A computing power card cooling device and a workstation comprising the same

Abstract

The utility model discloses a kind of computing power card heat dissipation device and workstation comprising it, the computing power card heat dissipation device includes fan assembly, it includes shell, fan and motor, the side of shell is equipped with first air outlet, shell is along its thickness direction from first surface transition to second surface, first surface is equipped with air inlet, second surface is equipped with second air outlet, air inlet, first air outlet and second air outlet are all communicated to the inner chamber of shell, fan and motor are installed in inner chamber;Connecting piece, its inside is provided with passageway, the both ends of passageway are connected to first air outlet and the tail end of computing power card respectively.Fan assembly adopts the architecture of centrifugal fan, when fan rotates, part of air can be thrown to computing power card by centrifugal force, complete active heat dissipation to computing power card;Since adopting centrifugal fan architecture, the appearance of fan assembly is more flat, adapt to the appearance characteristics of computing power card flat, reduce the occupation to workstation internal space.The utility model relates to computer heat dissipation technical field.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, and in particular to a heat dissipation device for a computing card and a workstation including the same. Background Technology

[0002] A workstation is a high-end general-purpose microcomputer, typically designed for single-user use and offering significantly greater performance than a personal computer, particularly in graphics processing and parallel processing. Workstations are usually equipped with large, high-resolution displays, multi-screen displays, and large amounts of internal and external memory, making them computers with extremely strong information and image processing capabilities. A computing power card, on the other hand, is a hardware expansion card installed within a workstation specifically to enhance computing power, primarily used to accelerate specific computing tasks (such as deep learning and high-performance computing). Its core function is to accelerate floating-point operations by optimizing hardware architecture (such as GPUs and FPGAs) and dedicated computing units (such as tensor cores).

[0003] Computing cards generate heat during operation, and excessively high temperatures can affect their normal operation. Therefore, appropriate heat dissipation structures are often required. Generally, workstations are equipped with full-chassis cooling systems such as air cooling or liquid cooling. Computing cards mainly rely on heat sinks, heat pipes, and other components to exchange heat with the cooling medium (such as cold air or coolant) circulating within the workstation, using passive cooling to dissipate the heat from the computing card.

[0004] However, as the functionality of computing cards gradually improves, the heat they generate also increases. Traditional passive cooling methods, limited by the surface area and thermal conductivity of the cooling structure, are no longer sufficient to meet the cooling requirements of computing cards. At the same time, due to the compact space within the workstation and the close spacing between the various computing cards on the motherboard, existing active cooling devices are prone to interference with other components inside the chassis. Utility Model Content

[0005] This utility model aims to at least solve one of the aforementioned technical problems existing in the prior art. To this end, this application proposes a computing card heat dissipation device that can actively dissipate heat from the computing card, while also having a compact structure that can be installed in existing workstations.

[0006] This application also proposes a workstation with the aforementioned computing card heat dissipation device.

[0007] The computing card heat dissipation device according to the first aspect of this application includes: A fan assembly includes a housing, a fan, and a motor. A first air outlet is provided on one side of the housing. The housing transitions from a first surface to a second surface along its thickness direction. An air inlet is provided on the first surface, and a second air outlet is provided on the second surface. The air inlet, the first air outlet, and the second air outlet are all connected to the inner cavity of the housing. The fan and the motor are installed in the inner cavity, and the motor drives the fan to rotate. The connector has a channel inside, and the two ends of the channel are respectively connected to the first air outlet and the tail end of the computing card; The fan rotation drives air into the inner cavity of the housing. Part of the air, under the centrifugal force of the fan, flows through the first air outlet to the computing card, while the other part of the air flows out through the second air outlet.

[0008] The computing card heat dissipation device according to the embodiments of this application has at least the following beneficial effects: the fan assembly adopts a centrifugal fan architecture, and when the fan rotates, some air can be thrown to the computing card by centrifugal force to complete the active heat dissipation of the computing card; due to the centrifugal fan architecture, the fan assembly is flatter in shape, which is compatible with the flat shape of the computing card and reduces the space occupied inside the workstation.

[0009] According to some embodiments of this application, the housing is a volute, and a spiral air duct is formed between the inner sidewall of the volute and the fan. The inner diameter of the spiral air duct gradually increases with the airflow direction, and the spiral air duct guides the airflow to the first air outlet.

[0010] According to some embodiments of this application, the fan is provided with a plurality of blades arranged in a circumferential array. The blades are arranged at an acute angle to the rotation axis of the fan. The blades split the air entering from the air inlet. Part of the air enters the spiral air duct under the action of centrifugal force, and the other part of the air is blown to the second air outlet by the blades.

[0011] According to some embodiments of this application, the housing and the connector are detachably connected.

[0012] According to some embodiments of this application, the connector has a connection slot, and the housing is inserted into the connection slot to achieve fixation.

[0013] According to some embodiments of this application, the connector is provided with a sliding groove, and the surface of the housing is provided with a slider that can slide into the sliding groove. The slider slides into the sliding groove to limit and fix the housing.

[0014] According to some embodiments of this application, the groove is a dovetail groove, and the slider and the dovetail groove form a dovetail tenon and mortise structure.

[0015] According to some embodiments of this application, the thickness of the housing is not greater than the thickness of the computing card.

[0016] According to some embodiments of this application, the number of computing power cards is at least two, and the computing power card heat dissipation devices on two adjacent computing power cards are respectively a first computing power card heat dissipation device and a second computing power card heat dissipation device, with the second air outlet of the first computing power card heat dissipation device facing the air inlet of the second computing power card heat dissipation device.

[0017] A workstation according to a second aspect of this application includes a motherboard and the aforementioned computing card heat dissipation device, wherein a computing card is installed on the motherboard, the computing card heat dissipation device is installed on the computing card, and the motor of the computing card heat dissipation device is electrically connected to the motherboard.

[0018] The workstation according to the embodiments of this application has at least the following beneficial effects: by configuring a computing card heat dissipation device on the computing card therein, the computing card can be actively cooled, thereby having a better heat dissipation effect than traditional heat dissipation methods, ensuring the stable operation of the computing card.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The accompanying drawings are used to provide a further understanding of the technical solutions disclosed in this application and form part of the specification. They are used together with the embodiments disclosed in this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions disclosed in this application.

[0021] Figure 1 This is a first three-dimensional view of the computing card heat dissipation device according to the first aspect of this application; Figure 2 This is a schematic diagram of the fan assembly in the heat dissipation device of the computing card according to the first aspect of this application; Figure 3 for Figure 2 Sectional view at point AA; Figure 4 This is a second three-dimensional view of the heat dissipation device for a computing card according to the first aspect of this application.

[0022] Reference numerals: 100-fan assembly, 110-housing, 111-first air outlet, 112-air inlet, 113-second air outlet, 114-spiral air duct, 120-fan, 130-motor, 200-connector, 300-computing card. Detailed Implementation

[0023] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0024] In the description of this application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0026] In the description of this application, unless otherwise expressly defined, terms such as "setup," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this application in conjunction with the specific content of the technical solution.

[0027] In the description of this application, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0028] A workstation is a high-end general-purpose microcomputer, typically designed for single-user use and offering significantly greater performance than a personal computer, particularly in graphics processing and parallel processing. Workstations are usually equipped with large, high-resolution displays, multi-screen displays, and large amounts of internal and external memory, making them computers with extremely strong information and image processing capabilities. A computing power card, on the other hand, is a hardware expansion card installed within a workstation specifically to enhance computing power, primarily used to accelerate specific computing tasks (such as deep learning and high-performance computing). Its core function is to accelerate floating-point operations by optimizing hardware architecture (such as GPUs and FPGAs) and dedicated computing units (such as tensor cores).

[0029] Computing cards generate heat during operation, and excessively high temperatures can affect their normal operation. Therefore, appropriate heat dissipation structures are often required. Generally, workstations are equipped with full-chassis cooling systems such as air cooling or liquid cooling. Computing cards mainly rely on heat sinks, heat pipes, and other components to exchange heat with the cooling medium (such as cold air or coolant) circulating within the workstation, using passive cooling to dissipate the heat from the computing card.

[0030] However, as the functionality of computing cards gradually improves, the heat they generate also increases. Traditional passive cooling methods, limited by the surface area and thermal conductivity of the cooling structure, are no longer sufficient to meet the cooling requirements of computing cards. At the same time, due to the compact space within the workstation and the close spacing between the various computing cards on the motherboard, existing active cooling devices are prone to interference with other components inside the chassis.

[0031] In response, this application proposes a computing card heat dissipation device, whose fan assembly adopts a centrifugal fan architecture. When the fan rotates, some air can be thrown to the computing card by centrifugal force to complete the active heat dissipation of the computing card. Due to the centrifugal fan architecture, the fan assembly has a flatter shape, which is compatible with the flat shape of the computing card and reduces the space occupied inside the workstation.

[0032] In addition, this application also proposes a workstation that includes the above-mentioned computing card heat dissipation device. By configuring the computing card heat dissipation device on the computing card, the computing card can be actively cooled, thus achieving a better heat dissipation effect than traditional heat dissipation methods and ensuring the stable operation of the computing card.

[0033] Reference Figure 1The computing card heat dissipation device in the first aspect embodiment of this application includes a fan assembly 100 and a connector 200. The fan assembly 100 mainly functions to dissipate heat and cool the computing card 300. By drawing in outside air and blowing it onto the computing card 300, the air can fully contact the surface of the computing card 300, and the air carries away the heat from the computing card 300 to achieve cooling. The connector 200 serves a connecting function, used to fix the fan assembly 100 to the computing card 300.

[0034] Specifically, refer to Figure 2 and Figure 3 The fan assembly 100 includes a housing 110, a fan 120, and a motor 130. A first air outlet 111 is provided on one side of the housing 110, facing the computing card 300, allowing the airflow generated by the fan assembly 100 to flow to the computing card 300. The housing 110 transitions from a first surface to a second surface along its thickness direction. An air inlet 112 is provided on the first surface, and a second air outlet 113 is provided on the second surface. The air inlet 112, the first air outlet 111, and the second air outlet 113 are all connected to the inner cavity of the housing 110, and the three are spatially interconnected. The fan 120 and the motor 130 are mounted in the inner cavity. The motor 130 drives the fan 120 to rotate, thereby using the rotation of the fan 120 to drive the airflow in the inner cavity.

[0035] The connector 200 has a channel inside, with its two ends connected to the first air outlet 111 and the tail end of the computing card 300, respectively, which guides the airflow toward the computing card 300.

[0036] When the motor 130 drives the fan 120 to rotate, the rotation of the fan 120 can drive air into the inner cavity of the housing 110. Part of the air is driven by the centrifugal force of the fan 120 and flows to the computing card 300 through the first air outlet 111, while the other part of the air flows out through the second air outlet 113. Thus, while delivering cool air to the computing card 300, it also promotes the overall airflow in the workstation, which has a dual heat dissipation effect.

[0037] Furthermore, the housing 110 is a volute, and a spiral air duct 114 is formed between the inner sidewall of the volute and the fan 120. The inner diameter of the spiral air duct 114 gradually increases with the airflow direction, so that the internal space of the spiral air duct 114 adapts to the airflow direction. The spiral air duct 114 guides the airflow to the first air outlet 111, and guides the airflow to finally be discharged to the computing card 300.

[0038] Furthermore, the fan 120 is equipped with multiple blades arranged in a circular array, with the blades forming an acute angle with the rotation axis of the fan 120. Thus, when the blades sweep across the air, they divert the air entering from the air inlet 112. Part of the air enters the spiral air duct 114 under the action of centrifugal force, while the other part of the air is blown by the blades to the second air outlet 113 for discharge.

[0039] Optionally, the housing 110 and the connector 200 are detachably connected, so that the fan assembly 100 can be easily detached from the connector 200 when it is not needed or when it needs to be removed for later maintenance. The detachable connection can be achieved using bolted connections, plug-in connections, snap-fit ​​connections, or sliding groove fixation.

[0040] In some embodiments, the housing 110 and the connector 200 are connected by a plug-in connection. See details... Figure 1 The connector 200 has a connection slot, and the housing 110 is directly inserted into the connection slot for fixation.

[0041] In other embodiments, specific references are made. Figure 4 The connector 200 has a groove, and the surface of the housing 110 is provided with a slider that can slide into the groove. The slider slides into the groove to limit and fix the housing 110. Specifically, in order to prevent the slider from falling out of the groove, the groove is designed as a dovetail groove, and the slider and the dovetail groove form a dovetail tenon structure.

[0042] It is easy to understand that the housing 110 and the connector 200 can also adopt other types of detachable connection methods, which will not be described in detail here.

[0043] Furthermore, in order to reduce the space occupied by the fan assembly 100 in the workstation, the thickness of the housing 110 is no greater than the thickness of the computing card 300.

[0044] Furthermore, when there are at least two computing power cards 300, the cooling devices on two adjacent computing power cards 300 are respectively the first computing power card cooling device and the second computing power card cooling device, with the second air outlet 113 of the first computing power card cooling device facing the air inlet 112 of the second computing power card cooling device. Thus, the air exhausted from the second air outlet 113 of the first computing power card cooling device can directly enter the air inlet 112 of the second computing power card cooling device, ensuring that the airflow direction among the various computing power card cooling devices is consistent, avoiding mutual airflow interference and turbulence within the workstation.

[0045] A workstation according to a second aspect embodiment of this application includes a motherboard and the aforementioned computing card heat dissipation device, wherein a computing card 300 is installed on the motherboard, the computing card heat dissipation device is installed on the computing card 300, and the motor 130 of the computing card heat dissipation device is electrically connected to the motherboard, and the motherboard controls the motor 130 and provides it with power.

[0046] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A heat dissipation device for a computing card, characterized in that, include: A fan assembly includes a housing, a fan, and a motor. A first air outlet is provided on one side of the housing. The housing transitions from a first surface to a second surface along its thickness direction. An air inlet is provided on the first surface, and a second air outlet is provided on the second surface. The air inlet, the first air outlet, and the second air outlet are all connected to the inner cavity of the housing. The fan and the motor are installed in the inner cavity, and the motor drives the fan to rotate. The connector has a channel inside, and the two ends of the channel are respectively connected to the first air outlet and the tail end of the computing card; The fan rotation drives air into the inner cavity of the housing. Part of the air, under the centrifugal force of the fan, flows through the first air outlet to the computing card, while the other part flows out through the second air outlet.

2. The heat dissipation device for computing cards according to claim 1, characterized in that: The housing is a volute, and a spiral air duct is formed between the inner sidewall of the volute and the fan. The inner diameter of the spiral air duct gradually increases with the direction of airflow, and the spiral air duct guides the airflow to the first air outlet.

3. The heat dissipation device for computing cards according to claim 2, characterized in that: The fan is equipped with multiple blades arranged in a circular array. The blades are set at an acute angle to the rotation axis of the fan. The blades split the air entering from the air inlet. Part of the air enters the spiral air duct under the action of centrifugal force, and the other part of the air is blown to the second air outlet by the blades.

4. The heat dissipation device for computing cards according to claim 1, characterized in that: The housing and the connector are detachably connected.

5. The heat dissipation device for computing cards according to claim 4, characterized in that: The connector has a connection slot, and the housing is inserted into the connection slot to achieve fixation.

6. The heat dissipation device for computing cards according to claim 4, characterized in that: The connector has a sliding groove, and the surface of the housing is provided with a slider that can slide into the sliding groove. The slider slides into the sliding groove to limit and fix the housing.

7. The heat dissipation device for computing cards according to claim 6, characterized in that: The groove is a dovetail groove, and the slider and the dovetail groove form a dovetail tenon and mortise structure.

8. The heat dissipation device for computing cards according to any one of claims 1 to 7, characterized in that: The thickness of the shell is no greater than the thickness of the computing card.

9. The heat dissipation device for a computing card according to claim 8, characterized in that: The number of computing power cards is at least two, and the computing power card heat dissipation devices on two adjacent computing power cards are respectively the first computing power card heat dissipation device and the second computing power card heat dissipation device. The second air outlet of the first computing power card heat dissipation device faces the air inlet of the second computing power card heat dissipation device.

10. A workstation, characterized in that, The device includes a motherboard and a computing card heat dissipation device as described in any one of claims 1 to 9, wherein a computing card is inserted on the motherboard, the computing card heat dissipation device is installed on the computing card, and the motor of the computing card heat dissipation device is electrically connected to the motherboard.

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