A localized high-reliability ruggedized server system architecture

Abstract

The utility model discloses a kind of localization high-reliability reinforced server system architecture, it is related to server technical field, with localization processor as core, using modular integrated design, including mainboard module, power module, backplane module, expansion module, cabinet and heat dissipation module, IO module and management module, each module is detachably interconnected through standardization interface and backplane module, backplane module is as interconnected backbone to realize power distribution and signal transmission, heat dissipation system uses the mixed scheme of guide cooling and forced air cooling, IO interface is filtered with ESD protection design by EMC, management module integrates BMC to realize out-of-band accurate control and management. The core device of this architecture is localized, supports wide range of operating temperature and vibration, impact environment, suitable for vehicle, military and other harsh scenes, give consideration to high reliability, strong environmental adaptability and self-controllability.

Description

Technical Field

[0001] This invention relates to the field of server technology, and specifically to a domestically produced, highly reliable, and ruggedized server system architecture. Background Technology

[0002] The use of servers in harsh environments such as automotive, military, and industrial control is becoming increasingly widespread, placing higher demands on their reliability, environmental adaptability, and autonomous controllability. Traditional commercial servers are designed based on the constant temperature environment of data centers, and their core components are mostly commercial-grade standards. They are unable to withstand the harsh conditions of a wide operating temperature range of -20℃ to +55℃, vibration, shock, and humidity. Furthermore, their electromagnetic shielding design is weak, making them susceptible to external electromagnetic interference or electromagnetic leakage, and thus unable to meet the needs of special application scenarios.

[0003] While some existing ruggedized servers have improved environmental tolerance, they still have significant shortcomings: low system architecture integration, lack of coordinated optimization in power distribution, signal transmission, and heat dissipation design; electromagnetic compatibility design only reaches the basic shielding level, without refined treatment of critical components such as interfaces and board interconnections; unreasonable modular division, poor interface compatibility, and complex operation requiring disassembly of the entire machine for maintenance; reliance on imported core processors, chips, and other key components, posing supply chain risks and security vulnerabilities, and failing to meet the requirements of domestic self-sufficiency and controllability. These problems make it difficult for existing products to simultaneously meet the needs of high reliability, strong environmental adaptability, convenient maintenance, and domestic production, urgently requiring a targeted and optimized server system architecture to fill the technological gap. Summary of the Invention

[0004] The purpose of this invention is to provide a domestically produced, highly reliable, ruggedized server system architecture that can solve the shortcomings of traditional servers and existing ruggedized servers, such as their unsuitability for harsh environments and poor electromagnetic compatibility, and achieve a balance between high performance, high reliability, strong environmental adaptability, and convenient maintenance.

[0005] To achieve the above objectives, the present invention employs the following technical solutions.

[0006] A domestically developed, highly reliable, ruggedized server system architecture includes: Motherboard module, with onboard ECC memory and BMC chip; The power supply module is a dual-redundant power supply that supports AC220V input. The expansion module is directly interconnected with the processor of the motherboard module via the PCIe bus; The IO module integrates multiple interfaces, and all interfaces are equipped with EMC filtering and ESD protection structures. The management module is an out-of-band management system used to monitor and control the server hardware status. The backplane module is used to realize power distribution and signal interconnection between the motherboard module, power module, expansion module, I / O module and management module; The chassis and heat dissipation module include a chassis body with electromagnetic shielding function and heat dissipation components. The chassis body forms a closed installation space, and each module is integrated within the installation space. The power module, motherboard module, I / O module, and expansion module are all modularly configured. Each module is detachably connected to the backplane module through a standardized interface, forming a modular maintenance structure.

[0007] Furthermore, the motherboard module uses a Phytium S5000C-32 processor, surface-mount 128GB memory chips, and an onboard BMC chip E2000S.

[0008] Furthermore, the backplane module has one motherboard slot, two power supply slots, and at least one expansion slot. The expansion slot is compatible with the standard VPX expansion interface, and the backplane module interfaces with the motherboard module via a high-speed, high-density connector.

[0009] Furthermore, the main body of the chassis is made of AL6061 aluminum alloy, and the joints and interfaces of the structural components are sealed with hollow conductive rubber strips.

[0010] Furthermore, the heat dissipation components include: a custom heat sink that is attached to high-heat components and an independent speed-adjustable fan module. The chassis body is provided with a double-layer air duct structure for mixed heat dissipation of conductive cooling and forced air cooling.

[0011] Furthermore, the management module includes the BMC chip and BMC firmware.

[0012] Furthermore, the IO module's interfaces include a gigabit / 10-gigabit network interface, a USB interface, a VGA interface, a Type-C debugging port, and an RS232 interface, which are respectively located on the front and rear panels of the server.

[0013] The advantages of this invention are: Each module's core components meet industrial-grade or higher standards. Combined with an optimized cooling system and reinforced mechanical structure, it can operate continuously at full load within a temperature range of -20℃ to +55℃, withstand extreme storage temperatures of -50℃ to +70℃, and has passed vibration and shock tests, making it suitable for harsh environments such as automotive and military applications. The chassis employs an aluminum alloy shielding structure and a sealed design. I / O interfaces feature EMC filtering and ESD protection, effectively suppressing electromagnetic leakage and external electromagnetic interference, meeting stringent electromagnetic compatibility requirements. Each functional module is detachably connected via standardized interfaces and a backplate. Removing the front panel allows for easy maintenance of the I / O modules, and removing the heatsink allows for quick disassembly and reassembly of the motherboard, power supply, and expansion modules, significantly reducing maintenance difficulty and time costs. Redundant power supply design enhances power supply reliability, and the VPX standard expansion slot supports flexible customization. Domestically produced core components and an independently developed management system ensure the system's independent controllability and long-term stable operation. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the front panel interface and indicator lights of this utility model; Figure 3 This is a schematic diagram of the rear panel interface of this utility model; Figure 4 This is a schematic diagram of the backplate structure of this utility model. Detailed Implementation

[0015] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.

[0016] This embodiment presents a domestically produced, highly reliable, ruggedized server system architecture. Each module adopts a modular design, with the motherboard, power supply, backplane, and expansion modules interconnected via standardized interfaces. The backplane provides unified signal and power distribution and supports plug-and-play VPX expansion modules. Please refer to... Figure 1 The specific implementation details are as follows.

[0017] Motherboard Module: Utilizes a domestic Phytium S5000C-32 processor, 128GB surface-mount memory chips, and an onboard E2000S BMC chip for device management. Processors are interconnected via a high-speed C2C bus. The motherboard module features 128GB DDR4 surface-mount memory and 5-channel Gigabit Ethernet. The entire system is configured with 6 USB ports, 2 VGA ports, 4 10G Ethernet ports, and 1 RS232 port. The 4 Gigabit Ethernet ports, 2 USB ports, 1 VGA port, 1 RS232 port, and 4 10G Ethernet ports are connected via aviation connectors on the rear panel. Please refer to [reference needed]. Figure 3This enables modular, pluggable, high-density hybrid connectivity and integrated signal transmission. Four USB ports, one management network port, one service network port, and one VGA port are commercial interfaces located on the server's front panel. Please refer to [link / reference needed]. Figure 2 This facilitates testing and maintenance. The onboard BMC chip E2000S enables management functions and features a BMC management page. The management page can report the server's working status and can send relevant status information via Simple Network Management Protocol (SNMP) or from the network port. It can also periodically send self-test information, including power on / off status, availability status, core parameters, and other information.

[0018] Power Module: Employing a dual-path 1000W redundant power supply design, supporting AC220V input, and conforming to the "Power Blade Technical Requirements," the selected components meet industrial-grade standards. Through multi-level design and refined production control, it achieves multiple protections against overvoltage, undervoltage, short circuit, and overtemperature. The 1+1 redundancy structure ensures continuous power supply. A single power module can guarantee the server's operation of various business needs at room temperature.

[0019] Backplane Module: The backplane module is the interconnect backbone of the server system architecture, responsible for power and signal scheduling between all modules. Please refer to... Figure 4 The server backplane module primarily handles power supply transmission, signal interconnection, and interface output. It employs a rigid-flex PCB design, featuring one core motherboard slot, two redundant power supply slots, and one 3U VPX expansion slot. Power distribution uses 12V DC, distributing the 12V output from the power module to various functional modules. Signal types include PCIe, USB, UART, IIC, and GPIO, with high-speed, high-density connectors ensuring signal integrity. External interfaces include power connectors, network connectors, VGA display connectors, 10G network interfaces, and I / O connectors. At the signal interconnection level, the backplane interfaces with the motherboard module via high-speed, high-density connectors, ensuring the integrity of critical signal links such as PCIe. Simultaneously, the backplane, through a customized rigid-flex PCB, stably and with low loss extends and distributes multiple gigabit network, USB, VGA, Type-C debug ports, and RS232 I / O signals provided by the motherboard to the physical interfaces on the front and rear panels. This design internalizes fragile connectors and cable adapters into board-level interconnects, greatly improving connection reliability, signal quality, and overall maintainability.

[0020] Expansion Modules: Based on the 3U VPX standard, the expansion interface is designed and directly connected to the Phytium processor on the motherboard via the PCIe bus. It features low data transmission latency and high throughput. Users can customize and develop dedicated modules such as FPGA cards and GPU cards to expand functionality according to application scenarios such as radar signal processing, electronic countermeasures, and graphics computing. This allows for highly customized functional expansion and performance enhancement on a unified domestic hardware platform.

[0021] Chassis and Cooling Module: Adopting an integrated design, the chassis body is made of AL6061 aluminum alloy through precision machining. The joints of structural components and the interfaces of the front and rear panels are sealed with hollow conductive rubber strips. The cooling system adopts a hybrid cooling solution of conductive cooling and forced air cooling. High-heat components such as the CPU are cooled by a custom heatsink that is closely attached to the chassis shell. The chassis is designed with a double-layer air duct, and the rear panel is embedded with an independent speed-adjustable fan module to drive airflow to form forced convection, ensuring the cooling effect in high-temperature environments.

[0022] IO module: The front panel has 4 USB interfaces, 1 management network interface, 1 service network interface, and 1 VGA interface. The rear panel has 4 gigabit network connectors, 4 10G network connectors, 2 USB connectors, 1 VGA connector, and 1 RS232 connector. All interfaces integrate EMC filtering circuits and ESD protection devices, and the protection level meets industrial standards.

[0023] Management Module: The BMC chip uses the domestic E2000S, paired with self-developed firmware to achieve out-of-band management. Administrators can log in to the BMC management interface using a web browser through the dedicated management port on the front panel or the business network connector on the rear panel. They can monitor health parameters such as voltage, temperature, and fan speed in real time, remotely perform power on / off and reset operations, achieve remote desktop control through KVM over IP, support online firmware updates and system log queries, manually adjust fan speed and set sensor alarm thresholds, and realize real-time perception and precise control of server hardware status.

[0024] In this embodiment, all core components used in each module of the server are selected to industrial-grade or higher standards to ensure their electrical stability over a wide temperature range. The cooling system has been carefully optimized, employing high-performance fans and airflow design to achieve excellent heat dissipation performance, ensuring that the equipment can support continuous full-load operation within an operating temperature range of -20℃ to +55℃, and withstand extreme storage temperature tests from -50℃ to +70℃. The mechanical structure adopts a compact and reinforced design, with robust connections between modules. It has passed environmental tests for vibration, shock, high and low temperatures, and damp heat, enabling stable operation in harsh environments such as automotive and military applications. Furthermore, the modular design and convenient management functions significantly improve the system's maintenance efficiency and scalability.

[0025] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A domestically produced, highly reliable, ruggedized server system architecture, characterized in that: include: Motherboard module, with onboard ECC memory and BMC chip; The power supply module is a dual-redundant power supply that supports AC220V input. The expansion module is directly interconnected with the processor of the motherboard module via the PCIe bus; The IO module integrates multiple interfaces, and all interfaces are equipped with EMC filtering and ESD protection structures. The management module is an out-of-band management system used to monitor and control the server hardware status. The backplane module is used to realize power distribution and signal interconnection between the motherboard module, power module, expansion module, I / O module and management module; The chassis and heat dissipation module include a chassis body with electromagnetic shielding function and heat dissipation components. The chassis body forms a closed installation space, and each module is integrated within the installation space. The power module, motherboard module, IO module, and expansion module are all modularly configured. Each module is detachably connected to the backplane module through a standardized interface, forming a modular maintenance structure. The backplane module has one motherboard slot, two power supply slots and at least one expansion slot. The expansion slot is compatible with the standard VPX expansion interface. The backplane module connects to the motherboard module via a high-speed, high-density connector. The main body of the chassis is made of AL6061 aluminum alloy, and the joints and interfaces of the structural components are sealed with hollow conductive rubber strips. The heat dissipation components include: a custom heat sink that is attached to high-heat components and an independent speed-adjustable fan module. The chassis body is provided with a double-layer air duct structure for mixed heat dissipation of conductive cooling and forced air cooling.

2. The domestically produced high-reliability ruggedized server system architecture according to claim 1, characterized in that, The motherboard module uses a Phytium S5000C-32 processor, surface-mount 128GB memory chips, and an onboard BMC chip E2000S.

3. The domestically produced high-reliability ruggedized server system architecture according to claim 1, characterized in that, The management module includes the BMC chip and BMC firmware.

4. The domestically produced high-reliability ruggedized server system architecture according to claim 1, characterized in that, The I / O module includes a gigabit / 10-gigabit network interface, a USB interface, a VGA interface, a Type-C debugging port, and an RS232 interface, which are respectively located on the front and rear panels of the server.

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