Miniaturized low-power data acquisition device

Abstract

The utility model discloses a novel small -size low -power data acquisition device. The device includes collection box casing, circuit board subassembly and power supply subassembly. Collection box casing is composed of frame body, upper cover and lower cover, and each joint surface is equipped with waterproof rubber ring;Circuit board subassembly includes MCU microcontroller, interface switching module that is composed of multiple groups MOS switch, 485 module, TTL interface module, vibration string module and 4G wireless communication module, and the output end of each group MOS switch converges to multifunctional interface hole;Power supply subassembly includes photovoltaic board, lithium cell and power module. The utility model overcomes the single interface of prior art acquisition equipment, the higher power consumption, the shortcoming of insufficient waterproof performance, realizes interface time sharing multiplexing through MOS switch array, and standby power consumption reduces 1-2 orders of magnitude;Integrate multiple interfaces in single physical interface, realize one machine multi -purpose;Built -in photovoltaic power supply system realizes energy self -sufficiency;Waterproof grade can reach IP65 above, and is applicable to field unattended scene.

Description

Technical Field

[0001] This utility model relates to the field of data acquisition technology, specifically to a miniaturized, low-power data acquisition device suitable for field environments such as slope safety monitoring, water conservancy project monitoring, and geological disaster early warning. Background Technology

[0002] With the rapid development of infrastructure construction in my country, slope safety monitoring has received increasing attention. Currently, more and more monitoring equipment is being used in slope safety monitoring, such as deep inclinometers, piezometers, rain gauges, displacement gauges, and stress gauges. These monitoring devices typically share the following characteristics: low power consumption, collecting data once per hour, with each data collection session lasting approximately one minute, and remaining in sleep mode the rest of the time; overall average power consumption is controlled at the milliwatt level. However, due to the lack of built-in mobile communication modules, external DTU (Data Transmission Unit) and other devices are required for data transmission. In practical applications, these monitoring devices usually require additional power supply and transmission equipment such as photovoltaic panels, batteries, and DTUs, and a fixed support frame needs to be installed for this system, thus increasing equipment and construction costs. Statistics show that the cost of supporting equipment and installation often accounts for more than 40% of the total cost of the monitoring system.

[0003] To address the aforementioned issues, several improvements have emerged in existing technologies. For instance, Chinese patent CN211375364U discloses a multi-channel, multi-type analog sensor access circuit. This circuit employs two ADG1408 multiplexer chips as a multi-channel selection switch and a signal conditioning circuit selection switch, respectively. Sensor channel numbers and types are configured via host computer software, enabling time-division switching and acquisition of various analog sensors. This solution replaces traditional relays with multiplexer chips, effectively reducing circuit complexity and power consumption, and improving system reliability. However, this solution is only designed for analog sensors and is incompatible with monitoring devices using digital interfaces (such as RS485 and TTL). Furthermore, it requires host computer configuration and cannot achieve remote automatic identification and switching, limiting its application in unattended slope monitoring scenarios. Additionally, the multiplexer chip has a limited current throughput, making it difficult to meet the demands of high-current signal transmission.

[0004] In recent years, miniaturized portable data acquisition devices with integrated photovoltaic panels and batteries have emerged on the market, offering both power supply and data transmission capabilities. They are easy to install and deploy quickly. However, due to their small size and limited external interfaces, these devices typically only connect to one type of monitoring equipment and cannot simultaneously support multiple sensors with different interface types. When multiple types of sensors need to be deployed at the monitoring site, multiple acquisition devices are still required, increasing equipment and management costs. Furthermore, existing miniaturized acquisition devices generally suffer from insufficient waterproofing and poor interface sealing, making them prone to malfunction in harsh outdoor environments.

[0005] Therefore, how to design a data acquisition device that is compact, low in power consumption, highly compatible with interfaces, and waterproof and reliable has become a technical problem that urgently needs to be solved in this field. Utility Model Content

[0006] The purpose of this invention is to overcome the shortcomings of the prior art and provide a miniaturized, low-power data acquisition device to solve the problems of existing acquisition devices having single interfaces, high power consumption, and insufficient waterproof performance. Specifically, this invention aims to: provide a data acquisition device integrating multiple interface types; reduce system power consumption by using a MOS switch array to achieve time-division multiplexing of interfaces; and construct an integrated power supply system to achieve energy self-sufficiency for the device.

[0007] The purpose of this utility model is achieved through the following technical measures: a miniaturized, low-power data acquisition device, including an acquisition box housing, a circuit board assembly, and a power supply assembly; the acquisition box housing provides housing and protection space for the circuit board assembly and the power supply assembly; the power supply assembly provides operating power to the circuit board assembly; the circuit board assembly achieves external signal connection through a multi-functional interface hole on the housing.

[0008] The collection box housing includes a frame and a matching upper cover and lower cover. The side of the frame is provided with a power switch hole and a multi-functional interface hole. Waterproof rubber rings are provided between the upper cover and the frame and between the lower cover and the frame.

[0009] The circuit board assembly is located inside the acquisition box housing and includes a circuit board and an MCU microcontroller, an interface switching module, multiple interface modules and a wireless communication module mounted on the circuit board. The interface switching module includes multiple sets of MOS switches, each set of MOS switches is connected to a corresponding interface module, the control terminal of each set of MOS switches is connected to the MCU microcontroller, and the output terminals of each set of MOS switches converge to the multi-functional interface hole.

[0010] The power supply components include a photovoltaic panel disposed on the outer surface of the top cover and a battery and a power module disposed inside the housing of the acquisition box. The power module is connected to the photovoltaic panel, the battery and the circuit board respectively.

[0011] In the above technical solution, the multiple interface modules include a 485 module, a TTL interface module, and a vibrating string module. The interface switching module includes three sets of MOS switches, which are respectively connected to the 485 module, the TTL interface module, and the vibrating string module.

[0012] In the above technical solution, each of the three groups of MOS switches includes four MOS transistors connected in parallel, and the gates of the four MOS transistors are connected to the same GPIO port of the MCU microcontroller.

[0013] In the above technical solution, the wireless communication module is a 4G module, and the 4G module is connected to the MCU microcontroller.

[0014] In the above technical solution, the power module includes a charging management circuit and a voltage regulator output circuit. The charging management circuit is connected between the photovoltaic panel and the battery. The input terminal of the voltage regulator output circuit is connected to the battery, and the output terminal is connected to the circuit board and output to the outside through a multi-functional interface hole.

[0015] In the above technical solution, the photovoltaic panel is a monocrystalline silicon photovoltaic panel, which is attached to the outer surface of the upper cover; the battery is a lithium battery, which is disposed between the circuit board and the lower cover.

[0016] In the above technical solution, the frame, the upper cover and the lower cover are all integrally injection molded from engineering plastics, and the joint surfaces of the frame and the upper cover as well as the joint surfaces of the frame and the lower cover are provided with annular grooves for accommodating waterproof rubber rings.

[0017] In the above technical solution, the circuit board is fixed to the support column inside the frame by screws, and a heat dissipation gap is left between the circuit board and the inner wall of the frame.

[0018] In the above technical solution, the multi-functional interface hole is provided with an aviation socket, and the pins of the aviation socket are electrically connected to the output terminals of each group of MOS switches.

[0019] In the above technical solution, the battery is fixed to the inside of the lower cover by the battery compartment, and an insulating partition is provided between the battery compartment and the circuit board.

[0020] The miniaturized, low-power data acquisition device provided by this utility model organically integrates the acquisition box housing, circuit board assembly, and power supply assembly through a scientific and reasonable structural design, forming an integrated acquisition device with a compact structure, complete functions, and diverse interfaces, and has the following overall advantages: (1) Multifunctional interface integration to achieve multiple uses: By integrating the 485 interface, TTL interface and vibrating wire interface into a single external physical interface, and with the time-division multiplexing mechanism of the MOS switch array, one acquisition device can be compatible with a variety of different types of monitoring equipment. There is no need to configure different acquisition devices for different types of equipment, which significantly reduces the equipment procurement cost and the complexity of on-site management.

[0021] (2) Low power consumption design, extended battery life: MOS switches are used instead of relays to achieve interface switching. MOS switches have the characteristics of low on-resistance and fast response speed, which effectively reduces the overall power consumption of the system. With the low power operation mode of the MCU microcontroller, the device has extremely low power consumption in the sleep state and can maintain stable operation for a long time in continuous rainy weather. Because the leakage current of the MOS transistor in the off state is extremely low, usually in the microampere level, while the coil holding current of the traditional small relay is in the milliampere level, the use of MOS switch array can reduce the standby power consumption of interface switching by 1-2 orders of magnitude.

[0022] (3) Integrated power supply system to achieve energy self-sufficiency: Built-in photovoltaic panels and lithium batteries, the power module realizes efficient collection and storage management of solar energy, and can provide power to the outside through the multi-functional interface hole, so that the energy of the acquisition device and external monitoring equipment is self-sufficient and no additional external power supply equipment is required, which significantly simplifies the on-site deployment process.

[0023] (4) Reliable waterproof sealing performance: The collection box shell adopts a frame and upper and lower cover structure design. Each joint surface is equipped with waterproof rubber ring and annular groove for sealing. The waterproof rating can reach IP65 and above, which can meet the long-term use needs of harsh outdoor environments. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the miniaturized, low-power data acquisition device of this utility model; Figure 2 This is a schematic diagram of the functional modules of the circuit board assembly of the miniaturized, low-power data acquisition device of this utility model.

[0025] In the figure: 1-Frame (or acquisition box frame); 2-Waterproof rubber ring; 3-Top cover; 4-Bottom cover; 5-Power switch hole; 6-Multi-function interface hole; 7-Photovoltaic panel; 8-Circuit board; 9-Battery; 10-MCU microcontroller; 11-MOS switch (or MOS switch array); 12-485 module (or 485 communication module); 13-TTL interface module; 14-Vibrating string module (or vibrating string acquisition module); 15-4G module (or 4G wireless communication module); 16-Power module (or power management module). The modules or controllers used in this utility model are all existing commercially available products and are considered prior art. Detailed Implementation

[0026] The following detailed description of the implementation of this utility model, in conjunction with the accompanying drawings, does not constitute a limitation on this utility model, but is merely an example. Furthermore, the advantages of this utility model will become clearer and easier to understand by explaining them.

[0027] Referring to the accompanying drawings, the present invention provides a miniaturized, low-power data acquisition device, comprising an acquisition box housing, a circuit board assembly, and a power supply assembly. The acquisition box housing provides housing and protection space for the circuit board assembly and the power supply assembly. The power supply assembly provides operating power to the circuit board assembly. The circuit board assembly connects to external signals through a multi-functional interface hole 6 on the housing.

[0028] The collection box housing includes a frame 1 and an upper cover 3 and a lower cover 4 that cooperate with it. The side of the frame 1 is provided with a power switch hole 5 and a multi-functional interface hole 6. Waterproof rubber rings 2 are provided between the upper cover 3 and the frame 1 and between the lower cover 4 and the frame 1.

[0029] The circuit board assembly is located inside the acquisition box housing and includes a circuit board 8 and an MCU microcontroller 10, an interface switching module, multiple interface modules and a wireless communication module disposed on the circuit board 8. The interface switching module includes multiple sets of MOS switches 11, each set of MOS switches 11 is connected to a corresponding interface module, the control terminal of each set of MOS switches 11 is connected to the MCU microcontroller 10, and the output terminals of each set of MOS switches 11 converge to the multi-functional interface hole 6.

[0030] The power supply components include a photovoltaic panel 7 disposed on the outer surface of the upper cover 3, a battery 9 disposed inside the housing of the acquisition box, and a power module 16. The power module 16 is connected to the photovoltaic panel 7, the battery 9, and the circuit board 8, respectively.

[0031] like Figure 1 and Figure 2 As shown, by integrating the data acquisition box housing, circuit board assembly, and power supply assembly into a single structure, the data acquisition device achieves a compact structure and comprehensive functionality. Specifically: the data acquisition box housing uses a frame 1 with an upper cover 3 and a lower cover 4, providing reliable housing and protection for the internal circuit board assembly and power supply assembly; the power switch hole 5 on the side of the frame 1 facilitates user control of the device's power on / off status; the multi-functional interface hole 6 serves as a connection channel between the device and external monitoring equipment, enabling unified signal and power output; waterproof gaskets 2 are installed between the upper cover 3 and the frame 1, and between the lower cover 4 and the frame 1, ensuring the device's waterproof sealing performance in outdoor environments. This three-in-one structural design gives the device the advantages of miniaturization, high integration, and ease of installation and deployment.

[0032] The plurality of interface modules include a 485 module 12, a TTL interface module 13 and a vibrating string module 14. The interface switching module includes three sets of MOS switches 11, which are respectively connected to the 485 module 12, the TTL interface module 13 and the vibrating string module 14.

[0033] like Figure 2 As shown, by setting up three interface modules—RS485 module 12, TTL interface module 13, and vibrating wire module 14—and connecting them to three sets of MOS switches 11 respectively, the following advantages are achieved: Comprehensive interface type coverage: RS485 module 12 connects to monitoring devices using the RS485 interface protocol, such as inclinometers and piezometers; TTL interface module 13 connects to monitoring devices using TTL level signals, such as rain gauges and anemometers; and vibrating wire module 14 connects to vibrating wire sensors and collects vibrating wire frequency data. These three interface types basically cover the interface forms of commonly used monitoring devices in the slope monitoring field. Time-division multiplexing reduces costs: the three sets of MOS switches 11 enable time-division switching of the three interfaces, requiring only one external physical interface to be compatible with three different types of monitoring devices, avoiding the increased cost and waterproofing difficulties caused by setting up multiple independent interfaces.

[0034] In the three groups of MOS switches 11, each group of MOS switches includes four MOS transistors arranged in parallel, and the gates of the four MOS transistors are connected to the same GPIO port of the MCU microcontroller 10.

[0035] After powering on, the MCU microcontroller of this invention sequentially turns on each MOS switch group according to a preset cycle, and sends a probe signal to the external port or detects the port level / signal characteristics through the corresponding interface module. Based on whether there is a response signal that meets the expectation or the detected characteristics, the type of the currently connected device is determined, and then the corresponding MOS switch group and interface module are locked for communication and data acquisition.

[0036] like Figure 2 As shown, by designing each group of MOS switches as four MOS transistors connected in parallel, and connecting the gates of the four MOS transistors to the same GPIO port of the MCU microcontroller 10, the following advantages are achieved: Complete circuit control: The four MOS transistors control the on / off states of the four power supply lines (positive, negative, positive, and negative), ensuring complete isolation between signal and power supply during interface switching. Reliable synchronous switching: The gates of the four MOS transistors are connected to the same GPIO port, enabling synchronous switching control and avoiding signal interference or electrical damage caused by inconsistent switching timing. Minimal GPIO port usage: Each group of MOS switches requires only one GPIO port, and the three groups of MOS switches only require three GPIO ports to achieve independent control of the three interfaces, effectively saving port resources of the MCU microcontroller 10.

[0037] The wireless communication module is a 4G module 15, which is connected to the MCU microcontroller 10.

[0038] like Figure 2 As shown, by using a 4G module 15 as a wireless communication module and connecting it to the MCU microcontroller 10, the following advantages are achieved: Wide communication coverage; the 4G network has high coverage nationwide, meeting the communication needs of most slope monitoring sites without requiring additional communication infrastructure. Remote configuration and data transmission; the 4G module 15 can receive configuration commands from a remote server, and the MCU microcontroller 10 automatically controls the corresponding MOS switch 11 to conduct according to the commands, realizing remote automatic identification and intelligent switching of device types; simultaneously, the collected monitoring data can be uploaded to the remote server in real time, realizing remote data storage and analysis, which is particularly suitable for unattended field applications.

[0039] The power module 16 includes a charging management circuit and a voltage regulator output circuit. The charging management circuit is connected between the photovoltaic panel 7 and the battery 9. The input terminal of the voltage regulator output circuit is connected to the battery 9, and the output terminal is connected to the circuit board 8 and output to the outside through the multi-functional interface hole 6.

[0040] like Figure 2 As shown, by designing the power module 16 into two parts—a charging management circuit and a voltage regulator output circuit—it offers the following advantages: High-efficiency energy conversion: The charging management circuit, connected between the photovoltaic panel 7 and the battery 9, can employ MPPT (Maximum Power Point Tracking) charging control technology to automatically adjust the charging current according to sunlight conditions, maximizing solar energy utilization. The charging management circuit also features overcharge protection, over-discharge protection, and short-circuit protection functions, ensuring the safe use and lifespan of the battery 9. Stable power output: The input of the voltage regulator output circuit is connected to the battery 9, and its outputs power the circuit board 8 and external devices via the multi-functional interface 6, providing a stable power supply for external monitoring equipment and enabling the entire monitoring system to achieve energy self-sufficiency.

[0041] The photovoltaic panel 7 is a monocrystalline silicon photovoltaic panel, which is attached to the outer surface of the upper cover 3; the battery 9 is a lithium battery, which is disposed between the circuit board 8 and the lower cover 4.

[0042] like Figure 1As shown, the layout of using a monocrystalline silicon photovoltaic panel 7 attached to the outer surface of the upper cover 3 and the lithium battery 9 positioned between the circuit board 8 and the lower cover 4 offers the following advantages: High-efficiency energy harvesting; the monocrystalline silicon photovoltaic panel boasts a high conversion efficiency of over 18%, enabling the harvesting of more solar energy within a limited surface area; the photovoltaic panel 7 is directly attached to the outer surface of the upper cover 3, forming an integrated structure with the casing, thus fully utilizing the casing space; a rational spatial layout; the lithium battery 9 features high energy density and low self-discharge rate, and its placement within the space between the circuit board 8 and the lower cover 4 fully utilizes the internal space of the casing while lowering the device's center of gravity, improving installation stability.

[0043] The frame 1, the upper cover 3, and the lower cover 4 are all integrally injection molded from engineering plastics. The joint surfaces of the frame 1 and the upper cover 3, as well as the joint surfaces of the frame 1 and the lower cover 4, are provided with annular grooves for accommodating the waterproof rubber ring 2.

[0044] like Figure 1 As shown, by using engineering plastics for one-piece injection molding of the frame 1, upper cover 3, and lower cover 4, and setting an annular groove on the joint surface to accommodate the waterproof rubber ring 2, the following advantages are achieved: Excellent material properties: Engineering plastics such as ABS, PC, or PA66 are lightweight, high-strength, corrosion-resistant, and have good insulation properties, making them suitable for long-term use in outdoor environments. Mature manufacturing process: The one-piece injection molding process ensures the dimensional accuracy and surface quality of the shell, facilitating mass production and cost control. Reliable sealing effect: The depth and width of the annular groove match the cross-sectional dimensions of the waterproof rubber ring 2, ensuring that the waterproof rubber ring 2 can generate sufficient compressive deformation under pressure to achieve a reliable seal, enabling the device to achieve a waterproof rating of IP65 or higher.

[0045] The circuit board 8 is fixed to the support column inside the frame 1 by screws, and a heat dissipation gap is left between the circuit board 8 and the inner wall of the frame 1.

[0046] like Figure 1 As shown, the circuit board 8 is fixed to the support column inside the frame 1 using screws, with a heat dissipation gap between the circuit board 8 and the inner wall of the frame 1. This has the following advantages: Stable and reliable fixing; the screw fixing method can withstand a certain amount of vibration and impact, ensuring the installation stability of the circuit board 8 in outdoor environments. Good heat dissipation performance; the heat dissipation gap between the circuit board 8 and the inner wall of the frame 1 is not less than 3mm, ensuring that heat can be effectively dissipated in high-temperature environments, preventing performance degradation or damage to electronic components due to excessive temperature. Easy maintenance and replacement; the screw fixing method facilitates the disassembly and installation of the circuit board 8, making later maintenance and troubleshooting convenient.

[0047] The multi-functional interface hole 6 is equipped with an aviation socket, and the pins of the aviation socket are electrically connected to the output terminals of each group of MOS switches 11.

[0048] like Figure 1 and Figure 2 As shown, by installing an aviation socket within the multi-functional interface hole 6 and electrically connecting the pins of the aviation socket to the output terminals of each group of MOS switches 11, the following advantages are achieved: High connection reliability: The aviation socket possesses excellent mechanical strength and electrical contact performance, capable of withstanding multiple insertions and removals without poor contact, making it suitable for frequent connection and disconnection requirements in outdoor environments. Superior waterproof performance: The aviation socket features a built-in waterproof sealing structure with a waterproof rating of IP67, ensuring reliable waterproofing at the interface when used with the housing. Multi-functional multiplexing of a single interface: The output terminals of each group of MOS switches 11 converge to the corresponding pins of the aviation socket, achieving unified external output for both signal and power interfaces, simplifying the connection method for external devices.

[0049] The battery 9 is fixed to the inside of the lower cover 4 via a battery compartment, and an insulating partition is provided between the battery compartment and the circuit board 8.

[0050] like Figure 1 As shown, the battery 9 is fixed to the inside of the lower cover 4 via the battery compartment, and an insulating partition is installed between the battery compartment and the circuit board 8. This has the following advantages: The battery is securely fixed; the battery compartment effectively limits and fixes the battery 9, preventing displacement under vibration or impact conditions and ensuring the reliability of the electrical connection. Safety isolation and protection; the insulating partition, made of flame-retardant material, is placed between the battery compartment and the circuit board 8, providing electrical isolation and mechanical protection, preventing short circuits or mechanical collisions between the battery 9 and the circuit board 8, thus improving the safety of the device. Full space utilization; the battery 9 is placed in the space between the circuit board 8 and the lower cover 4, making full use of the internal three-dimensional space of the casing, resulting in a more compact overall structure.

[0051] The multi-functional interface hole described in this utility model can be an external interface set on the side of the frame. The TTL interface module includes multiple sets of switching circuits controlled by the MCU. Each set of switching circuits is connected to an interface module of a certain type, and the output terminal of each set of switching circuits is selectively connected to the external interface.

[0052] In summary, this utility model's miniaturized, low-power data acquisition device achieves its design goals of miniaturization, low power consumption, and multifunctionality through the organic integration of the acquisition box housing, circuit board assembly, and power supply assembly, as well as the coordinated operation of the MOS switch array time-division multiplexing mechanism and the integrated power supply system. This device features a compact structure, low power consumption, strong interface compatibility, and waterproof reliability, making it particularly suitable for unattended field applications such as slope safety monitoring, water conservancy project monitoring, and geological disaster early warning, demonstrating significant economic and social benefits.

[0053] It should be noted that the various location descriptions involved in this embodiment are only for the convenience of illustration in conjunction with the accompanying drawings and do not constitute a limitation on the actual installation location.

[0054] All other parts not described in detail are existing technologies.

Claims

1. A miniaturized, low-power data acquisition device, characterized in that, It includes a data acquisition box housing, a circuit board assembly, and a power supply assembly; the data acquisition box housing provides housing and protection space for the circuit board assembly and the power supply assembly; the power supply assembly provides operating power to the circuit board assembly; the circuit board assembly connects to external signals through a multi-functional interface hole on the housing; The collection box housing includes a frame and an upper cover and a lower cover that cooperate with it. The side of the frame is provided with a power switch hole and a multi-functional interface hole. Waterproof rubber rings are provided between the upper cover and the frame and between the lower cover and the frame. The circuit board assembly is located inside the acquisition box housing and includes a circuit board and an MCU microcontroller, an interface switching module, multiple interface modules and a wireless communication module disposed on the circuit board. The interface switching module includes multiple sets of MOS switches, each set of MOS switches is connected to a corresponding interface module, the control terminal of each set of MOS switches is connected to the MCU microcontroller, and the output terminals of each set of MOS switches converge to the multi-functional interface hole. The power supply components include a photovoltaic panel disposed on the outer surface of the top cover and a battery and a power module disposed inside the housing of the acquisition box. The power module is connected to the photovoltaic panel, the battery and the circuit board respectively.

2. The miniaturized, low-power data acquisition device according to claim 1, characterized in that, The multiple interface modules include a 485 module, a TTL interface module, and a vibrating string module. The interface switching module includes three sets of MOS switches, which are respectively connected to the 485 module, the TTL interface module, and the vibrating string module.

3. The miniaturized, low-power data acquisition device according to claim 2, characterized in that, In the three groups of MOS switches, each group of MOS switches includes four MOS transistors connected in parallel, and the gates of the four MOS transistors are connected to the same GPIO port of the MCU microcontroller.

4. The miniaturized, low-power data acquisition device according to claim 1, characterized in that, The wireless communication module is a 4G module, and the 4G module is connected to the MCU microcontroller.

5. The miniaturized, low-power data acquisition device according to claim 1, characterized in that, The power module includes a charging management circuit and a voltage regulator output circuit. The charging management circuit is connected between the photovoltaic panel and the battery. The input terminal of the voltage regulator output circuit is connected to the battery, and the output terminal is connected to the circuit board and outputs to the outside through a multi-functional interface hole.

6. The miniaturized, low-power data acquisition device according to claim 5, characterized in that, The photovoltaic panel is a monocrystalline silicon photovoltaic panel, which is attached to the outer surface of the upper cover; the battery is a lithium battery, which is disposed between the circuit board and the lower cover.

7. The miniaturized, low-power data acquisition device according to claim 1, characterized in that, The frame, upper cover, and lower cover are all integrally injection molded from engineering plastics. The joint surfaces of the frame and the upper cover, as well as the joint surfaces of the frame and the lower cover, are provided with annular grooves for accommodating waterproof rubber rings.

8. The miniaturized, low-power data acquisition device according to claim 7, characterized in that, The circuit board is fixed to the support column inside the frame by screws, and a heat dissipation gap is left between the circuit board and the inner wall of the frame.

9. The miniaturized, low-power data acquisition device according to claim 1, characterized in that, The multi-functional interface hole is equipped with an aviation socket, and the pins of the aviation socket are electrically connected to the output terminals of each group of MOS switches.

10. The miniaturized, low-power data acquisition device according to claim 6, characterized in that, The battery is fixed to the inside of the lower cover via a battery compartment, and an insulating partition is provided between the battery compartment and the circuit board.

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