A hanging basket for producing nickel-gold deposition

Abstract

The utility model discloses a kind of hanging baskets for nickel plating production, comprising: main frame body, the side of main frame body is provided with the opening for the insertion of circuit board;Multiple partition lines, made of corrosion-resistant material, multiple partition lines are vertically installed in main frame body, on horizontal section, multiple partition lines are arranged in dot matrix and form multiple partition layer areas, so that circuit board is inserted into partition layer area one by one through opening.Corresponding to the fixed operation of traditional block-by-block positioning column, significantly simplify clamping process and improve work efficiency;The corrosion-resistant characteristics of partition line ensure that it remains stable in nickel plating liquid environment, the dot matrix layout on its horizontal section accurately separates adjacent circuit boards, avoiding the occurrence of stacked board defects, overall from clamping mode, isolation stability and liquid reaction condition three aspects jointly guarantee the quality and efficiency of nickel plating process, solve the core problems of traditional process clamping inefficiency, easy to scratch board surface and insufficient liquid contact.

Description

Technical Field

[0001] This utility model relates to the technical field of printed circuit board surface treatment equipment, and in particular to a hanging basket for immersion nickel gold production. Background Technology

[0002] In the field of printed circuit board manufacturing, immersion nickel-gold plating, also known as electroless nickel / immersion gold plating, is a surface treatment process widely used to improve the solderability, conductivity, and corrosion resistance of circuit boards. This process involves sequentially depositing nickel and gold layers on a copper-based surface to form a protective layer that combines mechanical strength with low contact resistance. It is particularly suitable for small-sized circuit boards, such as high-precision electronic component mounting scenarios with dimensions ≤300mm×300mm.

[0003] For the production of such small-sized boards, the traditional immersion nickel gold process usually uses a "beading" method for clamping and fixing – that is, plastic or metal positioning posts are inserted at the four corners of each circuit board, and 1-2 positioning posts are used to maintain a fixed distance between adjacent boards. While this method can achieve some degree of inter-board isolation, it has significant technical drawbacks: First, the clamping efficiency is low, requiring the insertion of beads at each of the four corners of each board individually, and manual adjustment of the bead positions to ensure proper board spacing, resulting in a long loading time for operators. Second, improper bead insertion force or friction between the board surface during operation can easily cause scratches or bumps, directly affecting product yield. Third, for thinner boards, such as those ≤1.0mm, the lack of effective support in the middle area after bead insertion makes them prone to overlapping due to gravity or chemical flow, resulting in partial overlap of multiple boards. This prevents the nickel / gold plating solution from fully contacting the overlapping areas, causing uneven nickel / gold layer deposition, localized plating omissions, or insufficient thickness, ultimately affecting the electrochemical performance and appearance consistency of the circuit board. Furthermore, the metal or plastic beads in traditional bead insertion structures may wear down and detach during long-term use, further increasing the risk of board surface contamination.

[0004] The aforementioned problems are particularly prominent in the efficient and high-quality production of small-size boards. As electronic products become increasingly miniaturized and highly integrated, the demand for small-size boards continues to grow. The traditional "bead-threading" clamping method is no longer sufficient to meet the comprehensive requirements of modern immersion nickel-gold production lines for efficiency, yield, and consistency. Therefore, there is an urgent need for a dedicated hanging basket structure that eliminates the need for bead-threading, effectively prevents board stacking defects, and offers convenient clamping, to meet the production needs of immersion nickel-gold circuit boards. Utility Model Content

[0005] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes a hanging basket for immersion nickel-gold production, which uses Teflon wire to separate circuit boards to avoid poor stacking, ensures full contact of the chemical solution and improves quality. Furthermore, the fixing strips eliminate the need for screws, prevent waste during gold application, and the spacing is adjustable. In addition, the board insertion method can significantly improve the board loading efficiency. The manufacturing process is simple and compatible with existing processes, effectively solving the problems of low efficiency, easily damaged boards, and low space utilization in traditional processes.

[0006] A hanging basket for nickel-gold production according to an embodiment of the present invention includes: The main frame has an opening on its side for inserting a circuit board. Multiple dividing lines, made of corrosion-resistant material, are vertically installed within the main frame. In the horizontal cross-section, the multiple dividing lines are arranged in a dot matrix to form multiple partition areas, allowing the circuit board to be inserted into the partition areas one by one through the openings.

[0007] According to an embodiment of this utility model, a hanging basket for immersion nickel-gold production has at least the following beneficial effects: Through the synergistic effect of the opening on the side of the main frame and the vertically installed corrosion-resistant dividing lines inside, efficient insertion-type clamping of small-sized circuit boards is achieved. In application, the circuit board is directly inserted through the opening into an independent partition area formed by the dot matrix arrangement of the dividing lines, replacing the traditional method of fixing by inserting positioning posts one by one, significantly simplifying the clamping process and improving work efficiency. Furthermore, the corrosion-resistant properties of the dividing lines ensure their stability in the immersion nickel-gold solution environment, and the dot matrix layout on its horizontal cross-section accurately separates adjacent circuit boards, avoiding the stacking defects caused by insufficient fixing in traditional processes. Currently, reasonable gaps are maintained between circuit boards to ensure sufficient flow of the reagent during the immersion nickel-gold production process and uniform contact with each board surface, thereby ensuring the consistency and integrity of nickel and gold layer deposition. Through physical isolation and space optimization design, the overall structure effectively solves the technical problem of small-sized thin boards easily overlapping in the middle area due to gravity or reagent flow without the need for complex auxiliary components. At the same time, it is compatible with the hanging and reagent treatment environment of existing immersion nickel-gold production lines. It jointly ensures the quality and efficiency of the immersion nickel-gold process from three aspects: clamping method, isolation stability, and reagent reaction conditions, solving the core problems of inefficient clamping, easy damage to the board surface, and insufficient reagent contact in traditional processes.

[0008] According to some embodiments of this utility model, a hanging basket for immersion nickel-gold production is provided, wherein the dividing line is a Teflon wire.

[0009] According to some embodiments of this utility model, a hanging basket for immersion nickel gold production is provided on both sides of the main frame, with a first crossbar and a second crossbar respectively. A layered retaining strip is also connected between the first crossbar and the second crossbar. The layered retaining strip passes through all the partition areas to separate the first and second areas arranged vertically.

[0010] According to some embodiments of this utility model, a hanging basket for immersion nickel-gold production is provided, wherein there are multiple first crossbars and multiple second crossbars arranged at intervals in the vertical direction.

[0011] According to some embodiments of the present invention, a hanging basket for immersion nickel gold production is provided, wherein there are multiple layered clips, and the multiple layered clips are arranged at intervals along the length direction of the first crossbar.

[0012] According to some embodiments of this utility model, a hanging basket for immersion nickel-gold production is provided, wherein the two ends of the layered locking strip are respectively engaged with the first crossbar and the second crossbar.

[0013] According to some embodiments of this utility model, a hanging basket for immersion nickel-gold production is provided, wherein one end of the layered card strip is bent inward to form a first locking groove, the other end of the layered card strip is bent outward to form a second locking groove, the first crossbar is engaged with the first locking groove, and the second crossbar is engaged with the second locking groove.

[0014] According to some embodiments of this utility model, a hanging basket for immersion nickel gold production is provided, wherein a hook is fixedly connected to the upper side of the main frame to lift the main frame.

[0015] According to some embodiments of this utility model, a hanging basket for immersion nickel gold production has two hooks, which are symmetrically arranged on the main frame.

[0016] According to some embodiments of this utility model, a hanging basket for immersion nickel-gold production is provided on the side of the main frame away from the opening. There are multiple side stops arranged at intervals in the vertical direction. The distance between adjacent side stops is less than the length of the circuit board, so as to prevent the circuit board from detaching from the main frame.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1This is a schematic diagram of the overall structure of a hanging basket for immersion nickel-gold production according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the connection structure of the layered clips, the first crossbar, and the second crossbar of a hanging basket for immersion nickel gold production according to an embodiment of this utility model.

[0019] Explanation of icon numbers: Main frame 100; opening 101; first crossbar 110; second crossbar 120; side stop bar 130; Separator line 200; Layered area 201; Layered card strip 300; First card slot 301; Second card slot 302; Hook 400. Detailed Implementation

[0020] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0021] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is used in the description, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0024] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] In the field of printed circuit board manufacturing, immersion nickel-gold plating, also known as electroless nickel / immersion gold plating, is a surface treatment process widely used to improve the solderability, conductivity, and corrosion resistance of circuit boards. This process involves sequentially depositing nickel and gold layers on a copper-based surface to form a protective layer that combines mechanical strength with low contact resistance. It is particularly suitable for small-sized circuit boards, such as high-precision electronic component mounting scenarios with dimensions ≤300mm×300mm.

[0026] For the production of such small-sized boards, the traditional immersion nickel gold process usually uses a "beading" method for clamping and fixing – that is, plastic or metal positioning posts are inserted at the four corners of each circuit board, and 1-2 positioning posts are used to maintain a fixed distance between adjacent boards. While this method can achieve some degree of inter-board isolation, it has significant technical drawbacks: First, the clamping efficiency is low, requiring the insertion of beads at each of the four corners of each board individually, and manual adjustment of the bead positions to ensure proper board spacing, resulting in a long loading time for operators. Second, improper bead insertion force or friction between the board surface during operation can easily cause scratches or bumps, directly affecting product yield. Third, for thinner boards, such as those ≤1.0mm, the lack of effective support in the middle area after bead insertion makes them prone to overlapping due to gravity or chemical flow, resulting in partial overlap of multiple boards. This prevents the nickel / gold plating solution from fully contacting the overlapping areas, causing uneven nickel / gold layer deposition, localized plating omissions, or insufficient thickness, ultimately affecting the electrochemical performance and appearance consistency of the circuit board. Furthermore, the metal or plastic beads in traditional bead insertion structures may wear down and detach during long-term use, further increasing the risk of board surface contamination.

[0027] The aforementioned problems are particularly prominent in the efficient and high-quality production of small-size boards. As electronic products become increasingly miniaturized and highly integrated, the demand for small-size boards continues to grow. The traditional "bead-threading" clamping method is no longer sufficient to meet the comprehensive requirements of modern immersion nickel-gold production lines for efficiency, yield, and consistency. Therefore, there is an urgent need for a dedicated hanging basket structure that eliminates the need for bead-threading, effectively prevents board stacking defects, and offers convenient clamping, to meet the production needs of immersion nickel-gold circuit boards.

[0028] Therefore, such as Figure 1As shown, this utility model discloses a hanging basket for nickel-gold plating production, comprising a main frame 100 and multiple partition lines 200 installed within the main frame 100. The partition lines 200 are all made of corrosion-resistant material and are vertically installed within the main frame 100. Specifically, the main frame 100 has openings 101 on its side for inserting circuit boards. In the horizontal cross-section, the partition lines 200 are arranged in a matrix to form multiple partitioned areas 201, allowing circuit boards to be inserted one-to-one into the partitioned areas 201 through the openings 101. It should be noted that the synergistic effect of the openings 101 on the side of the main frame 100 and the vertically installed corrosion-resistant partition lines 200 enables efficient insertion-type clamping of small-sized circuit boards. In application, the circuit board is directly inserted through the openings 101 into the independent partitioned areas 201 formed by the matrix arrangement of the partition lines 200, replacing the traditional method of inserting each board one by one through positioning posts, significantly simplifying the clamping process and improving operational efficiency. Furthermore, the corrosion-resistant properties of the separator line 200 ensure its stability in the immersion nickel-gold solution environment. The dot matrix layout on its horizontal cross-section precisely separates adjacent circuit boards, avoiding the stacking defects caused by insufficient fixing in traditional processes. It also maintains a reasonable gap between circuit boards, ensuring sufficient flow of the solution and uniform contact with each board surface during the immersion nickel-gold production process, thereby ensuring the consistency and integrity of nickel and gold layer deposition. Through physical isolation and space optimization design, the overall structure effectively solves the technical problem of small-sized thin boards easily overlapping in the middle area due to gravity or solution flow without the need for complex auxiliary components. At the same time, it is compatible with the hanging and solution treatment environment of existing immersion nickel-gold production lines. It jointly ensures the quality and efficiency of the immersion nickel-gold process from three aspects: clamping method, isolation stability, and solution reaction conditions, solving the core problems of inefficient clamping, easy damage to the board surface, and insufficient solution contact in traditional processes.

[0029] Optionally, the separator line 200 is made of Teflon. This material has excellent chemical stability and can withstand long-term corrosion from strong acid and alkali solutions in the immersion nickel-gold process without swelling, decomposition, or precipitation of impurities, ensuring that the separator line 200 maintains structural integrity and functional stability during repeated use. At the same time, the Teflon surface has an extremely low coefficient of friction and is smooth and burr-free, which can prevent jamming or mechanical damage to the board surface in the separator area 201 when the circuit board is inserted, and reduce the adhesion and residue of the solution on the surface of the separator line 200, preventing contamination of the board surface and reducing the difficulty of subsequent cleaning. In addition, the insulating properties of Teflon material can effectively prevent abnormal metal deposition caused by electrochemical reactions, further ensuring the uniformity of nickel and gold layer deposition during the immersion nickel-gold process. It significantly improves the applicability and processing yield of the basket for small-sized boards in terms of corrosion resistance, operational safety, and process consistency. Understandably, wires made from materials other than Teflon, such as PEEK, PFA, PVDF, modified PTFE (e.g., fiberglass-filled), PPS, and PI, are suitable as separator lines 200 for isolating circuit boards during the immersion nickel-gold plating process due to their excellent corrosion resistance, temperature resistance, insulation, and smooth surface properties. The selection of these materials depends on the specific chemical composition, temperature conditions, and process requirements to ensure the quality and consistency of the circuit boards during immersion nickel-gold plating production.

[0030] Refer to Figure 1In some embodiments of this utility model, a first crossbar 110 and a second crossbar 120 are respectively provided on both sides of the main frame 100. A layered clamping strip 300 is connected between the first crossbar 110 and the second crossbar 120. The layered clamping strip 300 passes through all the partition areas 201 to separate the first and second areas arranged vertically at intervals. This realizes the double-layer or multi-layer insertion clamping of circuit boards, which can make full use of the vertical space height of the main frame 100. Without increasing the overall floor area of ​​the main frame 100, the number of circuit boards processed in a single batch can be multiplied, significantly improving production efficiency. Furthermore, the physical isolation effect of the layered clamping strip 300 ensures that the circuit boards between different layers are kept independently distributed, avoiding poor stacking caused by contact between upper and lower board surfaces due to gravity or liquid flow. At the same time, combined with the horizontal isolation of the dividing line 200, a two-way spatial separation system is formed, which strengthens the fixing stability of small-sized thin boards, especially easily deformable boards with a thickness ≤1.0mm, and effectively ensures full contact between each board surface and the liquid. Specifically, there are multiple first crossbars 110 and second crossbars 120 arranged at intervals in the vertical direction. The combination of multiple crossbars forms a multi-group layered clip 300 mounting position. The fixed height of the layered clip 300 can be flexibly adjusted according to the height of the circuit board when it is placed vertically, such as 80mm, 100mm, 150mm, 250mm, 300mm, etc., thereby accurately controlling the vertical spacing of each layered area 201, further improving the uniformity of the process and the flexibility of production, especially suitable for batch processing scenarios of circuit boards with mixed heights.

[0031] In some embodiments of this utility model, such as Figure 1 As shown, there are multiple layered clips 300, which are spaced apart along the length of the first crossbar 110. On one hand, the horizontally dispersed layered clips 300 further divide each layer area 201 into multiple independent slots, maintaining a uniform horizontal spacing between multiple circuit boards within the same layer and enhancing the stability of the lateral distribution of the circuit boards. On the other hand, the horizontally dispersed layered clips 300 better separate the first and second zones, preventing the circuit boards from shifting, tilting, or overlapping due to uneven force during insertion in the first and second zones. Furthermore, the horizontal spacing of the layered clips 300 can be adjusted to accommodate the clamping requirements of circuit boards of different sizes. Working in conjunction with the layered structure of the first and second zones, a multi-dimensional precision isolation system is formed, comprehensively ensuring the independent reaction space and uniform contact of each circuit board with the reagent solution during the nickel-gold plating process. This is particularly suitable for dense clamping scenarios of small-sized boards with dimensions close to 300mm × 300mm.

[0032] Optionally, in some embodiments of this utility model, the two ends of the layered clip 300 are respectively engaged with the first crossbar 110 and the second crossbar 120, achieving fixation without screws, nuts, or other fasteners, thus simplifying the assembly and disassembly process of the layered clip 300. Simultaneously, the screwless design eliminates the risk of gold plating waste caused by contact between metal fasteners and the immersion nickel-gold solution, i.e., metal ions would contaminate the board surface. Therefore, it improves production efficiency and reduces production costs, meeting the comprehensive requirements of the immersion nickel-gold process for cleanliness, economy, and ease of operation. (Refer to...) Figure 2 One end of the layered retaining strip 300 bends inward to form a first retaining groove 301, and the other end bends outward to form a second retaining groove 302. A first crossbar 110 engages with the first retaining groove 301, and a second crossbar 120 engages with the second retaining groove 302. The specific shaped groove structure tightly engages with the first crossbar 110 and the second crossbar 120, significantly improving the stability and positioning accuracy of the engagement. Furthermore, the bidirectional bending design, both inward and outward, utilizes the material's yield strength to achieve self-locking, allowing for manual installation and adjustment without additional tools, preventing deformation, breakage, or detachment of the retaining strip due to prolonged use or frequent insertion and removal. This structure simplifies the assembly process while further enhancing the lateral support capacity of the layered retaining strip 300, ensuring independent separation of circuit boards between different layers. It is particularly suitable for production scenarios involving high-frequency clamping operations, extending the service life of the hanging basket and reducing maintenance costs.

[0033] In some embodiments of this utility model, such as Figure 1 As shown, a hook 400 is fixedly connected to the upper side of the main frame 100 to lift the main frame 100. This mechanical lifting method replaces manual handling, significantly improving the ease of operation and safety of the main frame 100 during transfer on the nickel-gold production line. Furthermore, there are two hooks 400, symmetrically arranged on the main frame 100. This balanced force-bearing structure ensures that the center of gravity of the main frame 100 remains stable during lifting, effectively preventing frame tilting, twisting deformation, or misalignment of the dividing lines 200 / clamping strips due to uneven force on one side of the hooks 400. Moreover, the symmetrical layout enhances the overall structural symmetry of the hanging basket, making the distribution of the internal dividing lines 200 and layered clamping strips 300 more uniform, indirectly ensuring the consistency and stability of the circuit board insertion clamping. In addition, the double hook 400 design enhances the reliability of the connection between the hanging basket and the hoisting equipment, and is suitable for large-size main frame 100, such as heavy hoisting scenarios that accommodate double-layer, multi-layer circuit boards or multiple circuit boards in the same clamping state. This further reduces safety risks and equipment wear during the production process and improves the applicability of the hanging basket in complex production environments.

[0034] Refer to Figure 1In some embodiments of this utility model, a side stop bar 130 is provided on the side of the main frame 100 opposite to the opening 101. Multiple side stop bars 130 are arranged at intervals in the vertical direction, and the distance between adjacent side stop bars 130 is less than the length of the circuit board, thus preventing the circuit board from detaching from the main frame 100. By limiting the displacement of the circuit board towards the non-opening 101 side after insertion using a physical blocking structure, it can be understood that the distance between adjacent side stop bars 130 is less than the length of the circuit board, which is the height of the circuit board in the vertical direction. Furthermore, this ensures that even when the circuit board is subjected to tilting forces, impact from liquid flow, or multiple layers stacked, the circuit board is reliably confined within the main frame 100 and will not detach from the opening 101 area, overcoming the limitations of traditional hanging baskets that rely solely on insertion and fixation on the opening 101 side.

[0035] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

Claims

1. A hanging basket for immersion nickel-gold production, characterized in that, include: The main frame has openings on its sides for inserting circuit boards. Multiple dividing lines are made of corrosion-resistant material. All of the dividing lines are vertically installed in the main frame. On the horizontal cross section, the multiple dividing lines are arranged in a dot matrix to form multiple partition areas, so that the circuit board can be inserted into the partition areas one by one through the opening. The main frame is provided with a first crossbar and a second crossbar on both sides, and a layered retaining strip is connected between the first crossbar and the second crossbar. The layered retaining strip passes through all the partition areas to separate the first and second areas arranged vertically.

2. The hanging basket for immersion nickel-gold production according to claim 1, characterized in that: The dividing line is made of Teflon.

3. The hanging basket for immersion nickel-gold production according to claim 1, characterized in that: There are multiple first and second crossbars, which are arranged at intervals in the vertical direction.

4. A hanging basket for immersion nickel-gold production according to claim 1 or 3, characterized in that: There are multiple layered card strips, which are arranged at intervals along the length of the first crossbar.

5. A hanging basket for immersion nickel-gold production according to claim 4, characterized in that: The two ends of the layered clip are respectively engaged with the first crossbar and the second crossbar.

6. The hanging basket for immersion nickel-gold production according to claim 5, characterized in that: One end of the layered card strip is bent inward to form a first locking groove, and the other end of the layered card strip is bent outward to form a second locking groove. The first crossbar engages with the first locking groove, and the second crossbar engages with the second locking groove.

7. The hanging basket for immersion nickel-gold production according to claim 1, characterized in that: A hook is fixedly connected to the upper side of the main frame to lift the main frame.

8. A hanging basket for immersion nickel-gold production according to claim 7, characterized in that: There are two hooks, which are symmetrically arranged on the main frame.

9. A hanging basket for immersion nickel-gold production according to claim 1, characterized in that: A side stop is provided on the side of the main frame away from the opening. There are multiple side stops arranged at intervals in the vertical direction. The distance between adjacent side stops is less than the length of the circuit board, so as to prevent the circuit board from detaching from the main frame.

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