An optical detection device for a chip

Abstract

The utility model provides a kind of optical detection device for chip, including optical mechanism, the optical mechanism includes cover, optical projection component and mounting seat, and the cover is set as open end in one end, and the mounting seat is suitable for with The open end sliding fit;Stop portion is provided on the mounting seat, and the stop portion is used to with The open end abutment cooperation, locking structure is provided on the optical mechanism, when The stop portion with The open end abutment cooperation, the locking structure can be with The mounting seat is pressed and set on The cover, in this way, the quick installation and disassembly of mounting seat and cover can be realized, and it is convenient to maintain and replace optical element inside.

Description

Technical Field

[0001] This application relates to the field of chip inspection technology, and further to an optical inspection device for chips. Background Technology

[0002] An integrated circuit chip (IC chip) is a chip structure that places a large number of microelectronic components (including transistors, resistors, and capacitors) onto an IC substrate. Currently, with continuous innovation in chip technology and chip packaging technology, chip and package areas are becoming smaller, lighter, and thinner, making chip appearance increasingly difficult to inspect. As one of the core components of electronic products, chips are inevitably affected by various factors during the manufacturing process, potentially resulting in various appearance defects. These defects may include surface cracks, dust, scratches, oxidation, pin misalignment, and incomplete packaging. If these defects are not detected and addressed in a timely manner, they may lead to malfunctions or even failures in electronic products during use.

[0003] Currently, surface defect detection is mainly performed using chip inspection devices. These devices utilize inspection cameras to detect defects on the chip surface. The devices are equipped with cameras to acquire images of the chip surface and optical elements to illuminate the chip under test. However, traditional inspection devices are limited by their own structure and the position of the chip under test, making internal disassembly, maintenance, and replacement of optical elements inconvenient and affecting inspection efficiency.

[0004] A search revealed that Chinese utility model CN212159597U discloses a chip taping pin size and appearance inspection module, including a frame, a reflective device mounted on the frame, and a camera. The reflective device consists of a mounting bracket, a light source plate, a light source mounting plate, a reflective plate, and four prisms. The upper end of the mounting bracket has a prism mounting plate with openings, and the four prisms are arranged around the openings and below the prism mounting plate. Although this patent has a prism mounting plate at the upper end of the mounting bracket for mounting the four prisms, it does not address how to detachably mount the prism mounting plate on the mounting bracket, resulting in difficulties in quickly replacing optical components and disassembling for maintenance.

[0005] Therefore, this utility model aims to provide an optical inspection device for chips to solve the above-mentioned technical problems. Utility Model Content

[0006] To address the aforementioned technical problems, the purpose of this application is to provide an optical inspection device for chips, which aims to detachably mount the mounting base onto the housing through the cooperation of a mounting base, a housing, and a locking structure, facilitating internal disassembly and maintenance, and replacement of optical components, thereby effectively improving the chip inspection efficiency.

[0007] To achieve the above objectives, this application provides an optical inspection device for a chip, including an optical mechanism. The optical mechanism includes a housing, an optical projection component, and a mounting base. One end of the housing is configured as an open end, and the mounting base is adapted to slide and engage with the open end. A stop portion is provided on the mounting base for abutting and engaging with the open end. The optical mechanism is provided with a locking structure. When the stop part abuts against the opening end, the locking structure can press the mounting seat onto the cover.

[0008] In some embodiments, the locking structure includes a fastener disposed on the mounting base and a connection hole formed on the housing, the connection hole being for engaging with the fastener to connect the fastener to the housing.

[0009] In some embodiments, the stop is disposed at one end of the mounting base and is located in the direction of movement of the mounting base, and the open end is provided with an abutment portion for abutting against the stop, thereby limiting the mounting base on the cover.

[0010] In some embodiments, a guide portion is provided at the end of the mounting base away from the stop portion, the guide portion being used to slide and limit the opening end so that the mounting base can move on the cover.

[0011] In some embodiments, the abutting portion is provided with a positioning pin, and the stop portion is provided with a notch or groove that mates with the positioning pin; The notch is provided along the moving direction of the mounting base. When the stop part abuts against the open end, the positioning pin is located in the notch.

[0012] In some embodiments, the fastener includes a threaded rod and an extension arm disposed on the mounting base, the threaded rod being disposed on the extension arm and threadedly connected to the extension arm, and the connection hole having an internal thread that matches the threaded rod.

[0013] In some embodiments, a pickup mechanism and a reflector are also included, and the mounting base is provided with a chip entry channel to form a detection station; The picking mechanism is used to pick up the chip and send it into the chip entry channel. The reflector is disposed on the picking mechanism and is disposed corresponding to the detection station.

[0014] In some embodiments, the optical projection assembly includes a plurality of side reflectors and a plurality of first light source modules, and the mounting base is provided with a mounting groove on the side away from the housing, wherein the first light source modules are detachably mounted in the mounting groove; The first light source module is positioned toward the reflector and is used to emit imaging light toward the reflector so that the reflector can reflect the imaging light into the chip entry channel. Several side reflectors are evenly distributed on the inner wall of the chip entry channel and are used to reflect the imaging light reflected from the periphery of the chip to the imaging mechanism.

[0015] In some embodiments, the housing is further provided with a second light source module, a diffuser plate and a beam splitter, wherein the second light source module is configured corresponding to the detection station and is used to generate imaging light; The diffuser plate and the beam splitter are sequentially arranged on the side of the second light source module near the mounting base, and the beam splitter is set at a preset angle to the second light source module to reflect the imaging light reflected from the bottom and periphery of the chip to the imaging mechanism.

[0016] In some embodiments, a base is also included for supporting the optical mechanism and the imaging mechanism, and the imaging mechanism is adapted to move on the base to adjust the distance between itself and the optical mechanism.

[0017] Compared with the prior art, the optical inspection device for chips provided in this application has the following advantages: 1. This utility model provides an optical inspection device for chips, in which an optical projection component is mounted on a mounting base. The mounting base is detachably mounted on the mounting base. During installation, the mounting base moves along the housing and abuts against the housing under the action of the stop part, achieving initial positioning of the mounting base. Under the action of the locking structure, the mounting base is connected and fixed to the housing. During disassembly, it is only necessary to release the locking action of the locking structure, and the mounting base can be moved and removed from the housing. The operation is very convenient. While facilitating internal disassembly and maintenance, it also allows users to replace the mounting base according to different needs, achieving the purpose of replacing optical components, thereby effectively improving chip inspection efficiency.

[0018] 2. The optical inspection device for chips provided by this utility model has a guide part that is used to slide and limit the opening end when installing and disassembling the mounting base, so as to play a restraining role when the mounting base moves and ensure the stability of the mounting base when it moves on the cover.

[0019] 3. The optical inspection device for chips provided by this utility model allows the positioning pin to move into the notch when the mounting base and the cover move relative to each other, thereby further positioning the mounting base in the direction perpendicular to the movement of the mounting base, which facilitates the subsequent fixing of the mounting base to the cover by the locking structure.

[0020] 4. The present invention provides an optical inspection device for chips, which allows users to quickly install and remove the mounting base and the cover simply by rotating the threaded rod.

[0021] 5. The optical inspection device for chips provided by this utility model can effectively improve the contrast of the image under the action of the reflector and the optical projection component, and produce a clear outline of the chip appearance, that is, to obtain an image with a bright background and a dark chip itself, thereby effectively improving the inspection accuracy, especially the ability to detect chip burrs and excess adhesive. Moreover, it can image the bottom surface and four sides of the chip without multiple adjustments to the inspection equipment during the inspection, realizing multi-angle inspection of the chip. Attached Figure Description

[0022] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of this application.

[0023] Figure 1 This is a schematic diagram of the structure of an optical inspection device for chips provided by this utility model; Figure 2 This is a schematic diagram of the internal structure of an optical inspection device for chips provided by this utility model; Figure 3 This is a schematic diagram of the structure of a mounting base provided by this utility model; Figure 4 This is a schematic diagram of the structure of a cover provided by this utility model; Figure 5 This is a schematic diagram of the structure of a picking mechanism provided by this utility model.

[0024] Explanation of icon numbers: 1. Optical mechanism; 11. Housing; 111. Open end; 112. Connecting hole; 113. Abutment part; 114. Positioning pin; 115. Second light source module; 116. Diffuser; 117. Beam splitter; 12. Optical projection assembly; 121. Side reflector; 122. First light source module; 13. Mounting base; 131. Stop part; 132. Guide part; 133. Mounting groove; 134. Inspection station; 135. Notch groove; 14. Locking structure; 141. Threaded rod; 142. Extending arm; 2. Imaging mechanism; 21. Camera; 22. Slider; 231. First part; 232. Second part; 3. Pickup mechanism; 31. Reflector; 32. Nozzle; 33. Chip; 4. Base. Detailed Implementation

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the specific implementation methods of this application will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort.

[0026] To keep the drawings concise, each drawing only schematically shows the parts relevant to the application; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" can mean not only "only one" but also "more than one."

[0027] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0028] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0030] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] In this embodiment, an optical inspection device for a chip is described. It is designed to allow the mounting base 13 to be detachably mounted on the housing 11 through the cooperation of the mounting base 13, the housing 11, and the locking structure 14. This facilitates internal maintenance and repair, and also allows the user to easily replace the mounting base 13 as needed to replace optical components.

[0032] Understandably, with the continuous development of science and technology, the application of chips in various industries is becoming increasingly diverse. As a result, higher requirements are being placed on the quality of chips. Currently, the surface of chips is mainly inspected using inspection cameras. In order to improve the appearance inspection effect of chips, it is often necessary to set up a variety of optical components to assist in chip inspection. However, due to the limitations of the existing structural position relationship, the flexibility of the inspection device is not high, which makes internal disassembly and maintenance, as well as the replacement of optical components, inconvenient.

[0033] In contrast, this utility model provides an optical inspection device for chips, see the accompanying drawings. Figures 1 to 5 The detection device includes an imaging mechanism 2 and an optical mechanism 1. The optical mechanism 1 includes a housing 11, an optical projection assembly 12, and a mounting base 13. One end of the housing 11 is configured as an open end 111, and the mounting base 13 is used to slide and engage with the open end 111, thereby opening or closing the open end 111. Correspondingly, a stop 131 is provided on the mounting base 13. The stop 131 is used to abut against the open end 111 when the mounting base 13 moves on the housing 11, so as to limit the mounting base 13 on the housing 11. That is, when the mounting base 13 is slidably mounted on the housing 11, the stop 131 and the open end 111 limit the mounting base 13, preventing the mounting base 13 from sliding further off the housing 11.

[0034] In addition, the optical projection component 12 is mounted on the mounting base 13, which has a detection station 134. During detection, the chip is placed on the detection station 134, and the optical projection component 12 provides imaging light to the chip. Therefore, in actual production applications, different types of optical projection components 12 can be installed on different mounting bases 13 according to different needs, and different optical components (optical projection components 12) can be replaced by changing the mounting base 13.

[0035] Accordingly, the imaging mechanism 2 is able to receive light from the optical mechanism 1 and perform imaging. Accordingly, a locking structure 14 is provided on the optical mechanism 1. When the mounting base 13 abuts against the opening end 111 via the stop part 131, the mounting base 13 and the cover 11 can be connected by the locking structure 14, thereby fixing the mounting base 13 to the cover 11.

[0036] In one embodiment, see the appendix to the specification. Figure 1 and Figure 5 This embodiment further describes the optical inspection device for chips. The inspection device also includes a pickup mechanism 3, which is used to pick up the chip to be inspected and transport the chip to the inspection station 134.

[0037] Generally, in actual production applications, the pickup mechanism 3 can be set as a suction nozzle 32, or it can be set as other types of structures with clamping and adsorption functions. No limitation is made here, and all are within the protection scope of this utility model. In addition, a chip entry channel is provided on the mounting base 13 to form a detection station 134. During detection, the chip enters the chip entry channel under the action of the pickup mechanism 3 to complete the detection.

[0038] In one embodiment, see the accompanying drawings. Figure 1 , Figures 3 to 5 An abutment portion 113 is provided on the opening end 111 to cooperate with the stop portion 131. The stop portion 131 is provided at one end of the mounting base 13 and is located in the direction of movement of the mounting base 13 relative to the cover 11. As the mounting base 13 moves relative to the cover 11, the stop portion 131 can abut against the abutment portion 113, thereby limiting the mounting base 13 on the cover 11, preventing the mounting base 13 from moving further and avoiding the mounting base 13 from falling off.

[0039] Further, see the appendix to the instruction manual. Figure 3When the mounting base 13 moves on the cover 11, in order to ensure the stability of the mounting base 13 during movement and improve the efficiency of installation and removal of the mounting base 13, a guide portion 132 is provided at the end of the mounting base 13 away from the stop portion 131. The guide portion 132 is located on the side of the mounting base 13 closer to the cover 11 and is used to slide and limit the opening end 111, reducing the possibility of the mounting base 13 falling off during movement. When the mounting base 13 is installed on the cover 11, the guide portion 132 first slides and limits the opening end 111.

[0040] It should be noted that in this embodiment, the guide part 132 is set as a limiting block on the mounting base 13. The limiting block matches the opening end 111 and is located inside the opening end 111. When the mounting base 13 moves relative to the cover 11, the limiting block slides and limits the inner sidewall of the opening end 111 to ensure that the mounting base 13 can move stably and reliably and is not easy to fall off.

[0041] Understandably, please refer to the instruction manual appendix. Figure 3 A protrusion is provided on the lower end face of the mounting base 13 to form a stop portion 131. A step is provided on the open end 111 to cooperate with the protrusion and form an abutment portion 113. As the mounting base 13 moves continuously, the protrusion can abut against the step to prevent the mounting base 13 from moving and falling off. In addition, the limiting block is set to be slightly smaller than the size of the open end 111 to further reduce the possibility of the mounting base 13 shaking. The guide portion 132 can also be set to other structures, such as a sliding channel provided on the mounting base 13, so that the mounting base 13 can be movably mounted on the cover 11 through the sliding channel. These are not described in detail here, but are all within the protection scope of this utility model.

[0042] Furthermore, to ensure the stability of the mounting base 13 when the stop portion 131 abuts against the opening end 11, see the appendix to the instruction manual. Figure 1 A positioning pin 114 is also provided on the opening end 111. The positioning pin 114 is provided on the step surface of the abutment part 113 (step). A notch groove 135 that cooperates with the positioning pin 114 is provided on the stop part 131 (protrusion). The notch groove 135 is provided along the moving direction of the mounting base 13, and the notch of the notch groove 135 is opened on the side wall of the stop part 131 so that when the mounting base 13 moves relative to the cover 11, the positioning pin 114 passes through the notch and is placed in the notch groove 135. It is limited by the inner side wall of the notch groove 135, further reducing the possibility of the mounting base 13 shaking. That is, it plays a further positioning role for the mounting base 13 in the moving direction perpendicular to the mounting base 13, so that the mounting base 13 can be fixed to the cover 11 by the locking structure 14 later.

[0043] In one embodiment, see the accompanying drawings. Figure 1and Figure 3 This embodiment further describes the locking structure 14. The locking structure 14 includes a fastener and a connecting hole 112. The fastener is disposed on the stop portion 131 of the mounting base 13, and the connecting hole 112 is formed on the abutment portion 113 of the cover 11 for cooperating with the fastener, so that the fastener is connected to the cover 11 through the connecting hole 112, thereby fixing the mounting base 13 to the cover 11.

[0044] Specifically, the fastener includes a threaded rod 141 and an extended arm 142. One end of the threaded rod 141 is threadedly connected to one end of the extended arm 142, and the other end of the extended arm 142 is fixed to one end of the mounting base 13 where a stop portion 131 is provided. Correspondingly, a connecting hole 112 is provided at the part of the open end 111 where an abutment portion 113 is provided, and an internal thread matching the threaded rod 141 is provided inside the connecting hole 112. It can be understood that when the mounting base 13 moves to the point where the stop portion 131 abuts against the abutment portion 113, the threaded rod 141 is correspondingly set with the connecting hole 112. That is, the mounting base 13 and the cover 11 can be fixedly connected by rotating the threaded rod 141 to the connecting hole 112.

[0045] Alternatively, the fasteners can be configured as an extension arm 142 and a pin, which can be movably inserted into one end of the extension arm 142 and, through an interference fit with the connection hole 112, achieve a fixed connection between the mounting base 13 and the cover 11.

[0046] Therefore, in this embodiment, during installation, it is only necessary to move the mounting base 13 along the cover 11. When the stop portion 131 abuts and limits the engagement with the opening end 111, it is then connected to the connecting hole 112 via fasteners to achieve the installation of the mounting base 13. During disassembly, it is only necessary to release the connection between the fasteners and the connecting hole 112 and move the mounting base 13 to remove it from the cover 11. During this process, the mounting base 13 moves along the cover 11 without being affected by the picking mechanism 3, making the operation very convenient.

[0047] In one embodiment, see the appendix to the specification. Figure 5 This embodiment further describes an optical inspection device for chips. A reflector 31 is provided on the pickup mechanism 3 and is correspondingly positioned to the inspection station 134.

[0048] Furthermore, the optical projection module 12 also includes several side reflectors 121 and several first light source modules 122. On the side of the mounting base 13 away from the cover 11, there is a mounting groove 133 that corresponds to each of the several first light source modules 122. The several first light source modules 122 are detachably mounted in the mounting groove 133 to generate imaging light and are positioned towards the reflector 31, so that after the light is incident on the reflector 31, it can be incident on the chip and enter the channel under the reflection of the reflector 31.

[0049] Several first light source modules 122 are evenly distributed on the inner wall of the detection station 134, that is, on the inner wall of the chip entry channel. The imaging light generated by the first light source module 122 is reflected by the reflector 31 and enters the chip entry channel, so that part of the imaging light is emitted to the peripheral side of the chip 33. The light received by the peripheral side of the chip 33 is then reflected onto the side reflector 121, and then the imaging light is reflected to the imaging mechanism 2.

[0050] It is understood that in this embodiment, the first light source module 122 and the side reflector 121 are mounted on the mounting base 13, which makes it convenient for users to replace optical components without having to mount the light source on the pickup mechanism 3, resulting in a more reasonable structural design.

[0051] Generally speaking, the reflector 31 can be made of various materials, such as metal, acrylic and other white reflective materials, or a spray-on scattering coating can be applied to the reflector 31 to further enhance the reflective effect of the reflector 31.

[0052] In this embodiment, two first light source modules 122 are provided, symmetrically arranged on both sides of the pickup mechanism 3, and four side reflectors 121 are provided. It should be noted that the first light source modules 122 are mounted on the mounting base 13 via mounting grooves 133, eliminating the need to mount the light source on the pickup mechanism 3. Correspondingly, the cross-section of the mounting groove 133 is an inverted trapezoid, and the first light source modules 122 are mounted on the sloping sidewalls of the mounting groove 133. The first light source module 122 can be configured as a powered LED lamp. The first light source module 122 can be magnetically attached to the mounting groove 133; that is, magnetic components capable of mutual attraction are provided on the outer shell of the first light source module 122 and the mounting groove 133, or threaded holes are provided on both the mounting groove 133 and the first light source module 122, allowing the first light source module 122 to be detachably mounted on the mounting base 13 using bolts.

[0053] Furthermore, the housing 11 also houses a second light source module 115, a diffuser plate 116, and a beam splitter 117. The second light source module 115 is correspondingly positioned with the detection station 134 and is also used to generate imaging light. Accordingly, the diffuser plate 116 and the beam splitter 117 are sequentially positioned on the side of the second light source module 115 closest to the mounting base 13, and the beam splitter 117 is set at a preset angle to the second light source module 115. The second light source module 115 generates imaging light, which passes through the diffuser plate 116 and the beam splitter 117 to illuminate the chip entry channel and the bottom surface of the chip 33. The beam splitter 117 reflects the light reflected from the bottom surface of the chip 33 and the light reflected from the periphery of the chip 33 to the imaging mechanism 2, thereby generating a detection image. The preset angle between the beam splitter 117 and the second light source module 115 can be set according to actual needs.

[0054] In one embodiment, an optical inspection device for a chip further includes a base 4 for supporting an optical mechanism 1 and an imaging mechanism 2. The imaging mechanism 2 includes a camera 21, a support base, and a slider 22. The slider 22 is movably mounted on the base 4. The support base includes a first part 231 and a second part 232. The second part 232 is fixedly mounted on the slider 22. The first part 231 is vertically disposed on the side of the second part 232 away from the slider 22. A threaded hole is provided on one side of the camera. Threaded holes are also provided on both the first part 231 and the second part 232. During installation, the camera 21 can be connected to the first part 231 or the second part 232 by bolt threads, thereby mounting the camera 21 on the support base for adjusting the distance between the camera 21 and the optical mechanism 1.

[0055] It should be noted that the above embodiments can be freely combined as needed. The above are only preferred embodiments of this application. It should be pointed out that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. An optical inspection device for a chip, comprising an optical mechanism (1), said optical mechanism (1) including a housing (11), an optical projection assembly (12), and a mounting base (13), characterized in that, One end of the cover (11) is configured as an open end (111), and the mounting base (13) is adapted to slide with the open end (111); the mounting base (13) is provided with a stop (131), and the stop (131) is used to abut with the open end (111). The optical mechanism (1) is provided with a locking structure (14). When the stop part (131) abuts against the opening end (111), the locking structure (14) can press the mounting base (13) onto the cover (11).

2. The optical inspection device for chips according to claim 1, characterized in that, The locking structure (14) includes a fastener disposed on the mounting base (13) and a connection hole (112) opened on the cover (11), the connection hole (112) being used to cooperate with the fastener so that the fastener can be connected to the cover (11).

3. The optical inspection device for a chip according to claim 2, characterized in that, The stop (131) is disposed at one end of the mounting base (13) and is located in the moving direction of the mounting base (13). The opening end (111) is provided with an abutment (113) for abutting against the stop (131) and thereby limiting the mounting base (13) on the cover (11).

4. The optical inspection device for a chip according to claim 3, characterized in that, The mounting base (13) is provided with a guide portion (132) at one end away from the stop portion (131). The guide portion (132) is used to slide and limit the opening end (111) so that the mounting base (13) can move on the cover (11).

5. The optical inspection device for a chip according to claim 4, characterized in that, The abutting part (113) is provided with a positioning pin (114), and the stop part (131) is provided with a notch (135) that cooperates with the positioning pin (114). The notch (135) is provided along the moving direction of the mounting base (13). When the stop (131) abuts against the opening end (111), the positioning pin (114) is located in the notch (135).

6. The optical inspection device for a chip according to claim 2, characterized in that, The fastener includes a threaded rod (141) and an extension arm (142) disposed on the mounting base. The threaded rod (141) is disposed on the extension arm (142) and threadedly connected to the extension arm (142). The connecting hole (112) is provided with an internal thread that matches the threaded rod (141).

7. An optical inspection device for a chip according to any one of claims 1-6, characterized in that, It also includes a pickup mechanism (3) and a reflector (31), and the mounting base (13) is provided with a chip entry channel to form a detection station (134). The picking mechanism (3) is used to pick up the chip (33) and send the chip (33) into the chip entry channel. The reflector (31) is set on the picking mechanism (3) and is set in correspondence with the detection station (134).

8. The optical inspection device for a chip according to claim 7, characterized in that, The optical projection assembly (12) includes a plurality of side reflectors (121) and a plurality of first light source modules (122). The mounting base (13) has a mounting groove (133) on the side away from the cover. The first light source modules (122) are detachably mounted in the mounting groove (133). The first light source module (122) is positioned facing the reflector and is used to emit imaging light to the reflector (31) so that the reflector (31) can reflect the imaging light into the chip entry channel. Several side reflectors (121) are evenly distributed on the inner wall of the chip entry channel and are used to reflect the imaging light reflected from the periphery of the chip (33) to the imaging mechanism (2).

9. An optical inspection device for a chip according to claim 8, characterized in that, The housing (11) is also provided with a second light source module (115), a diffuser plate (116) and a beam splitter (117). The second light source module (115) is provided in correspondence with the detection station (134) and is used to generate imaging light. The diffuser plate (116) and the beam splitter (117) are sequentially arranged on the side of the second light source module (115) near the mounting base (13), and the beam splitter (117) is set at a preset angle to the second light source module (115) to reflect the imaging light reflected from the bottom surface and periphery of the chip (33) to the imaging mechanism (2).

10. The optical inspection device for a chip according to claim 9, characterized in that, It also includes a base (4) for supporting the optical mechanism (1) and the imaging mechanism (2), and the imaging mechanism (2) is adapted to move on the base (4) to adjust the distance between itself and the optical mechanism (1).

Images