A headset test module

Abstract

The utility model discloses a earphone test module is applied to earphone, and earphone includes earphone main part and microphone, and the inside of earphone main part is equipped with circuit board, and is equipped with main control chip and audio codec that links with main control chip on circuit board, and audio codec links with earphone main part and microphone, and earphone test module installs on circuit board, and earphone test module links with audio codec, to make the earphone signal of audio codec output transmission to the microphone pin of audio codec after through earphone test module. The utility model discloses earphone test module can be set up on the circuit board of earphone main part and links with audio codec, to make the earphone signal of audio codec output transmission to the microphone pin of audio codec after microphone signal is converted to through earphone test module, utilizes audio codec to the microphone signal of conversion and obtains the analysis, realizes earphone signal and microphone signal's test, completes earphone and microphone's function test.

Description

Technical Field

[0001] This utility model relates to the field of electronic circuit technology, and in particular to an earphone testing module. Background Technology

[0002] Existing headphone functional testing methods primarily involve connecting the headphone output signal to a dedicated audio analyzer. The analyzer then analyzes the electrical signal to measure parameters such as frequency, power, total harmonic distortion plus noise, and signal-to-noise ratio. However, using a dedicated audio analyzer is costly, and relying on a dedicated analyzer outside the headphones for signal analysis results in low testing efficiency. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide an earphone testing module to improve testing efficiency and reduce costs.

[0004] To solve the above-mentioned technical problems, the purpose of this utility model is achieved through the following technical solution: A headphone testing module is provided, applied to a headphone. The headphone includes a headphone body and a microphone. A circuit board is provided inside the headphone body. A main control chip and an audio codec connected to the main control chip are provided on the circuit board. The audio codec is connected to the headphone body and the microphone. The headphone testing module is mounted on the circuit board and connected to the audio codec, so that the headphone signal output by the audio codec is converted into a microphone signal by the headphone testing module and transmitted to the microphone pin of the audio codec.

[0005] The further technical solution is as follows: the headphone test module includes a first relay, a second relay, a third relay and a first capacitor. The third relay is connected to the audio pin of the audio codec. The third relay is connected to the first relay via the first capacitor. The first relay is connected to the microphone pin of the audio codec via the second relay.

[0006] The further technical solution is as follows: the audio pins of the audio codec include a left channel audio pin and a right channel audio pin; the microphone pins of the audio codec include a microphone pin ground terminal and a microphone pin audio terminal; the left channel audio pin is connected to the normally closed contact of the third relay; the right channel audio pin is connected to the normally open contact of the third relay; the switching contact of the third relay is connected to the first terminal of the first capacitor; the second terminal of the first capacitor is connected to the normally open contact of the first relay; the switching contact of the first relay is connected to the first normally open contact and the first normally closed contact of the second relay, respectively; the first switching contact of the second relay is connected to the microphone pin ground terminal; the second switching contact of the second relay is connected to the microphone pin audio terminal; and the second normally closed contact and the second normally open contact of the second relay are connected to the main control chip.

[0007] The further technical solution is as follows: the positive terminals of the coils of the first relay, the second relay, and the third relay are all connected to the power supply, and the negative terminals of the coils of the first relay, the second relay, and the third relay are connected to the main control chip.

[0008] The further technical solution is as follows: the left channel audio pin and the normally closed contact of the third relay are both connected to the first end of the seventh resistor, the second end of the seventh resistor is connected to the main control chip through the fourth switch and the ninth resistor, the right channel audio pin and the normally open contact of the third relay are both connected to the first end of the sixth resistor, and the second end of the sixth resistor is connected to the main control chip through the third switch and the eighth resistor.

[0009] The further technical solution is as follows: the third switch and the fourth switch are both NMOS transistors, the gate of the fourth switch is connected to the ninth resistor, the source of the fourth switch is grounded, the drain of the fourth switch is connected to the second end of the seventh resistor, the gate of the third switch is connected to the eighth resistor, the source of the third switch is grounded, and the drain of the third switch is connected to the second end of the sixth resistor.

[0010] The further technical solution is as follows: the switching contact of the first relay, the first normally open contact of the second relay, and the first normally closed contact of the second relay are all connected to the first end of the third resistor. The second end of the third resistor is connected to the main control chip through the second switching transistor and the fifth resistor. The second normally closed contact of the second relay is connected to the second normally open contact of the second relay and then connected to the main control chip through the first switching transistor and the fourth resistor.

[0011] The further technical solution is as follows: both the first switching transistor and the second switching transistor are NMOS transistors. The gate of the second switching transistor is connected to the fifth resistor, the source of the second switching transistor is grounded, the drain of the second switching transistor is connected to the second end of the third resistor, the gate of the first switching transistor is connected to the fourth resistor, the source of the first switching transistor is grounded, and the drain of the first switching transistor is connected to the second normally closed contact and the second normally open contact of the second relay, respectively.

[0012] The further technical solution is as follows: the headphone test module also includes a connector, which is connected to the audio pins and microphone pins of the audio codec.

[0013] The further technical solution is as follows: the headphone test module also includes an indicator light circuit, which includes a voltage regulator chip and a light-emitting diode. The voltage input pin of the voltage regulator chip is connected to the power supply, and the output terminal of the voltage regulator chip is connected to the anode of the light-emitting diode through a tenth resistor. The cathode of the light-emitting diode is grounded, and the tenth resistor is also connected to the working voltage terminal.

[0014] The beneficial technical effects of this utility model are as follows: The headphone test module of this utility model is set on the circuit board of the headphone body and connected to the audio codec. The headphone signal output by the audio codec is converted into a microphone signal by the headphone test module and then transmitted to the microphone pin of the audio codec. The audio codec analyzes the converted microphone signal to realize the testing of headphone signal and microphone signal, and completes the functional testing of headphone and microphone at the same time. Signal distortion testing can be performed through the audio codec to detect signal quality. There is no need to connect a dedicated audio analyzer, which is low in cost and high in testing efficiency, and is conducive to automated testing. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A circuit diagram of the headphone testing module provided in an embodiment of this utility model; Figure 2 The circuit diagram of the indicator light circuit of the headphone test module provided in this embodiment of the utility model. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figure 1 , Figure 1 This is a circuit diagram of an earphone testing module provided in an embodiment of the present invention. The earphone testing module is applied to an earphone, which includes an earphone body and a microphone. The earphone body has a circuit board inside, on which a main control chip and an audio codec connected to the main control chip are provided. The audio codec is connected to the earphone body and the microphone. The earphone testing module is mounted on the circuit board and is connected to the audio codec so that the earphone signal output by the audio codec is converted into a microphone signal by the earphone testing module and then transmitted to the microphone pin of the audio codec.

[0019] The audio codec's audio pins are connected to the headphone body, allowing the headphone body to play the signal output from the audio codec's audio pins. The audio codec's microphone pins are connected to the microphone to receive the signal collected by the microphone. The audio codec can perform Fourier transform on the received signal and calculate the signal's frequency, power, total harmonic distortion plus noise, and signal-to-noise ratio to determine if the signal is qualified, thus realizing the corresponding signal testing function. The headphone test module is set on the circuit board of the headphone body and connected to the audio codec. The headphone signal output by the audio codec is converted into a microphone signal by the headphone test module and then transmitted to the microphone pin of the audio codec. The audio codec analyzes the converted microphone signal to test the headphone and microphone signals, simultaneously completing the functional tests of the headphone and microphone. Furthermore, the audio codec can perform signal distortion testing to detect signal quality. It eliminates the need for a dedicated audio analyzer, resulting in low cost, high testing efficiency, and facilitating automated testing.

[0020] Preferably, the headphone testing module includes a first relay K1, a second relay K2, a third relay K3, and a first capacitor C1. The third relay K3 is connected to the audio pin of the audio codec. The third relay K3 is connected to the first relay K1 via the first capacitor C1. The first relay K1 is connected to the microphone pin of the audio codec via the second relay K2. The headphone signal output from the audio pin of the audio codec can be switched by the third relay K3 and then sequentially transmitted through the first capacitor C1, the first relay K1, and the second relay K2 to the microphone pin of the audio codec. This realizes the feedback of the headphone signal output by the audio codec to the microphone pin of the audio codec, so that the audio codec can analyze the feedback signal.

[0021] Specifically, in some embodiments, the audio pins of the audio codec include a left channel audio pin LEFT and a right channel audio pin RIGHT. The microphone pins of the audio codec include a microphone pin ground terminal HS3_CONN and a microphone pin audio terminal HS4_CONN. The left channel audio pin LEFT is connected to the normally closed contact of the third relay K3, and the right channel audio pin RIGHT is connected to the normally open contact of the third relay K3. The switching contact of the third relay K3 is connected to the first terminal of the first capacitor C1, and the second terminal of the first capacitor C1 is connected to the normally open contact of the first relay K1. The switching contact of the first relay K1 is connected to the first normally open contact and the first normally closed contact of the second relay K2, respectively. The first switching contact of the second relay K2 is connected to the microphone pin ground terminal HS3_CONN, and the second switching contact of the second relay K2 is connected to the microphone pin audio terminal HS4_CONN. The second normally closed contact and the second normally open contact of the second relay K2 are connected to the main control chip. The second relay K2 is connected to the main control chip, so that the operation of the headphone test module can be controlled by the main control chip.

[0022] Specifically, the positive terminals of the coils of the first relay K1, the second relay K2, and the third relay K3 are all connected to a power supply, while the negative terminals of the coils of the first relay K1, the second relay K2, and the third relay K3 are connected to the main control chip. The main control chip can be connected to the negative terminals of the coils of the first relay K1, the second relay K2, and the third relay K3 via a transistor driver chip. A 5V power supply can be used. Figure 1The power supply can be designated as 5V. The power supply can be located on the circuit board and connected to the main control chip, which then controls the output of the corresponding voltage to the appropriate module.

[0023] Preferably, the left channel audio pin LEFT and the normally closed contact of the third relay K3 are both connected to the first end of the seventh resistor R7. The second end of the seventh resistor R7 is connected to the main control chip via the fourth switch Q4 and the ninth resistor R9. The right channel audio pin RIGHT and the normally open contact of the third relay K3 are both connected to the first end of the sixth resistor R6. The second end of the sixth resistor R6 is connected to the main control chip via the third switch Q3 and the eighth resistor R8. The sixth resistor R6 and the seventh resistor R7 serve as analog loads for the headphone body to ensure stable headphone signals.

[0024] Specifically, in this embodiment, the third switch Q3 and the fourth switch Q4 are both NMOS transistors. The gate of the fourth switch Q4 is connected to the ninth resistor R9, the source of the fourth switch Q4 is grounded, and the drain of the fourth switch Q4 is connected to the second terminal of the seventh resistor R7. The gate of the third switch Q3 is connected to the eighth resistor R8, the source of the third switch Q3 is grounded, and the drain of the third switch Q3 is connected to the second terminal of the sixth resistor R6.

[0025] Preferably, the switching contact of the first relay K1, the first normally open contact of the second relay K2, and the first normally closed contact of the second relay K2 are all connected to the first end of the third resistor R3. The second end of the third resistor R3 is connected to the main control chip via the second switch Q2 and the fifth resistor R5. The second normally closed contact of the second relay K2 is connected to the second normally open contact of the second relay K2 and then connected to the main control chip via the first switch Q1 and the fourth resistor R4. The third resistor R3 serves as the analog load for the microphone, ensuring the stability of the microphone signal transmitted to the microphone pin of the audio codec.

[0026] Specifically, in this embodiment, both the first switch Q1 and the second switch Q2 are NMOS transistors. The gate of the second switch Q2 is connected to the fifth resistor R5, the source of the second switch Q2 is grounded, and the drain of the second switch Q2 is connected to the second terminal of the third resistor R3. The gate of the first switch Q1 is connected to the fourth resistor R4, the source of the first switch Q1 is grounded, and the drain of the first switch Q1 is connected to the second normally closed contact and the second normally open contact of the second relay K2, respectively.

[0027] Preferably, the headphone testing module further includes a connector J1, which is connected to the audio pins and microphone pins of the audio codec. The normally open and normally closed contacts of the third relay K3 are connected to the audio pins of the audio codec via connector J1, and the first and second switching contacts of the second relay K2 are connected to the ground terminal HS3_CONN and the audio terminal HS4_CONN of the microphone pin of the audio codec, respectively, via connector J1.

[0028] Combination Figure 2 Specifically, in some embodiments, the headphone test module further includes an indicator light circuit. The indicator light circuit includes a voltage regulator chip U1 and a light-emitting diode (LED1). The voltage input pin VIN of the voltage regulator chip U1 is connected to the power supply. The output terminal of the voltage regulator chip U1 is connected to the anode of the LED1 via a tenth resistor R10. The cathode of the LED1 is grounded. The tenth resistor R10 is also connected to the operating voltage terminal. The power supply can be a 5V power supply. Figure 2 The power supply can be denoted as 5V. The power supply can be located on the circuit board and connected to the main control chip. The operating voltage terminal can provide a voltage of 3.3V. Figure 2 The working voltage terminal is denoted as 3V3. The working voltage terminal can be provided through the pins of the main control chip to control the working state of LED1 based on the test results of the headphone and microphone functions obtained from the audio codec test.

[0029] In summary, the headphone test module of this invention is mounted on the circuit board of the headphone body and connected to the audio codec. This allows the headphone signal output from the audio codec to be converted into a microphone signal and transmitted to the microphone pin of the audio codec. The audio codec analyzes the converted microphone signal to test both the headphone and microphone signals, simultaneously performing functional tests on both the headphone and microphone. Furthermore, the audio codec allows for signal distortion testing to detect signal quality. This eliminates the need for a dedicated audio analyzer, resulting in low cost, high testing efficiency, and facilitating automated testing.

[0030] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. A headphone testing module, characterized in that, The invention pertains to headphones, which include a headphone body and a microphone. The headphone body has an internal circuit board containing a main control chip and an audio codec connected to the main control chip. The audio codec is connected to the headphone body and the microphone. A headphone test module is mounted on the circuit board and connected to the audio codec, enabling the headphone signal output by the audio codec to be converted into a microphone signal and transmitted to the microphone pin of the audio codec.

2. The headphone testing module according to claim 1, characterized in that, The headphone testing module includes a first relay, a second relay, a third relay, and a first capacitor. The third relay is connected to the audio pin of the audio codec. The third relay is connected to the first relay via the first capacitor. The first relay is connected to the microphone pin of the audio codec via the second relay.

3. The headphone testing module according to claim 2, characterized in that, The audio codec has audio pins including a left channel audio pin and a right channel audio pin. The microphone pins of the audio codec include a microphone pin ground terminal and a microphone pin audio terminal. The left channel audio pin is connected to the normally closed contact of the third relay, and the right channel audio pin is connected to the normally open contact of the third relay. The switching contact of the third relay is connected to the first terminal of the first capacitor, and the second terminal of the first capacitor is connected to the normally open contact of the first relay. The switching contact of the first relay is connected to the first normally open contact and the first normally closed contact of the second relay, respectively. The first switching contact of the second relay is connected to the microphone pin ground terminal, and the second switching contact of the second relay is connected to the microphone pin audio terminal. The second normally closed contact and the second normally open contact of the second relay are connected to the main control chip.

4. The headphone testing module according to claim 3, characterized in that, The positive terminals of the coils of the first relay, the second relay, and the third relay are all connected to a power source, while the negative terminals of the coils of the first relay, the second relay, and the third relay are connected to the main control chip.

5. The headphone testing module according to claim 3, characterized in that, The left channel audio pin and the normally closed contact of the third relay are both connected to the first end of the seventh resistor. The second end of the seventh resistor is connected to the main control chip via the fourth switch and the ninth resistor. The right channel audio pin and the normally open contact of the third relay are both connected to the first end of the sixth resistor. The second end of the sixth resistor is connected to the main control chip via the third switch and the eighth resistor.

6. The headphone testing module according to claim 5, characterized in that, Both the third and fourth switching transistors are NMOS transistors. The gate of the fourth switching transistor is connected to the ninth resistor, the source of the fourth switching transistor is grounded, and the drain of the fourth switching transistor is connected to the second terminal of the seventh resistor. The gate of the third switching transistor is connected to the eighth resistor, the source of the third switching transistor is grounded, and the drain of the third switching transistor is connected to the second terminal of the sixth resistor.

7. The headphone testing module according to claim 3, characterized in that, The first relay's switching contact, the second relay's first normally open contact, and the second relay's first normally closed contact are all connected to the first end of the third resistor. The second end of the third resistor is connected to the main control chip via the second switching transistor and the fifth resistor. The second normally closed contact of the second relay is connected to the second normally open contact of the second relay and then connected to the main control chip via the first switching transistor and the fourth resistor.

8. The headphone testing module according to claim 7, characterized in that, Both the first and second switching transistors are NMOS transistors. The gate of the second switching transistor is connected to the fifth resistor, the source of the second switching transistor is grounded, and the drain of the second switching transistor is connected to the second end of the third resistor. The gate of the first switching transistor is connected to the fourth resistor, the source of the first switching transistor is grounded, and the drain of the first switching transistor is connected to the second normally closed contact and the second normally open contact of the second relay, respectively.

9. The headphone testing module according to claim 1, characterized in that, The headphone test module also includes a connector that is connected to the audio pins and microphone pins of the audio codec.

10. The headphone testing module according to claim 1, characterized in that, The headphone testing module also includes an indicator light circuit, which includes a voltage regulator chip and a light-emitting diode. The voltage input pin of the voltage regulator chip is connected to the power supply, and the output terminal of the voltage regulator chip is connected to the anode of the light-emitting diode through a tenth resistor. The cathode of the light-emitting diode is grounded, and the tenth resistor is also connected to the working voltage terminal.

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