A device for protecting against laser ablation in semiconductor processing

Abstract

The utility model relates to a kind of fusing protection devices in semiconductor process, belong to semiconductor fusing protection field, including first fixture (1), second fixture (2) and fusing component (3), the first fixture (1) includes fixed plate (4) and baffle (5), the second fixture (2) includes limit block (6) and support block (7), the support block (7) is located limit block (6) side, the fusing component (3) includes bottom plate (8) and connecting plate (9), connecting plate (9) side is equipped with support seat (10), connecting plate (9) and baffle (5) are attached, the support block (7) is located in support seat (10).By being provided with first fixture (1) and second fixture (2) on fusing component (3), the part needing protection is shielded, simple operation and can avoid residual glue and offset problem, can mass production, while saving manpower and material resources of the convenience protection.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor sputtering protection. Specifically, this utility model relates to a sputtering protection device in semiconductor manufacturing process. Background Technology

[0002] Under vacuum conditions, low-voltage, high-current arc discharge technology is used to evaporate the target material and ionize both the evaporated material and the gas. The electric field accelerates the vaporized material and its reaction products, causing them to deposit on the workpiece. To improve the performance of the deposited material, sandblasting or spraying processes are used for surface roughening. However, before roughening, smooth surfaces, sealing surfaces, and areas not requiring spraying treatment need to be shielded to prevent sand and sprayed material from splashing onto the smooth surfaces. The conventional protection method for sprayed components is shielding with sprayed tape. Due to the irregular appearance of the product, the tape needs to be cut during application, and tape marks are left after spraying, requiring further sandblasting to remove them, which consumes significant manpower and resources.

[0003] A search revealed that Chinese patent CN111823377A, published on October 27, 2020, discloses a device for removing protective coating after semiconductor ceramic welding and its usage method. The device includes a placement plate, with a motor screwed to the lower end of the plate. The motor's output end passes through the placement plate and is connected to a drive shaft. The upper end of the drive shaft is connected to a working box. The working box has two sliding cavities inside, and a first sliding groove is formed on one side of the working box, located on one side of each sliding cavity. A sliding plate is slidably connected inside each sliding cavity, with one end of the sliding plate fitting into the first sliding groove. A limit ring is rotatably connected inside the sliding plate. However, this method cannot effectively prevent tape marks from forming after welding. Utility Model Content

[0004] The present invention aims to provide a melt spray protection device in semiconductor manufacturing processes to avoid residual adhesive and offset printing.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: A sputtering protection device for semiconductor manufacturing includes a first fixture, a second fixture, and a sputtering component. The first fixture is disposed on the outside of the sputtering component, and the second fixture is disposed on the inside of the sputtering component.

[0006] The first fixture includes a fixing plate and a baffle, the fixing plate and the baffle are connected, and the baffle is attached to the outer side of the lamination component.

[0007] The second fixture includes a limiting block and a support block. The support block is located on one side of the limiting block and is in contact with the inner side of the spraying component.

[0008] The spraying component includes a base plate and a connecting plate, which are connected and the connecting plate is fitted with a baffle; a support seat is provided on one side of the connecting plate, and the support block is located inside the support seat.

[0009] The baffle plate is provided with a through groove that mates with the support seat.

[0010] The base plate is provided with a first fixing plate and a second fixing plate at both ends. The first fixing plate and one side of the baffle are connected by bolts, and the second fixing plate and the other side of the baffle are connected by bolts.

[0011] The baffle is provided with two sets of through slots.

[0012] The two sets of through slots are symmetrically distributed.

[0013] The fixing plate and baffle are annular, and the base plate and connecting plate are arc-shaped.

[0014] The support block and support base are arc-shaped, and the first fixing plate and the second fixing plate are both L-shaped plates.

[0015] The technical advantages of this utility model are as follows: by setting a first fixture and a second fixture on the molten metal part, the part that needs to be protected can be shielded. The operation is simple and can avoid the problems of residual glue and glue marks. It can be mass-produced, which is convenient for protection and saves manpower and material resources. By setting a ring-shaped first fixture, each set of first fixtures can assemble two sets of molten metal parts, which improves the working efficiency. A first fixing plate and a second fixing plate are also set on both sides of the base plate to fix the molten metal parts. Attached Figure Description

[0016] This manual includes the following figures, which illustrate the following:

[0017] Figure 1 This is a schematic diagram of a melt spray protection device used in semiconductor manufacturing.

[0018] Figure 2 for Figure 1 A schematic diagram of the structure of the middle spraying component.

[0019] Figure 3 for Figure 2 The front view.

[0020] Figure 4 for Figure 1 A schematic diagram of the structure of the first fixture.

[0021] Figure 5 for Figure 1 A schematic diagram of the structure of the second fixture.

[0022] The components in the diagram are labeled as follows: 1. First fixture; 2. Second fixture; 3. Spraying component; 4. Fixing plate; 5. Baffle; 6. Limiting block; 7. Support block; 8. Base plate; 9. Connecting plate; 10. Support seat; 11. Through groove; 12. First fixing plate; 13. Second fixing plate. Detailed Implementation

[0023] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings, in order to help those skilled in the art to have a more complete, accurate and in-depth understanding of the inventive concept and technical solution of this utility model, and to facilitate its implementation.

[0024] like Figure 1 As shown, a sputtering protection device for semiconductor manufacturing includes a first fixture 1, a second fixture 2, and a sputtering component 3. The first fixture 1 is located on the outside of the sputtering component 3, and the second fixture 2 is located on the inside of the sputtering component 3. In this embodiment, the sputtering component 3 is a Load Slot Shield component of an SPTS NiV device in semiconductor manufacturing. By setting the first and second fixtures on the sputtering component, the parts that need to be protected are shielded. The operation is simple and can avoid problems such as residual adhesive and adhesive marks. It can be mass-produced, facilitating protection while saving manpower and resources.

[0025] like Figure 4 As shown, the first fixture 1 includes a fixing plate 4 and a baffle 5, which are connected. The baffle 5 is attached to the outer side of the spraying component 3. The first fixture 1 is an annular fixing plate 4 with a baffle 5. The baffle 5 is used to shield the spraying component 3. The fixing plate 4 and the baffle 5 are made of stainless steel, which can be repeatedly cleaned and reused, extending the service life of the fixture and reducing the cost of protecting and shielding the product components.

[0026] like Figure 5 As shown, the second fixture 2 includes a limiting block 6 and a support block 7. The support block 7 is located on one side of the limiting block 6 and fits against the inner side of the spraying component 3. The second fixture 2 includes a hollow limiting block 6 with the support block 7 on it. The size of the limiting block 6 is larger than that of the support block 7. When the limiting block 6 and the support block 7 are inserted into the spraying component 3, the limiting block 6 can prevent the second fixture 2 from completely entering the spraying component 3, thus facilitating removal after spraying protection is completed. The support block 7 is made of hollow stainless steel, which saves material and allows for repeated cleaning and reuse, extending the service life of the fixture and reducing the cost of protecting and shielding product components.

[0027] like Figure 2 and Figure 3As shown, the spraying component 3 includes a base plate 8 and a connecting plate 9. The base plate 8 and the connecting plate 9 are connected, and the connecting plate 9 and the baffle 5 are fitted together. A support seat 10 is provided on one side of the connecting plate 9, and a support block 7 is located inside the support seat 10. The spraying component 3 includes an arc-shaped base plate 8, on which the connecting plate 9 is provided. During installation, the connecting plate 9 and the baffle 5 are in contact, and the baffle 5 serves to shield the connecting plate 9. A support seat 10 is provided in the middle of the connecting plate 9. The support 10 has an arc-shaped mesh structure. The support seat 10 is a load slot shield component of the SPTS NiV device used to protect the load slot. During spraying protection, the support block 7 is located inside the support seat 10 to provide protection and shielding.

[0028] The baffle 5 is provided with a through groove 11 that mates with the support base 10. The baffle 5 of the first fixture 1 is provided with a through groove 11. During installation, the through groove 11 is used for the support base 10 of the spraying component 3 to mate with the through groove 11. At this time, the baffle 5 and the connecting plate 9 fit tightly together, and the shielding and protection effect is better.

[0029] A first fixing plate 12 and a second fixing plate 13 are respectively provided at both ends of the base plate 8. The first fixing plate 12 and one side of the baffle 5 are connected by bolts, and the second fixing plate 13 and the other side of the baffle 5 are connected by bolts. The first fixing plate 12 is provided at one end of the base plate 8, and the first fixing plate 12 and one side of the baffle 5 are connected by bolts. The second fixing plate 13 is provided at the other end of the base plate 8, and the second fixing plate 13 and the other side of the baffle 5 are connected by bolts. This serves to fix the spraying component 3 during the spraying process and prevent the spraying component 3 from shaking during the spraying process.

[0030] The baffle 5 is provided with two sets of through slots 11. The size of the through slots 11 is slightly larger than that of the support base 10. Each set of first fixtures 1 is provided with two sets of spraying components 3, which can save costs and improve efficiency.

[0031] Two sets of through slots 11 are symmetrically distributed on the baffle 5.

[0032] The fixing plate 4 and the baffle 5 are annular, while the base plate 8 and the connecting plate 9 are arc-shaped. The annular fixing plate 4 and the baffle 5 can shield and protect the two sets of arc-shaped base plates 8 and connecting plates 9.

[0033] The support block 7 and the support base 10 are arc-shaped, and the first fixing plate 12 and the second fixing plate 13 are both L-shaped plates. The L-shaped plates can support the base plate 8 and the baffle 5 at the same time.

[0034] The working principle of this utility model is as follows: The first fixture 1 includes a fixing plate 4 and a baffle 5, which are connected. The second fixture 2 includes a limiting block 6 and a supporting block 7, which are located on one side of the limiting block 6. The molten spraying component 3 includes a base plate 8 and a connecting plate 9, which are connected. A support seat 10 is provided on one side of the connecting plate 9. The support block 7 is located inside the support seat 10 to shield and protect the support seat 10. The connecting plate 9 and the baffle 5 are attached to shield and protect the connecting plate 9. The part that needs to be protected is shielded. The operation is simple and can avoid the problems of residual glue and glue marks. The structure is simple and can be mass-produced. It is convenient for protection and saves manpower and material resources. By setting the first fixture 1 in a ring shape, each set of the first fixture 1 can assemble two sets of molten spraying components 3, which increases the working efficiency. The base plate 8 is also provided with a first fixing plate 12 and a second fixing plate 13 on both sides to fix the molten spraying component 3.

[0035] The present invention has been described above by way of example with reference to the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvements made using the inventive concept and technical solution of the present invention; or the direct application of the inventive concept and technical solution to other situations without modification, are all within the protection scope of the present invention.

Claims

1. A melt spray protection device for semiconductor manufacturing processes, characterized in that: It includes a first fixture (1), a second fixture (2) and a spraying component (3), wherein the first fixture (1) is located on the outside of the spraying component (3) and the second fixture (2) is located on the inside of the spraying component (3).

2. The melt spray protection device in a semiconductor manufacturing process according to claim 1, characterized in that: The first fixture (1) includes a fixing plate (4) and a baffle (5), the fixing plate (4) and the baffle (5) are connected, and the baffle (5) is attached to the outside of the spraying component (3).

3. The melt spray protection device in a semiconductor manufacturing process according to claim 2, characterized in that: The second fixture (2) includes a limiting block (6) and a support block (7). The support block (7) is located on one side of the limiting block (6), and the support block (7) is attached to the inner side of the spraying component (3).

4. The melt spray protection device in a semiconductor manufacturing process according to claim 3, characterized in that: The spraying component (3) includes a base plate (8) and a connecting plate (9). The base plate (8) and the connecting plate (9) are connected, and the connecting plate (9) and the baffle (5) are attached together. A support seat (10) is provided on one side of the connecting plate (9), and the support block (7) is located in the support seat (10).

5. The melt spray protection device in a semiconductor manufacturing process according to claim 4, characterized in that: The baffle (5) is provided with a through groove (11) that cooperates with the support seat (10).

6. The melt spray protection device in a semiconductor manufacturing process according to claim 5, characterized in that: The bottom plate (8) is provided with a first fixing plate (12) and a second fixing plate (13) at both ends. The first fixing plate (12) and the baffle (5) are connected on one side by bolts, and the second fixing plate (13) and the baffle (5) are connected on the other side by bolts.

7. A melt spray protection device in a semiconductor manufacturing process according to any one of claims 5-6, characterized in that: The baffle (5) is provided with two sets of through slots (11).

8. A melt spray protection device in a semiconductor manufacturing process according to claim 7, characterized in that: The two sets of through slots (11) are symmetrically distributed.

9. A melt spray protection device in a semiconductor manufacturing process according to claim 6, characterized in that: The fixing plate (4) and the baffle (5) are annular, and the bottom plate (8) and the connecting plate (9) are arc-shaped.

10. A melt spray protection device in a semiconductor manufacturing process according to claim 9, characterized in that: The support block (7) and support base (10) are arc-shaped, and the first fixing plate (12) and the second fixing plate (13) are both L-shaped plates.

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