Refrigerator

Abstract

The application discloses a refrigerator. A storage compartment of a cabinet is provided with a fresh-keeping box assembly. The fresh-keeping box assembly comprises a fresh-keeping box body and a drawer box. The drawer box is in a pull-out connection with the fresh-keeping box body. The fresh-keeping box assembly further comprises a semiconductor refrigeration structure. The semiconductor refrigeration structure is attached to an outer surface of the fresh-keeping box body. The refrigerator of the application is provided with the semiconductor refrigeration structure attached to the surface of the fresh-keeping box body. The Peltier effect of the semiconductor is utilized to directly cool the fresh-keeping box body. The low temperature of the semiconductor is conducted to the fresh-keeping space of the fresh-keeping box body through the surface of the fresh-keeping box body, and the food materials in the storage space of the drawer box can be uniformly cooled.

Description

Technical Field

[0001] This application relates to the field of household appliance technology, and more particularly to a refrigerator. Background Technology

[0002] As people's living standards continue to improve, refrigerators have become an indispensable household appliance. A refrigerator has a storage compartment, which is typically used for the low-temperature refrigeration or freezing of items such as food and medicine.

[0003] Considering that some foods have high requirements for preservation, drawer-type food storage containers are usually installed in the refrigerator's storage compartment. Simultaneously, a separate airflow system is connected to these containers within the refrigerator's cooling system to blow cold air from the storage compartment onto their surface, allowing for individual temperature control. However, using an airflow system to cool the surface of the food storage containers not only occupies a significant amount of space within the storage compartment, but this indirect airflow also has low cooling efficiency, making it unsuitable for meeting the low-temperature preservation requirements of the food storage containers. Utility Model Content

[0004] This application discloses a refrigerator for effectively cooling the food storage container in the refrigerator, thereby improving the food preservation effect of the food storage container in the refrigerator.

[0005] To achieve the above objectives, this application discloses a refrigerator, comprising: The container has a storage compartment; A door, rotatably connected to the housing, configured to close or open the storage compartment; Food storage container assembly, wherein the food storage container assembly is disposed in the storage compartment, the food storage container assembly comprising: A food storage container body, wherein the food storage container body has a food preservation space; A pull-out box is movably connected to the food preservation box body to open or close the food preservation space, and the pull-out box has a storage space. When the pull-out box closes the food preservation space, the storage space is connected to the food preservation space. A semiconductor cooling structure is disposed on at least one surface of the food storage container to cool the food storage container.

[0006] In the refrigerator disclosed in this application, the food storage container assembly is used to preserve ingredients with high freshness requirements. Therefore, the low-temperature preservation requirements for the food storage container assembly are high. To address this, this application uses a semiconductor cooling structure attached to the surface of the food storage container body, utilizing the Peltier effect of the semiconductor to directly cool the food storage container body. The low temperature of the semiconductor is conducted through the surface of the food storage container body to the preservation space within the container, enabling uniform cooling of the food within the pull-out storage space. Moreover, compared to cooling methods using air delivery structures, the semiconductor cooling structure reduces the design of complex air delivery channels, which helps optimize the spatial layout within the refrigerator and saves space occupied by the inner liner.

[0007] Furthermore, because the original air supply structure directs air from the refrigeration unit to the food storage container, the temperature inside the storage compartment is relatively higher than the temperature of the cold air when it enters, easily leading to condensation due to the interaction of hot and cold air. Therefore, eliminating the air supply structure also helps reduce condensation in the storage compartment.

[0008] As some alternative implementations, the semiconductor cooling structure includes: A first heat-conducting element is attached to at least one surface of the food storage container body; A refrigeration component, wherein the cold end of the refrigeration component is disposed on the first heat-conducting component; Wherein, along the thickness direction of the first heat-conducting element, the surface area of ​​the first heat-conducting element is greater than the surface area of ​​the cold end of the cooling element.

[0009] Considering the high cost of semiconductor cooling structures, this application employs a method where the cooling component is connected to a first heat-conducting component, allowing the temperature at the cold end of the cooling component to be uniformly conducted through the first heat-conducting component. Since the surface area of ​​the first heat-conducting component is larger than the surface area of ​​the cold end of the cooling component, the contact area between the first heat-conducting component and the surface of the food storage container is larger. This allows the first heat-conducting component to uniformly conduct the temperature at the cold end of the cooling component, resulting in a uniform distribution of low temperature across the surface of the food storage container. This, in turn, improves the cooling effect of the cooling component on the storage space within the food storage container.

[0010] As some alternative implementations, along the thickness direction of the first heat-conducting element, the surface area of ​​the first heat-conducting element is S1, and the surface area of ​​the cold end of the cooling element is S2, satisfying: 0.2 < S2 / S1 < 0.4.

[0011] In setting the ratio of the surface area of ​​the cold end of the cooling component to the surface area of ​​the first heat-conducting component, this application takes the following considerations: On the one hand, it avoids S2 / S1 being too small. If S2 / S1 is less than 0.2, the surface area of ​​the first heat-conducting component is too large relative to the surface area of ​​the cold end of the cooling component, making it difficult for the cooling effect of the cooling component to effectively and evenly transfer the temperature to the entire surface of the first heat-conducting component. On the other hand, it avoids S2 / S1 being too large. If S2 / S1 is greater than 0.4, the difference between the surface area of ​​the first heat-conducting component and the surface area of ​​the cold end of the cooling component is small, resulting in poor heat conduction and heat equalization effect of the first heat-conducting component on the cooling component. Therefore, this application controls the ratio of the surface area of ​​the cold end of the cooling component to the surface area of ​​the first heat-conducting component between 0.2 and 0.4. This reduces the cost of using semiconductors while also enabling effective heat equalization and cooling of the food storage container by the cold end of the cooling component through the first heat-conducting component.

[0012] As some alternative implementations, along the thickness direction of the first heat-conducting element, the surface area of ​​the first heat-conducting element is S1, and the surface area of ​​the side surface of the food storage box body that is attached to the first heat-conducting element is S3, satisfying: 0.15 < S1 / S3 < 0.45.

[0013] In setting the ratio of the surface area of ​​the first heat-conducting element to the surface area of ​​the food storage container, this application also takes into consideration two aspects: First, it avoids S1 / S3 being too small. If S1 / S3 is less than 0.15, the coverage area of ​​the first heat-conducting element on the surface of the food storage container is small, resulting in poor uniform cooling effect. That is, the cooling effect is better on the part of the food storage container covered by the first heat-conducting element, but the majority of the food storage container not covered by the first heat-conducting element is difficult to cool effectively. Second, it avoids S1 / S3 being too large. If S1 / S3 is greater than 0.45, the area occupied by the first heat-conducting element on the surface of the food storage container is large. Since the first heat-conducting element protrudes relative to the surface of the food storage container, it may occupy additional space in the storage compartment, affecting the storage volume of the storage compartment. Therefore, this application controls the ratio of the surface area of ​​the first heat-conducting element to the surface area of ​​the food storage container to be between 0.15 and 0.45. This not only allows the first heat-conducting element to cool the surface of the food storage container evenly, but also avoids the first heat-conducting element occupying too much space and causing additional space occupation in the storage compartment.

[0014] As some alternative implementations, the semiconductor cooling structure includes multiple semiconductor cooling structures, which are disposed on the same side surface of the food storage container or dispersedly disposed on different surfaces of the food storage container.

[0015] By setting multiple semiconductor cooling structures, if the food storage container is square, all surfaces except the pull-out side can be equipped with semiconductor cooling structures to enhance the cooling effect of the semiconductor cooling structure on the inside of the container. If multiple semiconductor cooling structures are all set on one side of the food storage container, they can effectively cover that side, radiating and cooling the storage space through that side, thus achieving effective cooling of both the storage and preservation spaces.

[0016] As some alternative implementations, the semiconductor cooling structure includes: A refrigeration component, wherein the cold end of the refrigeration component is disposed on at least one side surface of the food storage container, and the hot end of the refrigeration component is connected to the inner surface of the storage compartment.

[0017] This application addresses the issue that, when a food storage container is installed in a storage compartment, at least one surface of the container must be adjacent to the inner surface of the storage compartment to ensure installation stability. This is because during the cooling process of a semiconductor refrigeration structure, the hot end of the cooling component dissipates heat. If this heat is directly dissipated into the storage compartment, it may affect the cooling effect and increase energy consumption. To address this, this application positions the cooling component on the side of the food storage container closest to the inner surface of the storage compartment. By connecting the cold end of the cooling component to the surface of the container and the hot end to the inner surface of the storage compartment, the heat from the hot end of the cooling component is dissipated or conducted away through the inner surface of the storage compartment, preventing direct heat dissipation into the storage compartment and thus avoiding impacts on cooling performance and refrigerator energy consumption.

[0018] As some optional implementations, the refrigerator further includes: A vacuum device is provided in the box body and is connected to the food storage container assembly. The vacuum device is configured to vacuum the food storage container assembly.

[0019] Considering the food preservation effect of the food storage container assembly, it is necessary not only to create a low-temperature environment but also a relatively low-pressure, low-oxygen environment to inhibit the growth of microorganisms and the rate of decomposition of organic matter. To address this, this application employs a semiconductor cooling structure to effectively cool the food storage container body. Furthermore, a vacuum device is installed within the container body, connected to the food storage container assembly, to create a low-temperature, low-pressure, and low-oxygen environment, thereby enhancing the food preservation effect of the food storage container assembly.

[0020] As some alternative implementations, at least one surface of the food storage container is provided with reinforcing ribs.

[0021] This application also considers that after the interior of the food storage container assembly is vacuumed, the pressure difference between the inner and outer surfaces of the container may cause the container to be subjected to excessive pressure, leading to damage. Therefore, this application incorporates reinforcing ribs on the surface of the food storage container to enhance its structural strength and prevent damage after vacuuming.

[0022] As some alternative implementations, the semiconductor cooling structure includes: A refrigeration component, wherein the cold end of the refrigeration component is located on the side of the reinforcing rib away from the food storage container body; The second heat-conducting element is located between the refrigeration element and the food preservation box body. The second heat-conducting element is configured to connect the cold end of the refrigeration element with the surface of the food preservation box body where the reinforcing ribs are provided.

[0023] In this application, the food storage container body has reinforcing ribs on its surface. These ribs protrude from the surface of the container body, hindering the connection between the cooling component of the semiconductor cooling structure and the container body. This prevents the cooling component from effectively cooling the container body directly, thus affecting its cooling performance. To address this, this application employs a second heat-conducting component. This component connects the surface of the food storage container body to the cold end of the cooling component, allowing for temperature transfer and thus achieving effective cooling of the food storage container.

[0024] As some alternative embodiments, the reinforcing ribs include a plurality of ribs, which are staggered on each surface of the food storage container body to form a grid-like structure. The grid-like reinforcing ribs have mounting positions on one surface of the food storage container body, and the semiconductor cooling structure is located at the mounting positions to be disposed on the surface of the food storage container body.

[0025] To enhance the strength of the food storage container, this application employs a grid-like arrangement of multiple interlaced reinforcing ribs covering the surface of the container. This significantly strengthens the structural integrity of the container. However, this prevents the cooling component of the semiconductor cooling structure from directly connecting to the surface of the container for cooling. To address this, this application provides mounting positions on the grid-like surface of the container, without reinforcing ribs, allowing the cooling component to directly connect to the surface. This not only improves the cooling effect of the cooling component but also, because the mounting positions are recessed relative to the reinforcing ribs, facilitate the positioning and installation of the cooling component, improving the ease of assembly.

[0026] Compared with the prior art, this application has at least the following beneficial effects: In the refrigerator disclosed in this application, the food storage container assembly is used to preserve ingredients with high freshness requirements. Therefore, the low-temperature preservation requirements for the food storage container assembly are high. To address this, this application uses a semiconductor cooling structure attached to the surface of the food storage container body, utilizing the Peltier effect of the semiconductor to directly cool the food storage container body. The low temperature of the semiconductor is conducted through the surface of the food storage container body to the preservation space within the container, enabling uniform cooling of the food within the pull-out storage space. Moreover, compared to cooling via a fan-based structure, the semiconductor cooling structure reduces the design of complex air delivery channels, which helps optimize the spatial layout within the refrigerator and saves space occupied by the inner liner.

[0027] Furthermore, because the original air supply structure directs air from the refrigeration unit to the food storage container, the temperature inside the storage compartment is relatively higher than the temperature of the cold air when it enters, easily leading to condensation due to the interaction of hot and cold air. Therefore, eliminating the air supply structure also helps reduce condensation in the storage compartment. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of the refrigerator disclosed in the embodiments of this application; Figure 2 This is a schematic diagram of an explosion of a refrigerator as disclosed in an embodiment of this application; Figure 3 This is a schematic diagram of a food storage container assembly disclosed in an embodiment of this application; Figure 4 This is an exploded view of a food storage container assembly disclosed in an embodiment of this application; Figure 5 This is a schematic diagram of the semiconductor cooling structure disclosed in the embodiments of this application; Figure 6 This is an isometric view of the food storage container assembly disclosed in the embodiments of this application; Figure 7 This is an exploded view of the semiconductor cooling structure disclosed in the embodiments of this application; Figure 8 This is another exploded view of the food storage container assembly disclosed in the embodiments of this application; Figure 9 This is another structural schematic diagram of the food storage container assembly disclosed in the embodiments of this application; Figure 10 for Figure 9 A magnified view of a portion of point A in the middle.

[0030] Explanation of reference numerals in the attached figures: 100. Refrigerator; 1. Cabinet; 1a. Storage compartment; 2. Door; 3. Food storage container assembly; 31. Food storage container body; 311. Reinforcing rib; 31a. Food storage space; 31b. Mounting position; 32. Pull-out box; 32a. Storage space; 33. Semiconductor cooling structure; 331. First heat conduction component; 332. Cooling component; 332a. Cold end; 332b. Hot end; 333. Second heat conduction component. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," and "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0033] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0034] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0035] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0036] As people's living standards continue to improve, refrigerators have become an indispensable household appliance. A refrigerator has a storage compartment, which is typically used for the low-temperature refrigeration or freezing of items such as food and medicine.

[0037] Considering that some foods have high requirements for preservation, drawer-type food storage containers are usually installed in the refrigerator's storage compartment. Simultaneously, a separate airflow system is connected to these containers within the refrigerator's cooling system to blow cold air from the storage compartment onto their surface, allowing for individual temperature control. However, using an airflow system to cool the surface of the food storage containers not only occupies a significant amount of space within the storage compartment, but this indirect airflow also has low cooling efficiency, making it unsuitable for meeting the low-temperature preservation requirements of the food storage containers.

[0038] Furthermore, the air supply structure requires a separate air supply duct design, which will occupy additional space in the cabinet or storage room, making it unfavorable for the space design of the storage room and cabinet.

[0039] In addition, because the food storage container has high refrigeration requirements, the air blown out by the air supply structure is relatively lower than the temperature inside the storage room. When a temperature difference occurs between the two, condensation is likely to occur at the air outlet of the air supply structure.

[0040] In response, the refrigerator disclosed in this application incorporates a semiconductor cooling structure on the food storage container body of the food storage container assembly. This utilizes the Peltier effect of the semiconductor to directly cool the food storage container body, thereby effectively cooling both the storage space within the food storage container and the storage space in the pull-out compartment. Furthermore, by eliminating the need for a traditional airflow structure and directly employing a semiconductor cooling structure to cool the food storage container body, the space-consuming and condensation problems caused by the airflow structure are effectively avoided.

[0041] The technical solution of this application will be further described below with reference to the embodiments and accompanying drawings.

[0042] This application discloses a refrigerator 100, which can be, for example, a double-door refrigerator 100, a single-door refrigerator 100, a three-door refrigerator 100, or a French door refrigerator 100. Alternatively, it can be a French door refrigerator 100, that is, the upper part is a double-door refrigerator compartment, providing users with spacious storage space, and the lower part is usually a drawer-type freezer compartment, which makes it easier to classify, store, and access frozen foods. The specific form is not limited in this application embodiment.

[0043] Please see Figure 1 In some embodiments, the refrigerator 100 includes a cabinet 1 that defines a storage compartment 1a for storing food. The storage compartment 1a may include a freezer compartment, a refrigerator compartment, or a variable temperature compartment, etc.

[0044] Understandably, the temperature of a refrigerator compartment is typically between 0°C and 8°C, keeping food refrigerated. The temperature of a freezer compartment is typically between -14°C and -26°C, keeping food frozen. The temperature of a variable-temperature compartment is generally adjustable between 0°C and -7°C, or can be directly set to -18°C for use as a freezer.

[0045] Optionally, the storage room 1a may include a first sub-storage room 1a and a second sub-storage room 1a, with the second sub-storage room 1a located below the first sub-storage room 1a along the height direction of the housing 1.

[0046] It is understandable that either the first sub-storage compartment 1a or the second sub-storage compartment 1a could be a freezer compartment or a refrigerator compartment. Alternatively, one could be a variable temperature compartment or the other a freezer compartment.

[0047] Of course, the first sub-storage chamber 1a and the second sub-storage chamber 1a can also be set along the width direction of the box body 1, with one sub-storage chamber 1a on each side.

[0048] Understandably, in Figure 1 In the example, X indicates the width of box 1, Y indicates the depth of box 1, and Z indicates the height of box 1.

[0049] In some embodiments, the refrigerator 100 includes a door 2, which is movably connected to the cabinet 1 to open or close the storage compartment 1a to prevent cold air from leaking out of the storage compartment 1a.

[0050] It is understandable that doors 2 are also installed outside storage rooms 1a such as freezers and variable temperature rooms to close or open these storage rooms 1a.

[0051] In some embodiments, the refrigerator 100 further includes a refrigeration module (not shown), which is disposed inside the cabinet 1. The refrigeration module can lower the temperature inside the storage compartment 1a to different temperatures to meet the different storage needs of users.

[0052] Optionally, the refrigeration module can be a direct refrigeration module or an air-cooled refrigeration module.

[0053] Specifically, a direct refrigeration module may include a compressor, condenser, evaporator, and capillary tube. The refrigerant first passes through the compressor and condenser to become a high-pressure refrigerant liquid. The high-pressure refrigerant from the condenser is then throttled through the capillary tube to become a low-pressure refrigerant liquid. It first enters the high-temperature evaporator in the refrigerator compartment, where partial evaporation and vaporization occur, before entering the low-temperature evaporator in the freezer compartment. During low-temperature evaporation, after sufficient vaporization, it is drawn into the compressor for compression, and then condensed back into a liquid by the condenser. This cycle continues continuously, achieving the refrigeration effect.

[0054] An air-cooled refrigeration module may include a compressor, condenser, evaporator, capillary tube, and fan. After the compressor, condenser, evaporator, and capillary tube generate cold air through the cooling process, the fan blows air onto the evaporator. The air passing through the evaporator becomes cold air, which can be blown into the refrigerator compartment and freezer compartment for cooling.

[0055] In some embodiments, the refrigerator 100 also includes a control board (not shown), which is electrically connected to a structure such as a refrigeration module to control the operation of the refrigerator 100.

[0056] Please see Figure 1 as well as Figure 2 In some embodiments, the refrigerator 100 also includes a food storage container assembly 3, which is disposed in the storage compartment 1a.

[0057] For example, the food storage container assembly 3 can be placed in a refrigerator compartment. By placing the food storage container assembly 3 in a refrigerator compartment, the requirements for low-temperature preservation of the food storage container assembly 3 are met, while avoiding the food in the food storage container assembly 3 from being frozen and damaged by excessively low temperatures.

[0058] It is understandable that the opening of the food storage container 3 faces the depth direction of the box body 1 so that the user can take out items from the food storage container 3. The food storage container 3 is also installed in the storage compartment 1a along the depth direction of the box body 1.

[0059] In some embodiments, the food storage container assembly 3 includes a food storage container body 31, which has a food storage space 311.

[0060] Understandably, the food located in the preservation space 311 can be effectively preserved and prevented from spoiling. The food located in the preservation space 311 is usually subject to high preservation requirements, such as fresh meat and seafood.

[0061] Please see Figure 3 as well as Figure 4 In some embodiments, the food storage container assembly 3 further includes a pull-out box 32, which is movably connected to the food storage container body 31 to open or close the food storage space 311. The pull-out box 32 has a storage space 32a. When the pull-out box 32 closes the food storage space 311, the storage space 32a is connected to the food storage space 311.

[0062] For example, when the pull-out box 32 is pulled out relative to the preservation space 311, the user can place the food in the storage space 32a of the pull-out box 32. When the pull-out box 32 is pushed back into the preservation space 311, the food can be placed in the preservation space 311 to keep the food warm.

[0063] Please see Figure 3 as well as Figure 4In some embodiments, the food storage container assembly 3 further includes a semiconductor cooling structure 33 disposed on at least one surface of the food storage container body 31 to cool the food storage container body 31.

[0064] In the refrigerator 100 disclosed in this application, the food preservation container assembly 3 is used to preserve food with high freshness requirements. Therefore, the low-temperature preservation requirements for the food preservation container assembly 3 are high. To address this, this application provides a semiconductor cooling structure 33 attached to the surface of the food preservation container body 31, utilizing the Peltier effect of the semiconductor to directly cool the food preservation container body 31. The low temperature of the semiconductor is conducted through the surface of the food preservation container body 31 to the preservation space 311 of the food preservation container body 31, which can evenly cool the food in the storage space 32a of the pull-out box 32. Moreover, compared with cooling by a fan structure, the semiconductor cooling structure 33 reduces the design of complex fan channels, which is beneficial to optimizing the spatial layout of the cabinet body 1 and saving space occupied by the inner liner of the cabinet body 1.

[0065] For example, the semiconductor cooling structure 33 is attached to or fixed to the surface of the food storage container 31 by means of a sticker or mounting component, so that the semiconductor cooling structure 33 can be closer to the food storage container 31 for cooling.

[0066] Furthermore, because the original air supply structure directs air from the refrigeration structure to the food storage container 31, the temperature of the storage compartment 1a is relatively higher than that of the cold air when it enters, making it easy for condensation to occur due to the interaction of hot and cold air. Therefore, eliminating the air supply structure also helps to reduce the generation of condensation in the storage compartment 1a.

[0067] For example, the food storage container 31 can be a square container, and the semiconductor cooling structure 33 can be attached to the other surfaces of the food storage container 31 except for the side with the pull-out box 32.

[0068] It is understood that the semiconductor cooling structure 33 of this application can be electrically connected to the control motherboard in the refrigerator 100, thereby facilitating precise control of the temperature of the semiconductor cooling structure 33, thereby achieving precise temperature control of the food preservation box 31 and improving the preservation effect of the food in the food preservation box 31.

[0069] Please see Figure 5 In some embodiments, the semiconductor cooling structure 33 includes a first heat-conducting element 331 and a cooling element 332. The first heat-conducting element 331 is attached to at least one surface of the food storage container body 31, and the cold end 332a of the cooling element 332 is disposed on the first heat-conducting element 331. Specifically, along the thickness direction of the first heat-conducting element 331, the surface area of ​​the first heat-conducting element 331 is larger than the surface area of ​​the cold end 332a of the cooling element 332.

[0070] Considering the high cost of semiconductor setup, this application employs a single cooling element 332 connected to a first heat-conducting element 331 when setting up the semiconductor cooling structure 33. The temperature of the cold end 332a of the cooling element 332 is uniformly conducted through the first heat-conducting element 331. Since the surface area of ​​the first heat-conducting element 331 is larger than the surface area of ​​the cold end 332a of the cooling element 332, the first heat-conducting element 331 uniformly conducts the temperature of the cold end 332a of the cooling element 332, resulting in a uniform distribution of low temperature on the surface of the food storage container 31. This improves the cooling effect of the cooling element 332 on the food storage space 311 within the food storage container 31.

[0071] Optionally, the first heat-conducting element 331 may be a heat-conducting metal sheet, a heat-conducting plastic sheet, a heat-conducting gel sheet, etc., and this application does not make specific limitations.

[0072] Optionally, the shape of the first heat-conducting element 331 may be square, circular, elliptical, triangular or other polygonal, etc., and this application does not make specific limitations in this regard.

[0073] Optionally, the shape of the cooling component 332 may be square, circular, elliptical, triangular or other polygonal, etc., and this application does not specifically limit it.

[0074] It is understandable that the cooling element 332 is a semiconductor cooling element. When the semiconductor is cooled by the Peltier effect, one end of the semiconductor has a lower temperature and the other end has a higher temperature, which are the cold end 332a and the hot end 332b of the cooling element 332. The cold end 332a is used for cooling, and the hot end 332b is used for heat dissipation.

[0075] Please see Figure 6 In some embodiments, the semiconductor cooling structure 33 includes multiple semiconductor cooling structures 33, which are disposed on the same side surface of the food preservation box body 31 or dispersedly disposed on different surfaces of the food preservation box body 31.

[0076] In this application, multiple semiconductor cooling structures 33 are provided. If the food storage container 31 is square, semiconductor cooling structures 33 can be provided on all surfaces except the side where the pull-out box 32 is pulled out, thereby improving the cooling effect of the semiconductor cooling structures 33 on the inside of the food storage container 31. If multiple semiconductor cooling structures 33 are provided on one side surface of the food storage container 31, the multiple semiconductor cooling structures 33 can effectively cover one side surface of the food storage container 31, and radiate cooling of the food storage space 311 through the one side surface of the food storage container 31, thereby achieving effective cooling of both the food storage space 311 and the storage space 32a.

[0077] For example, when the semiconductor cooling structures 33 are distributed on different surfaces of the food storage container 31, since the cooling requirements of each individual surface of the food storage container 31 are relatively high, each semiconductor cooling structure 33 includes a first heat-conducting element 331 and a cooling element 332 to uniformly cool each surface of the food storage container 31. Alternatively, when multiple semiconductor cooling structures 33 are concentrated on one surface of the food storage container 31, each semiconductor cooling structure 33 may include a cooling element 332. That is, multiple cooling elements 332 can directly cover one surface of the food storage container 31 for cooling, without the need for an additional first heat-conducting element 331 for uniform heat dissipation.

[0078] Please see Figure 7 In some embodiments, along the thickness direction of the first heat-conducting element 331, the surface area of ​​the first heat-conducting element 331 is S1, and the surface area of ​​the cold end 332a of the cooling element 332 is S2, satisfying: 0.2 < S2 / S1 < 0.4.

[0079] For example, S2 / S1 can be 0.2-0.25, 0.25-0.3, 0.3-0.35, 0.3-0.4, etc. For example, S2 / S1 can be 0.21, 0.23, 0.25, 0.28, 0.3, 0.33, 0.35, 0.38, or 0.39, etc.

[0080] In setting the ratio of the surface area of ​​the cold end 332a of the cooling component 332 to the surface area of ​​the first heat-conducting component 331, this application avoids two considerations: First, S2 / S1 should not be too small. If S2 / S1 is less than 0.2, the surface area of ​​the first heat-conducting component 331 is relatively large compared to the surface area of ​​the cold end 332a of the cooling component 332, making it difficult for the cooling effect of the cooling component 332 to effectively and evenly transfer temperature to the entire surface of the first heat-conducting component 331. Second, S2 / S1 should not be too large. If S2 / S1 is greater than 0.4, the difference between the surface area of ​​the first heat-conducting component 331 and the surface area of ​​the cold end 332a of the cooling component 332 is small, resulting in poor heat conduction and heat equalization effect of the first heat-conducting component 331 on the cooling component 332. In other words, if the surface area of ​​the cold end 332a of the cooling component 332 meets the cooling requirements of the food storage box 31, the first heat-conducting component 331 may not be necessary. However, this would increase the cost of using semiconductors. Therefore, this application controls the ratio of the surface area of ​​the cold end 332a of the cooling component 332 to the surface area of ​​the first heat-conducting component 331 to between 0.2 and 0.4. While reducing the cost of using semiconductors, the first heat-conducting component 331 can also achieve effective heat dissipation and cooling of the food storage box body 31 by the cold end 332a of the cooling component 332.

[0081] Please see Figure 8In some embodiments, along the thickness direction of the first heat-conducting element 331, the surface area of ​​the first heat-conducting element 331 is S1, and the surface area of ​​the side surface of the food storage box body 31 on which the first heat-conducting element 331 is attached is S3, satisfying: 0.15 < S1 / S3 < 0.45.

[0082] For example, S1 / S3 can be 0.15-0.2, 0.2-0.25, 0.25-0.3, 0.3-0.35, 0.35-0.4, 0.4-0.45, etc. For example, S1 / S3 can be 0.16, 0.18, 0.2, 0.23, 0.25, 0.28, 0.3, 0.33, 0.35, 0.38, 0.4, 0.42, or 0.44, etc.

[0083] In setting the ratio of the surface area of ​​the first heat-conducting element 331 to the surface area of ​​the food storage container 31, this application avoids two main considerations. First, it avoids an excessively small S1 / S3 ratio. If S1 / S3 is less than 0.15, the coverage area of ​​the first heat-conducting element 331 on the surface of the food storage container 31 is small, resulting in poor uniform cooling. That is, the portion of the food storage container 31 covered by the first heat-conducting element 331 experiences better cooling, but the majority of the food storage container 31 not covered by the first heat-conducting element 331 struggles to achieve effective cooling. Second, it avoids an excessively large S1 / S3 ratio. If S1 / S3 is greater than 0.45, the area occupied by the first heat-conducting element 331 on the surface of the food storage container 31 is large. If the first heat-conducting element 331 protrudes relative to the surface of the food storage container 31, it may additionally occupy space in the storage compartment 1a, affecting the storage volume of the storage compartment 1a. Therefore, this application controls the ratio of the surface area of ​​the first heat-conducting element 331 to the surface area of ​​the food storage container 31 to be between 0.15 and 0.45. This not only enables the first heat-conducting element 331 to cool the surface of the food storage container 31 evenly, but also avoids the first heat-conducting element 331 occupying too much space and causing additional space occupation in the storage compartment 1a.

[0084] In some embodiments, the cold end 332a of the refrigeration component 332 is disposed on at least one side surface of the food storage container 31, and the hot end 332b of the refrigeration component 332 is connected to the inner surface of the storage chamber 1a.

[0085] This application takes into account that when the food storage container 31 is installed in the storage compartment 1a, in order to ensure the stability of the installation, at least one surface of the food storage container 31 is adjacent to the inner surface of the storage compartment 1a. Since the hot end 332b of the cooling element 332 dissipates heat during cooling, if the heat from the hot end 332b of the cooling element 332 is directly dissipated into the space of the storage compartment 1a, it may affect the cooling effect of the storage compartment 1a and cause additional cooling energy consumption. In this application, the refrigeration component 332 can be disposed on the side of the food storage box 31 near the inner surface of the storage compartment 1a. By connecting the cold end 332a of the refrigeration component 332 to the surface of the food storage box 31 and the hot end 332b of the refrigeration component 332 to the inner surface of the storage compartment 1a, the heat of the hot end 332b of the refrigeration component 332 can be dissipated or conducted through the inner surface of the storage compartment 1a, thereby preventing the heat of the hot end 332b of the refrigeration component 332 from being directly dissipated in the space of the storage compartment 1a and affecting the refrigeration of the storage compartment 1a and the energy consumption of the refrigerator 100.

[0086] Optionally, when the cold end 332a of the refrigeration component 332 is located on one side of the food storage container 31, the cold end 332a of the refrigeration component 332 can be installed on the food storage container by means of attachment or fixing with an installation component. This application does not make specific limitations here.

[0087] For example, when the food storage container 31 is installed on the bottom surface of the storage chamber 1a, the bottom surface of the food storage container 31 is close to the bottom surface of the storage chamber 1a. Therefore, the cooling component 332 can be placed on the bottom surface of the food storage container 31. In this way, the hot end 332b of the cooling component 332 can be connected to the bottom surface of the storage chamber 1a, so that the heat dissipation of the hot end 332b of the cooling component 332 can be achieved by utilizing the bottom surface of the storage chamber 1a.

[0088] It is understandable that when the food storage container 31 is located on the side of the storage compartment 1a, the refrigeration unit 332 is located on the side of the food storage container 31.

[0089] In some embodiments, the refrigerator 100 further includes a vacuum device (not shown), which is located in the cabinet 1 and is connected to the food storage container assembly 3. The vacuum device is configured to vacuum the food storage container assembly 3.

[0090] When the refrigerator 100 of this application is equipped with a food preservation container assembly 3 in the storage compartment 1a, considering the food preservation effect of the food preservation container assembly 3, it is necessary not only to create a low-temperature environment, but also a relatively low-pressure and low-oxygen environment to inhibit the growth of microorganisms and the rate of decomposition of organic matter. To this end, this application adopts a semiconductor cooling structure 33 to effectively cool the food preservation container body 31, and a vacuum device is installed in the cabinet 1. The vacuum device is connected to the food preservation container assembly 3 to create a vacuum, thereby creating a low-temperature, low-pressure, and low-oxygen environment, which is beneficial to improving the food preservation effect of the food preservation container assembly 3.

[0091] Please see Figure 8 In some embodiments, at least one side surface of the food storage container 31 is provided with reinforcing ribs 311.

[0092] This application also considers that after the interior of the food storage container assembly 3 is vacuumed, the pressure difference between the inner and outer surfaces of the food storage container body 31 may cause the food storage container body 31 to be subjected to excessive pressure and thus be damaged. In response, this application provides reinforcing ribs 311 on the surface of the food storage container body 31 to improve the structural strength of the food storage container body 31 and prevent the food storage container body 31 from being damaged after vacuuming is completed.

[0093] Please see Figure 8 In some embodiments, the reinforcing ribs 311 include a plurality of reinforcing ribs 311, which are staggered on each surface of the food storage container 31 so that the reinforcing ribs 311 are constructed in a grid shape. The grid-shaped reinforcing ribs 311 form mounting positions 31b on one surface of the food storage container 31, and the semiconductor cooling structure 33 is located at the mounting position 31b to be disposed on the surface of the food storage container 31.

[0094] To enhance the strength of the food storage container 31, this application uses a grid of interlaced reinforcing ribs 311 covering the surface of the container 31. This significantly strengthens the structural integrity of the container 31. However, this prevents the cooling element 332 of the semiconductor cooling structure 33 from directly connecting to the surface of the container 31 for direct cooling. To address this, this application provides mounting positions 31b on the grid-like surface of the container 31; these mounting positions 31b do not have reinforcing ribs 311, allowing the cooling element 332 to directly connect to the surface of the container 31. This not only improves the cooling effect of the cooling element 332 on the container 31 but also enhances its cooling efficiency.

[0095] Moreover, the recessed mounting position 31b of the reinforcing rib 311 can position and install the cooling component 332, and the supporting ribs around the mounting position 31b can hold the cooling component 332 in place, preventing the cooling component 332 from coming out of the mounting position 31b. This improves the ease of assembly of the cooling component 332 while also enhancing the installation stability of the cooling component 332.

[0096] Please see Figure 9 as well as Figure 10 In some embodiments, the cold end 332a of the cooling element 332 is disposed on the side of the reinforcing rib 311 facing away from the food storage container 31. The semiconductor cooling structure 33 includes a second heat-conducting element 333, which is located between the cooled element 332 and the food storage container 31. The second heat-conducting element 333 is configured to connect the cold end 332a of the cooling element 332 and the surface of the food storage container 31 where the reinforcing rib 311 is located.

[0097] Optionally, when the cold end 332a of the refrigeration component 332 is disposed on the reinforcing rib 311, the cold end 332a of the refrigeration component 332 can be connected to the reinforcing rib 311 by means of attachment or fixing by an installation component. This application does not make specific limitations here.

[0098] In this application, the food storage container 31 has reinforcing ribs 311 on its surface. These ribs protrude from the surface of the container, causing the cooling element 332 of the semiconductor cooling structure 33 to be obstructed from connecting to the surface of the container. This prevents the cooling element 332 from effectively cooling the container, thus affecting its cooling effect. To address this, this application employs a second heat-conducting element 333. This element connects the surface of the container to the cold end 332a of the cooling element 332, allowing for temperature transfer and effective cooling of the container.

[0099] Optionally, the second heat-conducting element 333 may be a heat-conducting metal sheet, heat-conducting plastic, heat-conducting gel, etc., and this application does not make specific limitations.

[0100] Optionally, the shape of the second heat-conducting element 333 may be square, circular, elliptical, triangular or other polygonal, etc., and this application does not make specific limitations in this regard.

[0101] The refrigerator disclosed in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the refrigerator of this application and its core ideas. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A refrigerator, characterized in that, include: The container has a storage compartment; A door, rotatably connected to the housing, configured to close or open the storage compartment; Food storage container assembly, wherein the food storage container assembly is disposed in the storage compartment, the food storage container assembly comprising: A food storage container body, wherein the food storage container body has a food preservation space; A pull-out box is movably connected to the food preservation box body to open or close the food preservation space, and the pull-out box has a storage space. When the pull-out box closes the food preservation space, the storage space is connected to the food preservation space. A semiconductor cooling structure is disposed on at least one surface of the food storage container to cool the food storage container.

2. The refrigerator according to claim 1, characterized in that, The semiconductor cooling structure includes: A first heat-conducting element is attached to at least one surface of the food storage container body; A refrigeration component, wherein the cold end of the refrigeration component is disposed on the first heat-conducting component; Wherein, along the thickness direction of the first heat-conducting element, the surface area of ​​the first heat-conducting element is greater than the surface area of ​​the cold end of the cooling element.

3. The refrigerator according to claim 2, characterized in that, Along the thickness direction of the first heat-conducting component, the surface area of ​​the first heat-conducting component is S1, and the surface area of ​​the cold end of the cooling component is S2, satisfying: 0.2 < S2 / S1 < 0.

4.

4. The refrigerator according to claim 2, characterized in that, Along the thickness direction of the first heat-conducting component, the surface area of ​​the first heat-conducting component is S1, and the surface area of ​​the side surface of the food storage box body that is attached to the first heat-conducting component is S3, satisfying: 0.15 < S1 / S3 < 0.

45.

5. The refrigerator according to claim 1, characterized in that, The semiconductor cooling structure includes multiple semiconductor cooling structures, which are disposed on the same side surface of the food preservation box or dispersedly disposed on different surfaces of the food preservation box.

6. The refrigerator according to claim 1, characterized in that, The semiconductor cooling structure includes: A refrigeration component, wherein the cold end of the refrigeration component is disposed on at least one side surface of the food storage container, and the hot end of the refrigeration component is connected to the inner surface of the storage compartment.

7. The refrigerator according to any one of claims 1-6, characterized in that, The refrigerator also includes: A vacuum device is provided in the box body and is connected to the food storage container assembly. The vacuum device is configured to vacuum the food storage container assembly.

8. The refrigerator according to claim 7, characterized in that, At least one side surface of the food storage container is provided with reinforcing ribs.

9. The refrigerator according to claim 8, characterized in that, The semiconductor cooling structure includes: A refrigeration component, wherein the cold end of the refrigeration component is located on the side of the reinforcing rib away from the food storage container body; The second heat-conducting element is located between the refrigeration element and the food preservation box body. The second heat-conducting element is configured to connect the cold end of the refrigeration element with the surface of the food preservation box body where the reinforcing ribs are provided.

10. The refrigerator according to claim 8, characterized in that, The reinforcing ribs include a plurality of ribs, which are staggered on each surface of the food storage container to form a grid. The grid-shaped reinforcing ribs form mounting positions on the surface of the food storage container, and the semiconductor cooling structure is located at the mounting positions to be disposed on the surface of the food storage container.

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