the auxiliary mounting component is provided with a sliding groove. The scraper is provided with a slider so that the scraper can be slidably connected to the auxiliary mounting component. The locking mechanism is provided on the auxiliary mounting component and can be engaged with the scraper.

[0014] Furthermore, the locking mechanism includes a spring, a locking block, and a sliding rod; The auxiliary mounting component has a locking cylinder on one side along the horizontal direction. The slide rod extends into the locking cylinder. The spring and the locking block are both sleeved on the slide rod and are both located inside the locking cylinder. One end of the spring is connected to the locking block, and the other end of the spring abuts against the locking cylinder. The scraper is provided with a slot, and the locking block can extend into the slot and engage with it.

[0015] Secondly, this utility model also provides a coating device, including the aforementioned silicon wafer cleaning device.

[0016] Compared with the prior art, the silicon wafer cleaning device provided by this utility model includes a scraper, a reciprocating mechanism, and a telescopic mechanism. The reciprocating mechanism includes a first driving member, a transmission assembly, and a swing arm. The first driving member is connected to the transmission assembly, and the transmission assembly is connected to one end of the swing arm. The scraper is fixed to the other end of the swing arm. The first driving member can drive the swing arm to reciprocate around the end connected to the transmission assembly. The telescopic mechanism is connected to the reciprocating mechanism to drive the reciprocating mechanism to move in the vertical direction. The telescopic mechanism can send the scraper to the underside of the carrier plate, and the first driving member drives the transmission assembly to drive the swing arm to swing around one end of the carrier plate. This allows the scraper fixed to the other end of the swing arm to repeatedly scrape the top of the target material to complete the cleaning of the scraper. This solves the technical problem in the prior art where silicon wafer displacement caused by carrier plate deformation leads to abnormal ignition. It achieves carrier plate cleaning, sweeps away fallen silicon wafers, and eliminates the risks of production capacity loss, target material waste, and inefficient wafer production caused by cavity opening. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of the silicon wafer cleaning device provided in this embodiment of the utility model; Figure 2This is a schematic diagram of the overall structure of the silicon wafer cleaning device provided in this embodiment of the present invention after installation. Figure 3 This is a schematic diagram of the reciprocating mechanism in the silicon wafer cleaning device provided in this embodiment of the utility model; Figure 4 This is a schematic diagram of the telescopic mechanism in the silicon wafer cleaning device provided in this embodiment of the utility model; Figure 5 This is a schematic diagram of the auxiliary mounting components and locking mechanism in the silicon wafer cleaning device provided in this embodiment of the utility model.

[0019] Figure label: 100. Scraper; 200. Reciprocating mechanism; 210. First driving component; 220. Transmission assembly; 221. Mounting bracket; 222. Rocker arm; 223. Connecting rod; 224. First transmission gear; 225. Residual gear; 230. Swing arm; 300. Telescopic mechanism; 310. Mounting box; 320. Second drive component; 330. Transmission screw; 340. Guide rod; 350. Telescopic component; 410. Fixing plate; 420. Clamping plate; 430. Connecting bolt; 440. Washer; 510. Adjustment parts; 520. Third drive; 610. Auxiliary installation components; 611. Locking cylinder; 620. Locking mechanism; 621. Spring; 622. Locking block; 623. Slide rod. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0025] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] Example 1 like Figures 1 to 5 As shown, this utility model embodiment provides a silicon wafer cleaning device, including a scraper 100, a reciprocating mechanism 200, and a telescopic mechanism 300. The reciprocating mechanism 200 includes a first driving member 210, a transmission assembly 220, and a swing arm 230. The first driving member 210 is connected to the transmission assembly 220, and the transmission assembly 220 is connected to one end of the swing arm 230. The scraper 100 is fixed to the other end of the swing arm 230. The first driving member 210 can drive the swing arm 230 to reciprocate around the end connected to the transmission assembly 220. The telescopic mechanism 300 is connected to the reciprocating mechanism 200 to drive the reciprocating mechanism 200 to move in the vertical direction.

[0028] That is, the silicon wafer cleaning mechanism provided in this embodiment of the utility model can send the scraper 100 to the underside of the carrier plate through the telescopic mechanism 300, and drive the transmission assembly 220 through the first driving member 210 to drive the swing arm 230 to swing around one end, so that the scraper 100 fixed at the other end of the swing arm 230 can repeatedly scrape the top of the target material to complete the cleaning of the scraper 100. This solves the technical problem in the prior art that silicon wafer displacement caused by carrier plate deformation leads to abnormal ignition, realizes the cleaning of the carrier plate, sweeps off the fallen silicon wafers, and eliminates the risk of production capacity loss, target material waste and inefficient wafer production caused by cavity opening.

[0029] Specifically, the silicon wafer cleaning device provided in this embodiment is installed on a carrier plate inside the coating chamber and positioned between the carrier plate and the target material. The telescopic mechanism 300 is arranged horizontally, thereby driving the reciprocating mechanism 200 mounted on the telescopic mechanism 300 to move horizontally, adjusting the position of the scraper 100 relative to the target material. The reciprocating mechanism 200 has a horizontally positioned swing arm 230, specifically a square rod. One end of the swing arm 230 is connected to the scraper 100, which can be fixed to the swing arm 230 by a connector or bolts. The other end of the swing arm 230 is connected to a transmission assembly 220, which is driven by a first driving member 210. The first driving member 210 is specifically equipped with a motor, connected to the swing arm 230 via the transmission assembly 220, thereby driving the swing arm 230 to swing horizontally, so that the scraper 100 on the swing arm 230 can sweep away fallen silicon wafers.

[0030] Furthermore, the transmission assembly 220 includes a mounting frame 221, a rocker arm 222, a connecting rod 223, a first transmission gear 224, and a residual gear 225; the first driving member 210 is fixed to the mounting frame 221, one end of the connecting rod 223 is connected to the driving end of the first driving member 210, the other end of the connecting rod 223 is movably connected to one end of the rocker arm 222, the other end of the rocker arm 222 is connected to the residual gear 225, the residual gear 225 is rotatably mounted on the mounting frame 221, the residual gear 225 is meshed with the first transmission gear 224, and the first transmission gear 224 is connected to one end of the swing arm 230.

[0031] Specifically, the mounting bracket 221 is configured as a "U"-shaped frame, with a mounting ear on one side wall and a mounting hole inside the mounting ear. One end of the connecting shaft passes through the mounting hole, and the other end is connected to the swing arm 230, allowing the swing arm 230 to rotate around the connecting shaft and be mounted on the mounting bracket 221. The first driving member 210 is fixed to the outer wall of the mounting bracket 221 by bolts, and the first driving member 210 is coaxially arranged with the connecting shaft. The first driving member 210 is specifically configured as a drive motor, with its motor shaft extending into the mounting bracket 221. One end of the connecting rod 223 is sleeved on the motor shaft, thereby rotating around the motor shaft under the drive of the first driving member 210. A first transmission gear 224 is fitted onto one end of the connecting shaft that passes through the mounting hole. One end of the residual gear 225 and the swing arm 222 are hinged to the side wall of the mounting bracket 221 opposite to the mounting ear. The residual gear 225 meshes with the first transmission gear 224. The swing arm 222 has a long slot along its extension direction, and the other end of the connecting rod 223 has a pin that can slide within the long slot. Therefore, when the first driving member 210 drives the connecting rod 223 to rotate, it will cause the pin to rotate around the motor shaft along with the connecting rod 223. This causes the connecting rod 223 and the residual gear 225 to swing on the mounting bracket 221, thereby driving the swing arm 230 to swing via the first transmission gear 224.

[0032] Furthermore, the telescopic mechanism 300 includes a mounting box 310, a second driving member 320, a transmission screw 330, a guide rod 340, and a telescopic member 350. The mounting box 310 has a receiving cavity, the guide rod 340 is fixedly installed in the receiving cavity, the transmission screw 330 is arranged parallel to the guide rod 340, the telescopic member 350 is slidably installed on the guide rod 340, and the telescopic member 350 is threadedly connected to the transmission screw 330. The second driving member 320 is connected to the transmission screw 330, driving the transmission screw 330 to rotate around its own axis, so that the telescopic member 350 can extend into or retract into the receiving cavity. The mounting bracket 221 is fixed to the telescopic end of the telescopic member 350.

[0033] Specifically, in this embodiment, the mounting box 310 is rectangular in shape and hollow, thus having a square receiving cavity. The guide rod 340 is a round rod, arranged along the length of the mounting box 310, with its two ends fixed to the inner wall of the mounting box 310. The transmission screw 330 is arranged parallel to the guide rod 340. The telescopic member 350 is specifically T-shaped, having a horizontal plate and a vertical rod. A round hole is provided on its horizontal plate, allowing it to slide on the guide rod 340. A threaded hole is also provided on the horizontal plate, allowing the transmission screw 330 to be threaded onto the telescopic member 350. The second driving member 320 is specifically a motor, fixed to the mounting box 310 by bolts. A second transmission gear is provided on its motor shaft, and a bevel gear is provided at one end of the transmission screw 330. The second transmission gear can mesh with the bevel gear, thereby driving the transmission screw 330, and in turn driving the telescopic member 350 to slide along the guide rod 340. An opening is provided on the side wall of the mounting box 310, allowing the longitudinal rod of the telescopic member 350 to extend through the opening. The mounting bracket 221 is fixed to the longitudinal rod by bolts, thus realizing the telescopic member 350 sliding and extending.

[0034] Furthermore, the silicon wafer cleaning device also includes a fixing bracket and a connecting bolt 430; the fixing bracket has a fixing plate 410 and a clamping plate 420 that can move closer or further apart from each other, the fixing plate 410 and the clamping plate 420 are arranged parallel to each other, and the connecting bolt 430 passes through the fixing plate 410 and is bolted to the clamping plate 420 so that the fixing bracket can clamp the carrier plate in the coating chamber, and the mounting box 310 is connected to the clamping plate 420.

[0035] Specifically, both the fixing plate 410 and the clamping plate 420 are rectangular flat plates, with round holes at both ends of each. Two connecting bolts 430 can pass through the round holes in both the fixing plate 410 and the clamping plate 420. This allows the fixing plate 410 and the clamping plate 420 to move closer or further apart along the connecting bolts 430. When the silicon wafer cleaning device needs to be fixed to the carrier plate, the fixing plate 410 and the clamping plate 420 can be clamped on both sides of the carrier plate, and nuts can be tightened on the connecting bolts 430 to clamp the carrier plate, thus fixing the bracket relative to the carrier plate. The mounting box 310 is mounted on the clamping plate 420 using bolts or connectors.

[0036] Furthermore, the silicon wafer cleaning device also includes two gaskets 440; one gasket 440 is disposed on the side of the fixing plate 410 near the clamping plate 420 and connected to the fixing plate 410, and the other gasket 440 is disposed on the side of the clamping plate 420 near the fixing plate 410 and connected to the clamping plate 420, and the gaskets 440 are made of elastic material.

[0037] Specifically, in this embodiment, the gasket 440 is a rubber sheet. One gasket 440 is fixed to the side of the fixing plate 410 near the clamping plate 420 by adhesive bonding, and the other gasket 440 is fixed to the side of the clamping plate 420 near the fixing plate 410 by adhesive bonding. By providing gaskets 440 on the side of the fixing plate 410 and the clamping plate 420 near the carrier plate, damage to the carrier plate by the fixing bracket can be avoided during fixing.

[0038] Furthermore, the silicon wafer cleaning device also includes an adjustment component 510 and a third drive component 520; one end of the adjustment component 510 is fixed to the clamping plate 420, and the other end of the adjustment component 510 is hinged to the mounting box 310; the third drive component 520 is fixed to the adjustment component 510 and is hinged to the mounting box 310 to drive the mounting box 310 to rotate.

[0039] Specifically, in this embodiment, the mounting box 310 has two connecting ears on the side away from the opening, and a rotating shaft is provided between the connecting ears. The rotating shaft is keyed to the connecting ears, and the adjusting member 510 is sleeved on the rotating shaft and thus hinged to the mounting box 310. The third drive 520 is specifically provided with a drive motor, the motor shaft of which can be connected to the rotation via a coupling. The third drive 520 is fixed to the adjusting member 510 by bolts. The adjusting member 510 is fixed to the clamping plate 420 by bolts. Thus, the rotating shaft can be driven to rotate by the third drive 520, thereby causing the connecting ears to rotate relative to the adjusting member 510, thereby adjusting the position of the reciprocating assembly and the scraper 100 relative to the carrier plate and preventing interference between the scraper 100 and the carrier plate and the target material.

[0040] Furthermore, the silicon wafer cleaning mechanism also includes an auxiliary mounting component 610 and a locking mechanism; the auxiliary mounting component 610 is fixed horizontally to the swing end of the swing arm 230, the bottom of the auxiliary mounting component 610 is provided with a sliding groove, and the scraper 100 is provided with a slider so that the scraper 100 can be slidably connected to the auxiliary mounting component 610, and the locking mechanism is provided on the auxiliary mounting component 610, and the locking mechanism can be engaged with the scraper 100.

[0041] Specifically, the auxiliary mounting component 610 is elongated, with one side bolted to the swing end of the swing arm 230, and the other side having a U-shaped groove for mounting the rectangular scraper 100. A sliding groove is provided within the U-shaped groove, and a corresponding sliding block is provided on the scraper 100, allowing the scraper 100 to slide within the auxiliary mounting component 610. A locking mechanism can secure the scraper 100 to the auxiliary mounting bracket 221 using pins, latches 622, or similar methods. This allows for the replacement of scrapers 100 of different models and shapes according to different usage scenarios.

[0042] Furthermore, the locking mechanism includes a spring 621, a locking block 622, and a slide rod 623; the auxiliary mounting part 610 is provided with a locking cylinder on one side along the horizontal direction, the slide rod 623 extends into the locking cylinder, the spring 621 and the locking block 622 are both sleeved on the slide rod 623, and the spring 621 and the locking block 622 are both provided inside the locking cylinder, one end of the spring 621 is connected to the locking block 622, and the other end of the spring 621 abuts against the locking cylinder; the scraper 100 is provided with a slot, and the locking block 622 can extend into the slot and engage with the slot.

[0043] Specifically, in this embodiment, the locking mechanism includes a spring 621, a locking block 622, and a slide rod 623. A locking cylinder is provided on one side of the auxiliary mounting member 610 along the horizontal direction. The locking cylinder is cylindrical, and two locking cylinders are respectively provided on both sides of the auxiliary mounting member 610 and communicate with the U-shaped groove. The slide rod 623 extends into the locking cylinder. The spring 621 and the locking block 622 are both sleeved on the slide rod 623. One end of the slide rod 623 is provided with a plug that can extend out of the locking cylinder and abut against it. The locking block 622 is configured as a bushing and fixed to the other end of the slide rod 623. Circular grooves, i.e., slots, are provided on both sides of the scraper 100. The spring 621 can push the locking block 622 into the slot, realizing the engagement of the locking block 622 with the slot, thus completing the fixation of the scraper 100 and the auxiliary mounting member 610. When the scraper 100 needs to be replaced, simply pull up the slide rod 623 to compress the spring 621, causing the locking block 622 to disengage from the slot, allowing the scraper 100 to slide off the auxiliary mounting part 610, and then install the new scraper 100.

[0044] Secondly, this utility model also provides a coating device that includes all the technical features of the aforementioned silicon wafer cleaning device, and can naturally achieve all the technical effects of the aforementioned silicon wafer cleaning device, which will not be repeated in this embodiment.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A silicon wafer cleaning device, characterized in that, include: Scraper (100); A reciprocating mechanism (200) includes a first driving member (210), a transmission assembly (220), and a swing arm (230). The first driving member (210) is connected to the transmission assembly (220), and the transmission assembly (220) is connected to one end of the swing arm (230). The scraper (100) is fixed to the other end of the swing arm (230). The first driving member (210) can drive the swing arm (230) to reciprocate around the end connected to the transmission assembly (220). A telescopic mechanism (300) is connected to the reciprocating mechanism (200) to drive the reciprocating mechanism (200) to move in the vertical direction.

2. The silicon wafer cleaning device according to claim 1, characterized in that, The transmission assembly (220) includes a mounting bracket (221), a rocker arm (222), a connecting rod (223), a first transmission gear (224), and a residual gear (225); The first driving member (210) is fixed to the mounting bracket (221). One end of the connecting rod (223) is connected to the driving end of the first driving member (210). The other end of the connecting rod (223) is movably connected to one end of the swing rod (222). The other end of the swing rod (222) is connected to the residual gear (225). The residual gear (225) is rotatably mounted on the mounting bracket (221). The residual gear (225) meshes with the first transmission gear (224). The first transmission gear (224) is connected to one end of the swing arm (230).

3. The silicon wafer cleaning apparatus according to claim 2, characterized in that, The telescopic mechanism (300) includes a mounting box (310), a second driving member (320), a transmission screw (330), a guide rod (340), and a telescopic member (350); The mounting box (310) has a cavity for receiving, the guide rod (340) is fixedly installed in the cavity for receiving, the transmission screw (330) is arranged parallel to the guide rod (340), the telescopic member (350) is slidably installed on the guide rod (340), and the telescopic member (350) is threadedly connected to the transmission screw (330). The second driving member (320) is connected to the transmission screw (330) for transmission, driving the transmission screw (330) to rotate around its own axis, so that the telescopic member (350) can extend into or retract into the cavity for receiving, and the mounting bracket (221) is fixed to the telescopic end of the telescopic member (350).

4. The silicon wafer cleaning apparatus according to claim 3, characterized in that, The silicon wafer cleaning device also includes a fixing bracket and connecting bolts (430); The fixed bracket has a fixed plate (410) and a clamping plate (420) that can move closer to or further away from each other. The fixed plate (410) and the clamping plate (420) are arranged parallel to each other. The connecting bolt (430) passes through the fixed plate (410) and is bolted to the clamping plate (420) so that the fixed bracket can clamp the carrier plate in the coating chamber. The mounting box (310) is connected to the clamping plate (420).

5. The silicon wafer cleaning apparatus according to claim 4, characterized in that, The silicon wafer cleaning device also includes two gaskets (440); One of the gaskets (440) is disposed on the side of the fixing plate (410) near the clamping plate (420) and connected to the fixing plate (410), and the other gasket (440) is disposed on the side of the clamping plate (420) near the fixing plate (410) and connected to the clamping plate (420), and the gasket (440) is made of an elastic material.

6. The silicon wafer cleaning apparatus according to claim 4, characterized in that, The silicon wafer cleaning device also includes an adjustment component (510) and a third drive component (520); One end of the adjusting member (510) is fixed to the clamping plate (420), and the other end of the adjusting member (510) is hinged to the mounting box (310). The third driving member (520) is fixed to the adjusting member (510) and is hinged to the mounting box (310) to drive the mounting box (310) to rotate.

7. The silicon wafer cleaning apparatus according to any one of claims 2-6, characterized in that, The silicon wafer cleaning device also includes an auxiliary mounting component (610) and a locking mechanism; The auxiliary mounting component (610) is fixed horizontally to the swing end of the swing arm (230). The bottom of the auxiliary mounting component (610) is provided with a sliding groove. The scraper (100) is provided with a slider so that the scraper (100) can be slidably connected to the auxiliary mounting component (610). The locking mechanism is provided on the auxiliary mounting component (610) and can be engaged with the scraper (100).

8. The silicon wafer cleaning apparatus according to claim 7, characterized in that, The locking mechanism includes a spring (621), a locking block (622), and a sliding rod (623); The auxiliary mounting component (610) has a locking cylinder on one side along the horizontal direction. The slide rod (623) extends into the locking cylinder (611). The spring (621) and the locking block (622) are both sleeved on the slide rod (623), and the spring (621) and the locking block (622) are both located inside the locking cylinder (611). One end of the spring (621) is connected to the locking block (622), and the other end of the spring (621) abuts against the locking cylinder (611). The scraper (100) is provided with a slot, and the locking block (622) can extend into the slot and engage with it.

9. A coating apparatus, characterized in that, Includes the silicon wafer cleaning apparatus according to any one of claims 1-8.

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