A semi-enclosed cooling device for high-speed forging

Abstract

The utility model relates to movable punch cooling technical field, concretely is a kind of semi-clad cooling device for high-speed forging, including base, connecting pipe, bottom plate structure and U-shaped structure, installation hole and cooling water hole are equipped on the base, and cooling water road is connected with host computer and host computer by bolt, the base is used for the positioning installation of connecting pipe, the base is connected with the bottom plate structure by the connecting pipe, the bottom plate structure includes bottom plate and cover plate, hollow cooling water road is formed between the bottom plate and the cover plate, the U-shaped structure is set in the cover plate upper portion, and the U-shaped structure is adapted to movable punch.The utility model increases U-shaped inner plate on structure, center end mould can be effectively cooled when being designed by U-shaped inner plate, to prolong mould life, reduce cost, solve the problem that current cooling device does not form effective, sufficient cooling to part mould component of high-speed precision forging machine, lead to the problem of poor mould life.

Description

Technical Field

[0001] This utility model relates to the field of moving punch cooling technology, specifically a semi-enclosed cooling device for high-speed forging. Background Technology

[0002] Currently, the commonly used high-speed forging cooling device is a single flat plate structure. The plate facing the punch has a certain number of water holes. During operation, cooling water is sprayed from the holes to the outside to cool the moving punch in a waterfall-like manner. However, the cooling effect is not ideal for moving punches with complex shapes and long strokes. In particular, the lower and rear parts of the moving punch cannot be cooled well, causing the moving punch to burn out prematurely and seriously affecting forging efficiency.

[0003] To address the aforementioned problems, a semi-enclosed cooling device for high-speed forging is proposed. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a semi-enclosed cooling device for high-speed forging, which can improve the cooling effect of complex-shaped and long-stroke moving punches, greatly extend the service life of the moving punches, and thus improve the production efficiency of high-speed forging.

[0005] To achieve the above objectives, this utility model provides the following technical solution: including a base, a connecting pipe, a base plate structure, and a U-shaped structure; The base is provided with mounting holes and cooling water holes, and is connected to the main unit and the main unit cooling water circuit by bolts. The base is used for positioning and installing the connecting pipe. The base is connected to the base plate structure via the connecting pipe; The base plate structure includes a base plate and a cover plate, and a hollow cooling water channel is formed between the base plate and the cover plate; The U-shaped structure is disposed on the upper part of the cover plate, and the U-shaped structure is adapted to the movable punch.

[0006] Preferably, the base, the bottom plate structure, and the connection of the connecting pipe are sealed to provide bottom support and connect the cooling water circuit.

[0007] Preferably, the base plate and the cover plate form a hollow sealed structure, and the hollow area is used for cooling water channels.

[0008] Preferably, the U-shaped structure includes an inner U-shaped inner plate, an inner U-shaped cover plate, an outer U-shaped inner plate, an outer U-shaped cover plate, and an outermost U-shaped cover plate.

[0009] Preferably, a plurality of water holes are provided between the inner U-shaped inner plate and the outer U-shaped inner plate, and the diameter of the water holes is between 1.5mm and 2.5mm. A plurality of water holes are provided on both the inner U-shaped cover plate and the outer U-shaped inner plate, and the diameter of the water holes is between 1.5mm and 2.5mm.

[0010] Preferably, the upper part of the cover plate combined with the U-shaped structure is provided with a number of water holes, and the diameter of the water holes is between 1.5mm and 2.5mm.

[0011] Preferably, the water holes on the outermost U-shaped inner plate and the water holes on the outermost U-shaped cover plate are combined to form a semi-enclosed cooling structure for cooling the moving punch.

[0012] Compared with the prior art, this utility model provides a semi-enclosed cooling device for high-speed forging, which has the following beneficial effects: 1. By adding a U-shaped inner plate to the structure, the mold at the center end can be effectively cooled, thereby extending the mold life and reducing costs.

[0013] 2. To solve the problem that the current cooling device does not effectively and sufficiently cool some mold components of the high-speed precision forging machine, resulting in poor mold life.

[0014] 3. The cooling device is redesigned based on the difference in diameter of the mold components and the stroke relationship. It is matched to the mold size in the diameter direction and redesigned in terms of thickness according to the stroke relationship. Attached Figure Description

[0015] Figure 1 This is a frontal cross-sectional view of the present invention. Figure 2 This is a side view sectional structural diagram of the present invention; Figure 3 This is a schematic diagram of the U-shaped structure of this utility model; Figure 4 This is a schematic diagram of the inner water hole structure of this utility model.

[0016] In the diagram: 1. Base plate; 2. Cover plate; 3. Inner U-shaped inner plate; 4. Outer U-shaped cover plate; 7. Inner U-shaped cover plate; 8. Outer U-shaped inner plate; 9. Outermost U-shaped cover plate; 10. Connecting pipe; 11. Base. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0018] Please see Figure 1 - Figure 4 A semi-enclosed cooling device for high-speed forging in this embodiment includes a base 11, a connecting pipe 10, a base plate structure, and a U-shaped structure. The base 11 is provided with mounting holes and cooling water holes, and is connected to the main unit and the main unit cooling water circuit by bolts. The base 11 is used for positioning and installing the connecting pipe 10. The base 11 is connected to the base plate structure via the connecting pipe 10; The base plate structure includes a base plate 1 and a cover plate 2, with a hollow cooling water channel formed between the base plate 1 and the cover plate 2; A U-shaped structure is provided on the upper part of the cover plate 2, and the U-shaped structure is adapted to the movable punch; The base 11, the base plate structure and the connection of the connecting pipe 10 are sealed to provide bottom support and connect the cooling water circuit; The base plate 1 and the cover plate 2 form a hollow sealed structure, and the hollow area is used for cooling water channels; The U-shaped structure includes an inner U-shaped inner plate 3, an inner U-shaped cover plate 7, an outer U-shaped inner plate 8, an outer U-shaped cover plate 4, and an outermost U-shaped cover plate 9. Several water holes are provided between the inner U-shaped inner plate 3 and the outer U-shaped inner plate 8, and the diameter of the water holes is 1.5mm-2.5mm. Several water holes are also provided on the inner U-shaped cover plate 7 and the outer U-shaped inner plate 8, and the diameter of the water holes is 1.5mm-2.5mm. The upper part of the cover plate 2, which is combined with the U-shaped structure, is provided with several water holes, and the diameter of the water holes is between 1.5mm and 2.5mm. The water holes on the outer U-shaped inner plate 8 and the water holes on the outermost U-shaped cover plate 9 combine to form a semi-enclosed cooling structure for cooling the moving punch. The base 11, connecting pipe 10 and base plate structure are connected by welding, which serves to support the base plate and connect the cooling water circuit. The base plate 1 and the cover plate 2 are connected by welding to form a hollow and closed structure, with the hollow part serving as a cooling water channel. Among them, the water holes of the outer U-shaped inner plate 8 and the outermost U-shaped cover plate 9 form a semi-enclosed cooling structure to cool the moving punch. The size and number of water holes can be adjusted according to the cooling effect of the moving punch. In this embodiment, the working process forms a waterfall-style + semi-enclosed cooling system for the moving punch, providing all-round cooling to the working part of the moving punch, greatly improving the cooling effect, significantly extending the service life of the moving punch, and thus greatly improving the production efficiency of high-speed forging.

[0019] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods. As long as they can achieve their beneficial effects, they can be implemented. Therefore, this embodiment will not elaborate on their specific structural composition and working principle.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semi-coat type cooling device for high speed forging, characterized by: Includes a base (11), a connecting pipe (10), a base plate structure, and a U-shaped structure; The base (11) is provided with mounting holes and cooling water holes, and is connected to the host and the host cooling water circuit by bolts. The base (11) is used for positioning and installing the connecting pipe (10). The base (11) is connected to the base plate structure through the connecting pipe (10); The base plate structure includes a base plate (1) and a cover plate (2), and a hollow cooling water channel is formed between the base plate (1) and the cover plate (2); The U-shaped structure is disposed on the upper part of the cover plate (2), and the U-shaped structure is adapted to the movable punch.

2. The semi-enclosed cooling device for high-speed forging according to claim 1, characterized in that: The base (11), the bottom plate structure and the connecting pipe (10) are sealed at the connection point for bottom support and connection of cooling water circuit.

3. The semi-enclosed cooling device for high-speed forging according to claim 1, characterized in that: The base plate (1) and the cover plate (2) form a hollow sealed structure, and the hollow area is used for cooling water channels.

4. The semi-enclosed cooling device for high-speed forging according to claim 1, characterized in that: The U-shaped structure includes an inner U-shaped inner plate (3), an inner U-shaped cover plate (7), an outer U-shaped inner plate (8), an outer U-shaped cover plate (4), and an outermost U-shaped cover plate (9).

5. A semi-enclosed cooling device for high-speed forging according to claim 4, characterized in that: A number of water holes are provided between the inner U-shaped inner plate (3) and the outer U-shaped inner plate (8), and the diameter of the water holes is 1.5mm-2.5mm. A number of water holes are provided on both the inner U-shaped cover plate (7) and the outer U-shaped inner plate (8), and the diameter of the water holes is 1.5mm-2.5mm.

6. The semi-enclosed cooling device for high-speed forging according to claim 1, characterized in that: The upper part of the cover plate (2) combined with the U-shaped structure is provided with several water holes, and the diameter of the water holes is between 1.5mm and 2.5mm.

7. A semi-enclosed cooling device for high-speed forging according to claim 4, characterized in that: The water holes on the outer U-shaped inner plate (8) and the water holes on the outermost U-shaped cover plate (9) combine to form a semi-enclosed cooling structure for cooling the moving punch.

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