Small semiconductor waterless single refrigerator

Abstract

The utility model relates to a semiconductor refrigeration technical field especially, it relates to a small -size semiconductor anhydrous single refrigeration ware, including flow channel turbulence upper outlet and flow channel main cavity, flow channel turbulence upper outlet installs in flow channel main cavity, and the lateral wall of flow channel main cavity is equipped with the connecting hanger, and the lateral wall of connecting hanger is equipped with temperature conversion board, and the lateral wall of temperature conversion board is equipped with radiating tooth piece, and the end of radiating tooth piece is equipped with power input port protection base, and the inside of temperature conversion board is equipped with semiconductor refrigeration piece, and the lateral wall of radiating tooth piece is equipped with radiating fan. The utility model discloses through setting up semiconductor refrigeration piece, and semiconductor refrigeration piece will work and produce the cold quantity conduction to flow channel main cavity, make the temperature reduction in flow channel main cavity, realize refrigeration effect, guarantee single refrigeration and cold and hot exchange function under the working environment, and the overall device volume is smaller, saves the work space, improves the application rate of equipment, and reduces cost and the complexity of operation.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration technology, and in particular to a small semiconductor waterless single-cooler. Background Technology

[0002] With the increasing and diversified demands of experimental applications, precise temperature control technology in the absence of water sources has been widely used in many special industries, which has had a profound impact on the reliability of experimental data, the stability of production processes, and the efficiency improvement of related industries.

[0003] Traditional temperature control structures are diverse and bulky, occupying a significant amount of workspace. In scenarios with extremely stringent space requirements, such as small laboratories or the interiors of precision instruments, their large size severely limits their use. Existing temperature control structures often have limited functionality and cannot meet both cooling and heating needs. When dealing with production processes that require alternating hot and cold temperature control, multiple different devices are required, increasing costs and operational complexity. Traditional temperature control structures also consume a large amount of energy, further increasing operating costs. Utility Model Content

[0004] The purpose of this invention is to solve the problem that the large size of existing devices limits their applicable scenarios, and to propose a small semiconductor waterless single-cooler.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A small semiconductor waterless single-cooler includes a flow channel turbulence upper outlet and a flow channel main cavity. The flow channel turbulence upper outlet is installed in the flow channel main cavity. The side wall of the flow channel main cavity is provided with a connecting bracket. The side wall of the connecting bracket is provided with a temperature conversion plate. The side wall of the temperature conversion plate is provided with heat dissipation fins. The end of the heat dissipation fins is provided with a power input port protective base. A semiconductor cooling chip is provided inside the temperature conversion plate. A cooling fan is provided on the side wall of the heat dissipation fins.

[0007] Preferably, the outer wall of the upper outlet of the flow channel is provided with a threaded groove, the upper outlet of the flow channel is threadedly connected to the main cavity of the flow channel, and the outer wall of the upper outlet of the flow channel is provided with a rubber sealing ring.

[0008] Preferably, the connecting bracket and the main cavity of the flow channel are connected by a hook, and the connecting bracket is threadedly connected to the temperature conversion plate by a bolt assembly.

[0009] Preferably, the heat dissipation fins are threadedly connected to the temperature conversion plate via bolt assemblies. The temperature conversion plate has a storage slot, which is rectangular in shape. The thermoelectric cooling chip is installed on the inner sidewall of the storage slot, and the heat dissipation fins are connected to the thermoelectric cooling chip.

[0010] Preferably, the power input port is provided at the end of the protective base, and the power input port is connected to the cooling fan and the thermoelectric cooler respectively.

[0011] Preferably, the cooling fan sidewall is provided with a protective plate, and the cooling fan and the protective plate are threadedly connected to the cooling fins by a screw assembly.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] 1. This utility model incorporates a semiconductor cooling chip, which conducts the cooling energy generated during operation to the main cavity of the flow channel, thereby lowering the temperature within the main cavity and achieving a cooling effect. This ensures both single-cooling and heat exchange functions under working conditions. Furthermore, the overall device is small in size, saving workspace, improving the applicability of the equipment, and reducing costs and operational complexity.

[0014] 2. This utility model features an upper outlet for flow channel turbulence, which is connected to the main cavity of the flow channel via a threaded groove. The addition of a rubber sealing ring enhances the overall sealing performance, reduces material leakage, and improves the stability of equipment operation. Furthermore, the inclusion of heat dissipation fins connected to the thermoelectric cooler dissipates the heat generated during operation, ensuring the cooling efficiency of the thermoelectric cooler. Finally, a cooling fan accelerates heat dissipation, further enhancing the heat dissipation effect, strengthening the equipment's protective performance, and extending its service life. Attached Figure Description

[0015] Figure 1 This is an exploded view of the components of a small semiconductor waterless single-cooler proposed in this utility model;

[0016] Figure 2 This is an isometric view of a small semiconductor anhydrous single-cooler proposed in this utility model;

[0017] Figure 3 This is a cross-sectional side view of the heat dissipation fins of a small semiconductor waterless single-cooler proposed in this utility model;

[0018] Figure 4 This is a sectional side view of the temperature conversion plate of a small semiconductor waterless single-cooler proposed in this utility model;

[0019] Figure 5 This is a schematic diagram of the operating state of a small semiconductor waterless single-cooler proposed in this utility model.

[0020] In the diagram: 1. Upper outlet of the flow channel; 2. Main cavity of the flow channel; 3. Connecting bracket; 4. Power input port; 5. Protective base for the power input port; 6. Temperature conversion plate; 7. Semiconductor cooling chip; 8. Heat sink; 9. Cooling fan; 10. Protective plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1-5 A small semiconductor waterless single-stage refrigerator includes a flow channel turbulence outlet 1 and a flow channel main cavity 2, as shown in the attached instruction manual. Figure 1 The flow channel turbulence outlet 1 is installed inside the main flow channel cavity 2. The outer wall of the flow channel turbulence outlet 1 is provided with a threaded groove. The flow channel turbulence outlet 1 and the main flow channel cavity 2 are threadedly connected. The outer wall of the flow channel turbulence outlet 1 is provided with a rubber sealing ring. The rubber sealing ring is set in an O-shape. Through the mutual cooperation between the rubber sealing ring and the main flow channel cavity 2, a sealing effect is formed between the flow channel turbulence outlet 1 and the main flow channel cavity 2, reducing fluid leakage and ensuring the stability of the entire equipment during operation. It also facilitates the installation and disassembly of the flow channel turbulence outlet 1 by the operator.

[0023] The main cavity 2 of the flow channel is provided with a connecting bracket 3 on its side wall. The connecting bracket 3 is provided with a temperature conversion plate 6 on its side wall. The connecting bracket 3 and the main cavity 2 of the flow channel are slidably connected by a hook. The connecting bracket 3 is threadedly connected to the temperature conversion plate 6 by a bolt assembly. Through the cooperation of the connecting bracket 3 and the temperature conversion plate 6, the temperature conversion plate 6 is installed on the side wall of the main cavity 2 of the flow channel, which facilitates the operator to disassemble and maintain the temperature conversion plate 6 in the future, and ensures the efficiency of the operator in the maintenance of the equipment.

[0024] The temperature conversion plate 6 has heat dissipation fins 8 on its side wall and a thermoelectric cooler 7 inside the temperature conversion plate 6. The heat dissipation fins 8 are threadedly connected to the temperature conversion plate 6 by bolt assemblies. The temperature conversion plate 6 has a storage slot with a rectangular shape. The thermoelectric cooler 7 is fixedly installed on the inner side wall of the storage slot. The side wall of the heat dissipation fins 8 is connected to the side wall of the thermoelectric cooler 7. Through the cooperation between the thermoelectric cooler 7 and the heat dissipation fins 8, the thermoelectric cooler 7 can achieve cooling or heating effects after being powered on. The heat dissipation fins 8 dissipate the heat generated by the thermoelectric cooler 7, ensuring that the thermoelectric cooler 7 can work continuously and stably.

[0025] The heat dissipation fin 8 is provided with a power input port protection base 5 at its end. The power input port 4 is fixedly installed at the end of the power input port protection base 5. The power input port 4 is connected to the cooling fan 9 and the thermoelectric cooler 7 respectively. Through the cooperation of the power input port 4 and the power input port protection base 5, power is input to the cooling fan 9 and the thermoelectric cooler 7, ensuring the normal operation of the equipment. The power input port protection base 5 also protects the power input port 4, reducing the possibility of damage to the power input port 4 caused by external factors and extending the service life of the equipment.

[0026] It should be noted that when the thermoelectric cooler 7 is a single-sided structure, it is only used for cooling, which is the most common application. The single-sided thermoelectric cooler 7 generates cold or heat on one side.

[0027] In some embodiments, the semiconductor cooling chip 7 preferably has a double-sided structure, in which both sides generate both cooling and heating simultaneously, i.e., a cooling-heating type.

[0028] A cooling fan 9 is provided on the side wall of the heat dissipation fin 8, and a protective plate 10 is fixedly installed on the side wall of the cooling fan 9. The cooling fan 9 and the protective plate 10 are threadedly connected to the heat dissipation fin 8 by a screw assembly. Through the cooperation between the cooling fan 9 and the thermoelectric cooler 7, the cooling fan 9 dissipates heat from the thermoelectric cooler 7. When the thermoelectric cooler 7 is working, it generates heat. When the cooling fan 9 is started, it accelerates the airflow speed to dissipate the heat generated by the thermoelectric cooler 7 to the surrounding environment, reducing the impact of the thermoelectric cooler 7 on the operating efficiency of the equipment due to excessive temperature, and ensuring the stability and safety of the equipment power supply.

[0029] The functional principle of this utility model can be explained through the following operation methods:

[0030] When the equipment is started, the power is connected through the power input port 4, and the semiconductor cooling chip 7 starts to work. The semiconductor cooling chip 7 begins to generate cooling energy, which is conducted to the main cavity 2 of the flow channel through the temperature conversion plate 6, thereby reducing the internal temperature of the main cavity 2 and achieving a cooling effect. Combined with the turbulence balancing effect of the upper outlet 1 of the flow channel, the high-temperature material entering from the lower inlet of the main cavity 2 of the flow channel can be cooled evenly. The high-temperature material is smoothly discharged through the upper outlet 1 of the flow channel. The threaded groove and rubber sealing ring on the outer wall of the upper outlet 1 of the flow channel enhance the stability of the connection when the upper outlet 1 of the flow channel is threadedly connected to the main cavity 2 of the flow channel, effectively reducing liquid leakage in the flow channel and ensuring the sealing of the equipment operation. The connecting bracket 3 is slidably connected to the main cavity 2 of the flow channel by a hook and is threadedly connected to the temperature conversion plate 6 by a bolt assembly, ensuring the reliability of the connection.

[0031] The dual-chip combination of the semiconductor cooling chip 7 connects the positive and negative electrodes of the two chips in series. The operator can switch the positive and negative electrodes to interchange the hot and cold sides, so that the system can automatically switch to cooling mode when the temperature is too high and switch to heating mode when the temperature is too low, thus realizing the self-adjustment and control of temperature.

[0032] Refer to the instruction manual appendix Figure 1 With appendix Figure 4 In some implementations, when the thermoelectric cooler 7 adopts a double-sided structure, the double-sided thermoelectric cooler 7 generates both cooling and heating on both sides simultaneously. Operators can replace and disassemble it according to the application scenario. When a single cooling function is required, a single-sided thermoelectric cooler 7 with the cold side facing the main cavity 2 of the flow channel can be selected. When a heat exchange function is required, a double-sided thermoelectric cooler 7 is selected. The double-sided thermoelectric cooler 7 can generate different temperatures on both sides simultaneously. One side of the thermoelectric cooler 7 cools, while the other side delivers heat, allowing the thermoelectric cooler 7 to switch between hot and cold sides during operation. When it is overheated, the thermoelectric cooler 7 cools; when it is undercooled, the thermoelectric cooler 7 heats. This achieves self-controllable temperature, ensuring the working efficiency of the equipment in single cooling and heat exchange, realizing temperature control of different areas, reducing energy waste, and lowering the cost of use.

[0033] By activating the cooling fan 9, the heat on the heat sink 8 is dissipated, preventing the temperature of the heating end of the thermoelectric cooler 7 from becoming too high and ensuring its continuous and stable operation. The protective plate 10 protects the cooling fan 9 and reduces the risk of damage from impacts by external objects during operation.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A small semiconductor waterless single-stage refrigerator, comprising a flow channel turbulence upper outlet (1) and a flow channel main cavity (2), wherein the flow channel turbulence upper outlet (1) is installed within the flow channel main cavity (2), characterized in that, The main cavity (2) of the flow channel is provided with a connecting bracket (3) on its side wall. The connecting bracket (3) is provided with a temperature conversion plate (6) on its side wall. The temperature conversion plate (6) is provided with a heat dissipation fin (8) on its side wall. The heat dissipation fin (8) is provided with a power input port protection base (5) at its end. The temperature conversion plate (6) is provided with a semiconductor cooling chip (7). The heat dissipation fin (8) is provided with a cooling fan (9) on its side wall.

2. The small semiconductor waterless single-cooler according to claim 1, characterized in that, The outer wall of the upper outlet (1) of the flow channel is provided with a threaded groove. The upper outlet (1) of the flow channel is threadedly connected to the main cavity (2) of the flow channel. The outer wall of the upper outlet (1) of the flow channel is provided with a rubber sealing ring.

3. A small semiconductor waterless single-cooler according to claim 1, characterized in that, The connecting bracket (3) and the main cavity of the flow channel (2) are connected by a hook, and the connecting bracket (3) is threadedly connected to the temperature conversion plate (6) by a bolt assembly.

4. A small semiconductor waterless single-cooler according to claim 1, characterized in that, The heat dissipation fins (8) are threadedly connected to the temperature conversion plate (6) by bolt assembly. The temperature conversion plate (6) has a storage slot, which is rectangular in shape. The semiconductor cooling chip (7) is installed on the inner side wall of the storage slot. The heat dissipation fins (8) and the semiconductor cooling chip (7) are connected.

5. A small semiconductor waterless single-cooler according to claim 1, characterized in that, The power input port protection base (5) is provided with a power input port (4) at its end. The power input port (4) is connected to the cooling fan (9) and the semiconductor cooling chip (7) respectively.

6. A small semiconductor waterless single-cooler according to claim 1, characterized in that, The cooling fan (9) has a protective plate (10) on its side wall. The cooling fan (9) and the protective plate (10) are connected by screw assembly and heat dissipation fins (8) threaded together.

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