Screen module and electronic device

Abstract

The present disclosure provides a screen module and an electronic device, the screen module comprising a cover plate, a glue layer and a film layer to be bonded; the glue layer is located between the cover plate and the film layer to be bonded, and is bonded with the cover plate and the film layer to be bonded respectively; the surface of the cover plate towards the glue layer has a glue overflow groove and a glue overflow prevention structure, the glue overflow groove contains at least part of the glue layer, and the glue overflow prevention structure prevents the glue layer in a non-solidified state from continuing to overflow from the glue overflow groove to the edge of the cover plate. The screen module of the present disclosure embodiment is not prone to the problem of edge glue overflow, and has high reliability and delicate appearance.

Description

Technical Field

[0001] This disclosure relates to the field of electronic device technology, and in particular to a screen module and an electronic device. Background Technology

[0002] Currently, various electronic devices with screen display functions are constantly evolving. These electronic devices often require the use of adhesives to bond different modules or film structures. To improve the flatness of the bonded modules or devices, liquid adhesives that can be cured through special treatment are generally used.

[0003] However, during application, liquid colloids may overflow due to the squeezing pressure between different modules or film structures, causing the colloid to partially spill out of the device edge or screen module edge, affecting the product's reliability and appearance, and reducing product yield. Utility Model Content

[0004] Therefore, this disclosure provides a screen module and electronic device that are less prone to edge glue overflow issues, and have high reliability and refined appearance.

[0005] Specifically, the following technical solutions are included: This disclosure provides a screen module including a cover plate, an adhesive layer, and a film layer to be bonded; the adhesive layer is located between the cover plate and the film layer to be bonded, and is bonded to both the cover plate and the film layer to be bonded; the surface of the cover plate facing the adhesive layer has an overflow groove and an overflow barrier structure, the overflow groove accommodating at least a portion of the adhesive layer, and the overflow barrier structure restricting the adhesive layer such that the orthographic projection of the adhesive layer on the cover plate is located on the side of the overflow barrier structure away from the edge of the cover plate.

[0006] In other words, this disclosure provides a screen module with an overflow groove on the surface of the cover plate facing the adhesive layer. When the cover plate and the film layer to be bonded are joined using the adhesive layer, any unsolidified adhesive layer flowing towards the edge of the cover plate due to pressure can flow into the overflow groove, preventing it from overflowing to the edge of the module. Even if the amount of adhesive layer overflowing is large, the overflow-blocking structure on the surface of the cover plate facing the adhesive layer can further prevent the adhesive layer from continuing to overflow from the overflow groove towards the edge of the cover plate, ensuring that the final orthographic projection of the adhesive layer on the cover plate is located on the side of the overflow-blocking structure away from the edge of the cover plate. That is, it ensures that the adhesive layer is unlikely to overflow to the edge of the module. Thus, the screen module has high reliability, a refined appearance, and a high yield rate.

[0007] Optionally, the overflow barrier is at least partially located on the side of the overflow channel near the edge of the cover plate. In this way, the overflow barrier can specifically inhibit the flow of adhesive towards the edge of the cover plate without obstructing the flow of adhesive into the overflow channel.

[0008] Optionally, the overflow-blocking structure includes an overflow-blocking layer that restricts the colloid layer such that the orthographic projection of the colloid layer onto the cover plate is located on the side of the overflow-blocking layer away from the edge of the cover plate. In this embodiment, the layered structure suppresses the overflow of the colloid layer towards the edge of the cover plate. The layered structure can effectively reduce the overall volume of the overflow-blocking structure, avoiding a significant increase in the thickness of the screen module, which is beneficial for reducing the thickness of the screen module and the electronic device including the screen module.

[0009] Optionally, at least a portion of the overflow barrier layer is located on the side of the overflow tank near the edge of the cover plate, and / or, at least a portion of the overflow barrier layer extends into the overflow tank and is located on the sidewall of the overflow tank near the edge of the cover plate. That is, the overflow barrier layer may have a portion located on the side of the overflow tank near the edge of the cover plate, which can suppress the overflow of liquid colloid (the colloid layer in its unsolidified state is a liquid colloid) in the overflow tank towards the edge of the cover plate. The overflow barrier layer may also have a portion extending into the overflow tank and located on the sidewall of the overflow tank near the edge of the cover plate, which can suppress the tendency of liquid colloid entering the overflow tank to overflow from the overflow tank, thereby suppressing the overflow of liquid colloid towards the edge of the cover plate. The combination of the two parts can effectively enhance the overflow barrier effect on liquid colloid.

[0010] Optionally, the overflow-blocking structure includes a raised structure located on the side of the overflow groove near the edge of the cover plate. In this embodiment, the overflow-blocking structure includes a raised structure, which can directly block the liquid adhesive overflowing from the overflow groove, making it difficult for the liquid adhesive to continue overflowing towards the edge of the cover plate. In other words, the raised structure, in conjunction with the overflow groove, enhances the restriction effect on the liquid adhesive, effectively preventing the adhesive from flowing to the edge of the cover plate.

[0011] Optionally, the overflow-blocking structure includes an overflow-blocking layer, which is at least partially located on the sidewall of the raised structure away from the edge of the cover plate. The overflow-blocking layer is also provided on the side of the raised structure away from the edge of the cover plate, thus the overflow-blocking layer and the raised structure work together to enhance the blocking effect on the colloid, further preventing the colloid from overflowing to the edge of the cover plate.

[0012] Optionally, the overflow barrier layer is a hydrophobic layer. The material of the colloidal layer is generally hydrophilic and tends to move away from the hydrophobic layer. By setting the overflow barrier layer as a hydrophobic layer, the approach of the colloidal material can be inhibited, thereby suppressing the tendency of the colloidal material to overflow towards the edge of the cover plate.

[0013] Optionally, the overflow barrier layer can be made of any one of silicone compounds, fluorocarbon compounds, and waxes. These materials ensure that the overflow barrier layer is hydrophobic and effectively inhibits the overflow of colloids towards the edge of the cover plate.

[0014] Optionally, the overflow barrier layer can be made of any one of silicone oil, fluorocarbon resin, and paraffin wax. These materials are low in cost and high in reliability.

[0015] Optionally, the surface of the cover plate facing the colloid layer also has a flow guiding structure, which guides the colloid layer to overflow into the overflow tank. The flow guiding structure can guide the colloid layer to overflow into the overflow tank, ensuring that the colloid layer (in its unsolidified state) preferentially enters the overflow tank rather than overflowing directly to the edge of the cover plate.

[0016] Optionally, the flow guiding structure is at least partially located on the side of the overflow groove away from the edge of the cover plate. This way, the adhesive preferentially contacts the flow guiding structure during overflow, and then flows into the overflow groove under the guidance of the flow guiding structure, rather than flowing directly to the edge of the cover plate.

[0017] Optionally, the flow guiding structure includes a flow guiding layer; at least a portion of the flow guiding layer is located on the side of the overflow groove away from the cover plate, and / or, at least a portion of the flow guiding layer extends into the overflow groove and is located on the side wall of the overflow groove away from the cover plate and / or on the bottom wall of the overflow groove. Using a layered structure to achieve flow guiding avoids excessive module space occupation, which helps reduce the module's volume. The flow guiding layer may include a portion located on the side of the overflow groove away from the cover plate, which can assist the adhesive in flowing towards the overflow groove, so that the overflow portion of the adhesive preferentially flows towards the overflow groove. The flow guiding layer may include a portion located on the side wall of the overflow groove away from the cover plate or on the bottom wall of the overflow groove, which can help the adhesive remain more in the overflow groove rather than overflow. The adhesive located in the overflow groove can also enhance the adhesion between the cover plate and the film layer to be bonded after solidification.

[0018] Optionally, the flow-guiding layer is a hydrophilic layer. The hydrophilic layer can increase the affinity of the flow-guiding layer for the colloid, thereby improving the flow-guiding effect of the colloid.

[0019] Optionally, the material of the flow-guiding layer is any one of polyoxyethylene ether, siloxane, sulfonate, and sulfate salt. These materials ensure that the flow-guiding layer has strong hydrophilicity.

[0020] Optionally, the material of the flow guiding layer is any one of polyethylene glycol, polydimethylsiloxane, sodium dodecylbenzenesulfonate, and sodium dodecyl sulfate. These materials ensure both the hydrophilicity of the flow guiding layer and its low cost and high reliability.

[0021] Optionally, the overflow groove satisfies at least one of the following: The width of the overflow groove is in the range of 0.01-0.1mm; The depth of the overflow groove is in the range of 0.01-0.1 mm; The distance between the overflow groove and the edge of the cover plate is in the range of 0.2-1.2mm.

[0022] The above-mentioned dimensions and distance range can ensure that the overflow groove effectively prevents the glue from overflowing to the edge of the cover plate.

[0023] Optionally, the film layer to be bonded is a film layer on the side of a display panel or touch panel near the cover plate; the adhesive layer is an optical adhesive layer; and / or, the cover plate is a glass cover plate. When the film layer to be bonded is a display panel, a screen module with display function is formed; when the film layer to be bonded is a touch panel, a screen module with touch function is formed. The materials of the adhesive layer and the cover plate can also be adjusted according to requirements.

[0024] Optionally, the overflow groove is an annular groove. This allows for omnidirectional adjustment of the adhesive flow, ensuring that overflow does not easily occur at the edges of the entire module, thus improving the module's appearance and finish.

[0025] Optionally, the overflow groove includes multiple sub-overflow grooves, which are independent of each other and extend sequentially along a direction parallel to the edge of the cover plate. This allows for targeted treatment of locations prone to overflow, preventing overflow from occurring; alternatively, nested sub-annular grooves can enhance the adhesive's containment space.

[0026] Optionally, the plurality of sub-overflow grooves includes at least the following components: at least one sub-overflow groove located at at least one corner of the cover plate; and at least one sub-overflow groove extending parallel to any side of the cover plate. Based on the above configuration, overflow can be managed at various angles and / or sides of the module, preventing overflow at these locations.

[0027] Optionally, the plurality of sub-overflow adhesive trays include at least the following portions: m sub-overflow grooves located at the m corners of the cover plate, where m is an integer greater than or equal to 3; and n sub-overflow grooves parallel to the n edges of the cover plate, where n is an integer greater than or equal to 3; or, The plurality of overflow glue tanks include at least the following: The cover plate has m sub-overflow grooves located at the m corners, where m is an integer greater than or equal to 3; and multiple sub-overflow grooves that extend along any side of the cover plate, are independent of each other, and are located on the same extension line.

[0028] Based on the above settings, several overflow colloid tank design options are provided. These options can be selected and further adjusted according to requirements to achieve customized and more flexible colloid flow management solutions.

[0029] Optionally, the cross-section of the overflow channel can be any of the following: triangular, arc-shaped, trapezoidal, U-shaped, or at least a portion of a polygon with four or more sides. This embodiment provides examples of several optional cross-sectional designs for the overflow channel. These cross-sections can be selected or further adjusted as needed to achieve a more suitable colloid receiving channel.

[0030] Optionally, the overflow groove satisfies at least one of the following: at least one corner of the cross-section of the overflow groove is a rounded transition; at least one angle formed by the overflow groove and the surface of the cover plate facing the adhesive layer is a rounded transition. Based on the above settings, the contact area between the adhesive and the groove wall in the overflow groove or the contact area between the adhesive and the surface of the cover plate can be increased, thereby strengthening the adhesion effect with the cover plate.

[0031] This disclosure also provides an electronic device, including any of the screen modules described above.

[0032] In the screen module of the electronic device provided in this embodiment, the surface of the cover plate facing the adhesive layer has an overflow groove. When the cover plate and the film layer to be bonded are adhered using the adhesive layer, any unsolidified adhesive layer flowing towards the edge of the cover plate due to pressure can flow into the overflow groove, preventing it from overflowing to the edge of the module. Even if the amount of adhesive layer overflowing is large, the overflow-blocking structure on the surface of the cover plate facing the adhesive layer can further prevent the adhesive layer from continuing to overflow from the overflow groove towards the edge of the cover plate, ensuring that the adhesive layer is unlikely to overflow to the edge of the module. This results in higher reliability, a more refined appearance, and a higher yield rate for the electronic device.

[0033] Optionally, the electronic device further includes a mid-frame and a border; the screen module is mounted on the mid-frame, and the edge of the screen module's cover plate contacts the border. Based on this configuration, the screen module can be ensured to be supported and fixed by the mid-frame, improving the stability of the screen module within the electronic device. The edge of the screen module's cover plate can directly contact the border and be supported by it. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of a screen module provided in an embodiment of the present disclosure; Figure 2 This is a schematic diagram of the structure of a screen module provided in an embodiment of the present disclosure; Figure 3This is a schematic diagram of the structure of a cover plate provided in an embodiment of the present disclosure; Figure 4 A partial structural schematic diagram of a cover plate provided in an embodiment of this disclosure; Figure 5 A partial structural schematic diagram of a cover plate provided in an embodiment of this disclosure; Figure 6 A partial structural schematic diagram of a cover plate provided in an embodiment of this disclosure; Figure 7 A partial structural schematic diagram of a cover plate provided in an embodiment of this disclosure; Figure 8 This is a schematic diagram showing the distribution of the overflow grooves on the cover plate provided in an embodiment of the present disclosure; Figure 9 Another schematic diagram showing the distribution of the overflow groove on the cover plate provided in this embodiment of the disclosure; Figure 10 This is a partial structural schematic diagram of an electronic device provided in an embodiment of the present disclosure.

[0036] The reference numerals in the figure indicate: 10-Screen module; 101-Cover plate; 1011-Overflow Glue Tank; 10111-Sub-Overflow Glue Tank; 1012 - Overflow barrier structure; 10121 - Overflow barrier layer; 10122 - Raised structure; 1013 - Flow guiding structure; 10131 - Flow guiding layer; 102-Colloidal layer; 103 - The film layer to be bonded; 20-Middle frame; 30 - Border.

[0037] The accompanying drawings have illustrated specific embodiments of this disclosure, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concepts of this disclosure to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0038] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0039] The directional terms used in the embodiments of this disclosure, such as "up," "down," and "side," are generally based on the orientation shown in the figures or the relative orientation between structures when the screen module or electronic device is conventionally arranged. These directional terms are used merely to more clearly describe the relationships between structures, not to describe absolute orientation. The orientation may change when the screen module or electronic device is placed in different postures; for example, "up" and "down" may be interchanged.

[0040] Unless otherwise defined, all technical terms used in the embodiments of this disclosure have the same meaning as commonly understood by one of ordinary skill in the art.

[0041] To make the technical solutions and advantages of this disclosure clearer, the embodiments of this disclosure will be described in further detail below with reference to the accompanying drawings.

[0042] like Figure 1-10 As described above, this disclosure provides a screen module 10.

[0043] refer to Figure 1-3 (in Figure 1 The middle colloidal layer has not yet been squeezed out. Figure 2 (Due to compression, part of the medium colloid layer flows into the overflow groove). The screen module 10 of this embodiment includes a cover plate 101, a colloid layer 102 and a film layer to be bonded 103. The colloidal layer 102 is located between the cover plate 101 and the film layer 103 to be bonded, and is bonded to both the cover plate 101 and the film layer 103 to be bonded. The surface of the cover plate 101 facing the colloid layer 102 has an overflow groove 1011 and an overflow barrier structure 1012. The overflow groove 1011 accommodates at least a portion of the colloid layer 102, and the overflow barrier structure 1012 restricts the colloid layer 102 such that the orthographic projection of the colloid layer 102 on the cover plate 102 is located on the side of the overflow barrier structure 1012 away from the edge of the cover plate 102.

[0044] It should be noted that the colloid layer of this disclosure is formed by the solidification of a liquid colloid. Liquid colloids are fluid and will flow under pressure. The overflow channel and overflow barrier structure in this disclosure are used to adjust the flow direction or position of the colloid during the module production process, when the colloid layer is not yet solidified, to prevent the colloid from flowing to the edge of the cover plate. In the final screen module product, the colloid layer remains solid.

[0045] This disclosure provides a screen module with an overflow groove on the surface of the cover plate facing the adhesive layer. When the cover plate and the film layer to be bonded are joined using the adhesive layer, any unsolidified adhesive layer flowing towards the edge of the cover plate due to pressure can flow into the overflow groove, preventing it from overflowing to the edge of the module. Even if the amount of adhesive overflow is large, the overflow-blocking structure on the surface of the cover plate facing the adhesive layer can further prevent the adhesive layer from continuing to overflow from the overflow groove towards the edge of the cover plate, ensuring that the orthogonal projection of the adhesive layer on the cover plate is always located on the side of the overflow-blocking structure away from the cover plate. In other words, the adhesive layer is unlikely to overflow to the edge of the module. Thus, with the dual effect of the overflow groove and the overflow-blocking structure, the adhesive in the module will not overflow to the edge, resulting in higher reliability, a more refined appearance, and a higher yield rate for the screen module.

[0046] Optional, see reference Figure 1-3 The overflow barrier structure 1012 is located at least partially on the side of the overflow tank 1011 near the edge of the cover plate 101. In this way, the overflow barrier structure can specifically inhibit the flow of adhesive towards the edge of the cover plate without obstructing the flow of adhesive into the overflow tank.

[0047] In some embodiments, reference Figure 1-4 The overflow barrier structure 1012 includes an overflow barrier layer 10121, which restricts the colloidal layer 102 such that the orthographic projection of the colloidal layer 102 on the cover plate 102 is located on the side of the overflow barrier layer 10121 away from the edge of the cover plate 102.

[0048] In this embodiment, the layered structure is used to suppress the overflow of the colloid layer towards the edge of the cover plate. The layered structure can effectively reduce the overall volume of the overflow prevention structure, avoid a significant increase in the thickness of the screen module, and help reduce the thickness of the screen module and the electronic device including the screen module.

[0049] Optional, see reference Figure 4 At least a portion of the overflow barrier layer 10121 is located on the side of the overflow tank 1011 near the edge of the cover plate 101, and / or at least a portion of the overflow barrier layer 10121 extends into the overflow tank 1011 and is located on the side wall of the overflow tank 1011 near the edge of the cover plate 101.

[0050] In this embodiment, the overflow barrier layer may have a portion located on the side of the overflow tank near the edge of the cover plate. This portion can suppress the overflow of liquid colloid (the colloid layer in its unsolidified state appears as liquid colloid) in the overflow tank towards the edge of the cover plate. The overflow barrier layer may also have a portion extending into the overflow tank and located on the side wall of the overflow tank near the edge of the cover plate. This portion can suppress the tendency of liquid colloid entering the overflow tank to overflow from the overflow tank, thereby suppressing the overflow of liquid colloid towards the edge of the cover plate. The combination of the two portions can effectively enhance the overflow barrier effect on liquid colloid.

[0051] In some embodiments, reference Figure 5 The overflow prevention structure 1012 includes a protrusion 10122 located on the side of the overflow groove 1011 near the edge of the cover plate 101.

[0052] In this embodiment, the overflow-blocking structure includes a raised structure, which directly blocks the liquid colloid overflowing from the overflow groove, making it difficult for the liquid colloid to continue overflowing towards the edge of the cover plate. In other words, the raised structure, in conjunction with the overflow groove, strengthens the restriction effect on the liquid colloid, effectively preventing the colloid from flowing to the edge of the cover plate. It should be noted that, in this disclosure, "liquid colloid" refers to the colloid layer in its unsolidified state during module production.

[0053] Optional, see reference Figure 6 The overflow barrier structure 1012 includes an overflow barrier layer 10121, which is at least partially located on the sidewall of the protrusion structure 10122 on the side away from the edge of the cover plate 101.

[0054] In this embodiment, an overflow barrier layer is also provided on the side of the protruding structure away from the edge of the cover plate. The overflow barrier layer and the protruding structure work together to enhance the blocking effect on the colloid and further prevent the colloid from overflowing to the edge of the cover plate.

[0055] In some embodiments, the overflow barrier layer 10121 is a hydrophobic layer. The material of the colloidal layer is generally hydrophilic and tends to move away from the hydrophobic layer. By making the overflow barrier layer hydrophobic, the approach of the colloidal material can be inhibited, thereby suppressing the tendency of the colloidal material to overflow towards the edge of the cover plate.

[0056] Optionally, the overflow barrier layer 10121 may be made of any one of silicone compounds, fluorocarbon compounds, and waxes. These materials ensure that the overflow barrier layer is hydrophobic and effectively inhibits the overflow of colloids towards the edge of the cover plate.

[0057] Optionally, the overflow barrier 10121 can be made of any one of silicone oil, fluorocarbon resin, and paraffin wax. These materials are low in cost and high in reliability.

[0058] In some embodiments, reference Figure 3 The surface of the cover plate 101 facing the colloid layer 102 also has a flow guiding structure 1013, which guides the colloid layer 102 to overflow into the overflow trough 1011.

[0059] In this embodiment, the flow guiding structure can guide the overflow of the colloid layer into the overflow tank, ensuring that the colloid layer (when it is not solidified) preferentially enters the overflow tank rather than overflowing directly to the edge of the cover plate.

[0060] Optional, see reference Figure 4The flow guiding structure 1013 is located at least partially on the side of the overflow groove 1011 away from the edge of the cover plate 101. In this way, the adhesive preferentially contacts the flow guiding structure during overflow and flows into the overflow groove under the guidance of the flow guiding structure, rather than flowing directly to the edge of the cover plate.

[0061] Optional, see reference Figure 4 The flow guiding structure 1013 includes a flow guiding layer 10131; at least a portion of the flow guiding layer 10131 is located on the side of the overflow trough 1011 away from the edge of the cover plate 101, and / or at least a portion of the flow guiding layer 10131 extends into the overflow trough 1011 and is located on the side wall of the overflow trough 1011 away from the edge of the cover plate 101 and / or on the bottom wall of the overflow trough 1011.

[0062] In this embodiment, the flow guiding structure can be a flow guiding layer. Using a layered structure to achieve flow guiding avoids excessive space occupation in the module, thus reducing the module's size. The flow guiding layer may include a portion located on the side of the overflow groove away from the cover plate. This portion assists the adhesive in flowing towards the overflow groove, ensuring that the overflow portion of the adhesive preferentially flows towards the overflow groove. The flow guiding layer may also include a portion located on the sidewall of the overflow groove away from the cover plate or on the bottom wall of the overflow groove. These portions help retain more adhesive within the overflow groove rather than overflowing. After solidification, the adhesive within the overflow groove can also enhance the adhesion between the cover plate and the film layer to be bonded, thereby improving the module's functional stability and service life.

[0063] Optionally, the flow guiding layer 10131 is a hydrophilic layer. The hydrophilic layer can improve the affinity of the flow guiding layer for colloids and enhance the flow guiding effect of colloids.

[0064] Optionally, the flow guide layer 10131 may be made of any one of polyoxyethylene ether, siloxane, sulfonate, and sulfate salt. These materials ensure that the flow guide layer has strong hydrophilicity.

[0065] Optionally, the flow guide layer 10131 can be made of any one of polyethylene glycol, polydimethylsiloxane, sodium dodecylbenzenesulfonate, and sodium dodecyl sulfate. These materials ensure both the hydrophilicity of the flow guide layer and its low cost and high reliability.

[0066] In some embodiments, the adhesive overflow tank 1011 satisfies at least one of the following: The width of the glue overflow groove 1011 is in the range of 0.01-0.1mm; The depth of the glue overflow groove 1011 is in the range of 0.01-0.1mm; The distance between the overflow groove 1011 and the edge of the cover plate 101 is in the range of 0.2-1.2mm.

[0067] The above-mentioned dimensions and distance ranges ensure that the overflow groove effectively prevents adhesive from overflowing to the edge of the cover plate. The width and depth of the overflow groove can also be adjusted according to the amount of adhesive overflow. The position of the overflow groove can be adjusted according to the width or location of the equipment frame and the position of other film layers within the module.

[0068] In some embodiments, the film layer 103 to be bonded is a film layer on the side of the display panel or touch panel near the cover plate 101; the colloid layer 102 is an optical adhesive layer; and / or, the cover plate 101 is a glass cover plate.

[0069] In this embodiment, when the film layer to be bonded is a display panel, a screen module with display function is formed; when the film layer to be bonded is a touch panel, a screen module with touch function is formed. The materials of the colloid layer and the cover plate can also be adjusted according to requirements; this disclosure only provides one example.

[0070] In some embodiments, reference Figure 8 The overflow groove 1011 is an annular groove. This allows for all-around adjustment of the adhesive flow, ensuring that overflow does not easily occur at the edges of the entire module, thus improving the module's appearance and finish.

[0071] In some embodiments, reference Figure 9 The glue overflow tank 1011 includes multiple sub-glue overflow tanks 10111, which are independent of each other and extend sequentially along a direction parallel to the edge of the cover plate 101. In this way, by setting multiple sub-glue overflow tanks, targeted treatment can be carried out on locations prone to glue overflow, thus preventing glue overflow from occurring in these locations; or, by nesting two sub-annular tanks, the space for containing the glue can be increased.

[0072] Optional, see reference Figure 9 The plurality of overflow glue tanks 10111 include at least the following portions: At least one sub-overflow groove 10111 located at at least one corner of the cover plate 101; At least one sub-overflow groove 10111 extending in a direction parallel to either side of the cover plate 101.

[0073] Based on the above settings, excess adhesive can be managed at various angles and / or sides of the module to prevent excess adhesive from appearing in these locations. The location of the sub-excess adhesive channel can also be selected based on requirements or experience.

[0074] Optional, see reference Figure 9 The plurality of overflow glue tanks 10111 include at least the following portions: m sub-overflow glue channels 10111 located at the m corners of the cover plate 101, where m is an integer greater than or equal to 3; and n sub-overflow glue channels 10111 parallel to the n sides of the cover plate 101, where n is an integer greater than or equal to 3; or, Multiple overflow glue tanks 10111 include at least the following portions: The m sub-overflow glue channels 10111 are located at the m corners of the cover plate 101, where m is an integer greater than or equal to 3; and the multiple sub-overflow glue channels 10111 that extend along any side of the cover plate 101, are independent of each other, and are located on the same extension line.

[0075] Based on the above settings, various overflow trough design schemes are provided. For example, multiple overflow troughs can be arranged in the form of multiple discontinuous lines around the cover plate, or distributed on the cover plate in a manner located at multiple corners and parallel to multiple sides. These overflow troughs can be evenly spaced or unevenly spaced as needed. These schemes can be selected and further adjusted according to requirements to achieve customized and more flexible colloid flow management solutions.

[0076] In some embodiments, reference Figure 7 The cross-section of the overflow groove 1011 is any one of the following: a triangle, an arc, a trapezoid, a U-shape, or at least a portion of a polygon with 4 or more sides.

[0077] This embodiment provides several examples of optional cross-sectional designs for the overflow tank. These cross-sections can be selected or further adjusted according to requirements to achieve a more suitable colloid receiving tank.

[0078] Optional, see reference Figure 7 The glue overflow tank 1011 satisfies at least one of the following: At least one corner of the cross-section of the overflow groove 1011 is rounded. At least one angle formed by the overflow groove 1011 and the surface of the cover plate 101 facing the adhesive layer 102 is a rounded transition.

[0079] Based on the above settings, the contact area between the colloid and the wall of the overflow tank or the contact area between the colloid and the surface of the cover plate can be increased, thereby enhancing the adhesion to the cover plate. The rounded corner on the same side as the flow guiding structure can also help guide the colloid in its unsolidified state, making it easier for the colloid to flow into the overflow tank rather than flowing directly to the edge of the module.

[0080] In summary, the embodiments of this disclosure provide a screen module in which the adhesive layer is less likely to overflow to the edge of the module when it is not solidified, thus avoiding the problem of edge adhesive overflow. This effectively improves the appearance of the module, avoids the adhesive overflow removal process, and improves the product yield.

[0081] refer to Figure 10 This disclosure also provides an electronic device, including the screen module 10 as described above.

[0082] In the screen module of the electronic device provided in this embodiment, the surface of the cover plate facing the adhesive layer has an overflow groove. When the cover plate and the film layer to be bonded are adhered using the adhesive layer, any unsolidified adhesive layer flowing towards the edge of the cover plate due to pressure can flow into the overflow groove, preventing it from overflowing to the edge of the module. Even if the amount of adhesive layer overflowing is large, the overflow-blocking structure on the surface of the cover plate facing the adhesive layer can further prevent the adhesive layer from continuing to overflow from the overflow groove towards the edge of the cover plate, ensuring that the adhesive layer is unlikely to overflow to the edge of the module. This results in higher reliability, a more refined appearance, and a higher yield rate for the electronic device.

[0083] Optional, see reference Figure 10 The electronic device includes a mid-frame 20 and a bezel 30; The screen module 10 is mounted on the mid-frame 20, and the edge of the cover plate 101 of the screen module 10 contacts the frame 30.

[0084] Based on the above configuration, the screen module can be supported and fixed by the mid-frame, improving its stability within the electronic device. The edge of the screen module's cover plate can directly contact the frame and be supported by it.

[0085] In summary, the embodiments of this disclosure provide an electronic device in which the adhesive layer of the screen module is less likely to overflow to the edge of the module when it is not solidified, thus reducing the risk of edge adhesive overflow. This effectively improves the appearance and refinement of the module, avoids the adhesive overflow removal process, and improves the product yield.

[0086] In this disclosure, the terms “first” and “second” are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term “multiple” means two or more, unless otherwise expressly defined.

[0087] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0088] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A screen module, characterized in that, Includes a cover plate (101), an adhesive layer (102), and a film layer to be bonded (103). The colloidal layer (102) is located between the cover plate (101) and the film layer (103) to be bonded, and is bonded to the cover plate (101) and the film layer (103) to be bonded respectively; The cover plate (101) has an overflow groove (1011) and an overflow barrier structure (1012) on the surface facing the colloid layer (102), the overflow groove (1011) accommodating at least a portion of the colloid layer (102), and the overflow barrier structure (1012) restricting the colloid layer (102) such that the orthographic projection of the colloid layer (102) on the cover plate (102) is located on the side of the overflow barrier structure (1012) away from the edge of the cover plate (102).

2. The screen module according to claim 1, characterized in that, The overflow barrier (1012) is located at least partially on the side of the overflow groove (1011) near the edge of the cover plate (101).

3. The screen module according to claim 1, characterized in that, The overflow barrier structure (1012) includes an overflow barrier layer (10121) that restricts the colloidal layer (102) such that the orthographic projection of the colloidal layer (102) onto the cover plate (102) is located on the side of the overflow barrier layer (10121) away from the edge of the cover plate (102).

4. The screen module according to claim 3, characterized in that, At least a portion of the overflow barrier layer (10121) is located on the side of the overflow groove (1011) near the edge of the cover plate (101), and / or at least a portion of the overflow barrier layer (10121) extends into the overflow groove (1011) and is located on the side wall of the overflow groove (1011) near the edge of the cover plate (101).

5. The screen module according to claim 1, characterized in that, The overflow barrier structure (1012) includes a raised structure (10122) located on the side of the overflow groove (1011) near the edge of the cover plate (101).

6. The screen module according to claim 5, characterized in that, The overflow barrier structure (1012) includes an overflow barrier layer (10121) which is at least partially located on the sidewall of the protrusion structure (10122) on the side away from the edge of the cover plate (101).

7. The screen module according to any one of claims 3-4 and 6, characterized in that, The overflow barrier layer (10121) is a hydrophobic layer.

8. The screen module according to any one of claims 3-4 and 6, characterized in that, The material of the overflow barrier layer (10121) is any one of silicone compound, fluorocarbon compound and wax.

9. The screen module according to claim 8, characterized in that, The material of the overflow barrier layer (10121) is any one of silicone oil, fluorocarbon resin and paraffin.

10. The screen module according to any one of claims 1-6 and 9, characterized in that, The surface of the cover plate (101) facing the colloid layer (102) also has a flow guiding structure (1013), which guides the colloid layer (102) to overflow into the overflow trough (1011).

11. The screen module according to claim 10, characterized in that, The flow guiding structure (1013) is located at least partially on the side of the overflow groove (1011) away from the edge of the cover plate (101).

12. The screen module according to claim 10, characterized in that, The flow guiding structure (1013) includes a flow guiding layer (10131). At least a portion of the flow guiding layer (10131) is located on the side of the overflow groove (1011) away from the edge of the cover plate (101), and / or, at least a portion of the flow guiding layer (10131) extends into the overflow groove (1011) and is located on the side wall of the overflow groove (1011) away from the edge of the cover plate (101) and / or on the bottom wall of the overflow groove (1011).

13. The screen module according to claim 12, characterized in that, The flow-guiding layer (10131) is a hydrophilic layer.

14. The screen module according to claim 12, characterized in that, The fluid guiding layer (10131) is made of any one of polyoxyethylene ether, siloxane, sulfonate and sulfate salt.

15. The screen module according to claim 12, characterized in that, The material of the flow guiding layer (10131) is any one of polyethylene glycol, polydimethylsiloxane, sodium dodecylbenzenesulfonate, and sodium dodecyl sulfate.

16. The screen module according to any one of claims 1-6, 9 and 11-15, characterized in that, The glue overflow tank (1011) satisfies at least one of the following: The width of the overflow groove (1011) is in the range of 0.01-0.1mm; The depth of the overflow groove (1011) is in the range of 0.01-0.1 mm; The distance between the overflow groove (1011) and the edge of the cover plate (101) is in the range of 0.2-1.2mm.

17. The screen module according to any one of claims 1-6, 9 and 11-15, characterized in that, The film layer to be bonded (103) is the film layer on the side of the display panel or touch panel near the cover plate (101); The colloidal layer (102) is an optical adhesive layer; and / or, The cover plate (101) is a glass cover plate.

18. The screen module according to any one of claims 1-6, 9 and 11-15, characterized in that, The overflow groove (1011) is an annular groove.

19. The screen module according to any one of claims 1-6, 9 and 11-15, characterized in that, The glue overflow channel (1011) includes a plurality of sub-glue overflow channels (10111), which are independent of each other and extend sequentially along a direction parallel to the edge of the cover plate (101).

20. The screen module according to claim 19, characterized in that, The plurality of overflow glue tanks (10111) include at least the following portions: At least one sub-overflow groove (10111) located at at least one corner of the cover plate (101). At least one sub-overflow groove (10111) extending in a direction parallel to either side of the cover plate (101).

21. The screen module according to claim 20, characterized in that, The plurality of overflow glue tanks (10111) include at least the following portions: m sub-overflow grooves (10111) located at the m corners of the cover plate (101), where m is an integer greater than or equal to 3; and n sub-overflow grooves (10111) parallel to the n sides of the cover plate (101), where n is an integer greater than or equal to 3; or, The plurality of overflow glue tanks (10111) include at least the following portions: m sub-overflow glue channels (10111) located at m corners of the cover plate (101), where m is an integer greater than or equal to 3; and multiple sub-overflow glue channels (10111) extending along any side of the cover plate (101), independent of each other and located on the same extension line.

22. The screen module according to any one of claims 1-6, 9, 11-15 and 20-21, characterized in that, The cross-section of the overflow groove (1011) is any of the following: a triangle, an arc, a trapezoid, a U-shape, or at least a portion of a polygon with 4 or more sides.

23. The screen module according to any one of claims 1-6, 9, 11-15 and 20-21, characterized in that, The glue overflow tank (1011) satisfies at least one of the following: At least one corner of the cross-section of the overflow groove (1011) is a rounded transition; At least one angle formed by the overflow groove (1011) and the surface of the cover plate (101) facing the adhesive layer (102) is a rounded transition.

24. An electronic device, characterized in that, Includes the screen module (10) as described in any one of claims 1-23.

25. The electronic device according to claim 24, characterized in that, Includes the middle frame (20) and the border (30); The screen module (10) is mounted on the middle frame (20), and the edge of the cover plate (101) of the screen module (10) contacts the frame (30).

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