A heat dissipation structure

Abstract

The utility model provides a heat dissipation structure, including radiator and a plurality of heat generating devices to be installed, the radiator includes fin part and installation part, the installation part includes first installation side surface and second installation side surface who are opposite to each other, and a plurality of installation sites are included on the first installation side surface and the second installation side surface, and the installation site is used to install the heat generating device in a one -to -one correspondence mode, therefore, the heat dissipation structure of the utility model can install a plurality of heat generating devices at a time, and the fin part is adjacent to the top of heat generating device, is favorable to heat dissipation.

Description

Technical Field

[0001] This utility model relates to heat dissipation of electronic devices, and more specifically, to a heat dissipation structure. Background Technology

[0002] As power requirements for power modules increase, the number of MOSFETs used in these modules is also growing. Installing numerous MOSFETs requires significant space. Furthermore, with the increasing miniaturization of power modules, the available space for MOSFETs is shrinking. Simultaneously, MOSFETs generate substantial heat during operation. If this heat cannot be dissipated in a timely manner, it will negatively impact the operation of the power module.

[0003] Therefore, a mounting structure is needed that can accommodate multiple MOSFETs while effectively dissipating heat from them. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a heat dissipation structure that can install multiple electronic devices in an effective space and help them dissipate heat effectively, in order to address the above-mentioned deficiencies of the prior art.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: a heat dissipation structure is constructed, including a heat sink and a plurality of heat-generating devices to be installed; the heat sink includes a finned portion and a mounting portion; the mounting portion includes a first mounting side and a second mounting side facing away from each other; the first mounting side and the second mounting side include a plurality of mounting positions, which are used to install the heat-generating devices in a one-to-one correspondence manner. In the heat dissipation structure described in this utility model, a first mounting position and a second mounting position are arranged side by side on the first mounting side, a first mounting hole is provided in the center of the first mounting position, and a second mounting hole is provided in the center of the second mounting position. A third mounting position and a fourth mounting position are arranged side by side on the second mounting side. A third mounting hole is provided in the center of the third mounting position, and a fourth mounting hole is provided in the center of the fourth mounting position.

[0006] In the heat dissipation structure described in this utility model, the plurality of heat-generating devices include a first heat-generating device, a second heat-generating device, a third heat-generating device, and a fourth heat-generating device; The first heating element is fixed to the first mounting position by the first fixing screw and the first mounting hole, the second heating element is fixed to the second mounting position by the second fixing screw and the second mounting hole, the third heating element is fixed to the third mounting position by the third fixing screw and the third mounting hole, and the fourth heating element is fixed to the fourth mounting position by the fourth fixing screw and the fourth mounting hole.

[0007] The heat dissipation structure described in this utility model further includes a first ceramic heat sink, a second ceramic heat sink, a third ceramic heat sink, and a fourth ceramic heat sink; The first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink are provided with ceramic heat sink mounting holes; The first ceramic heat sink is installed between the first heating element and the first mounting position by the first fixing screw through its ceramic plate mounting hole; The second ceramic heat sink is mounted between the second heating element and the second mounting position by the second fixing screw through its ceramic mounting hole; The third ceramic heat sink is installed between the third heating element and the third mounting position by the third fixing screw through its ceramic plate mounting hole; The fourth ceramic heat sink is installed between the fourth heating element and the fourth mounting position by the fourth fixing screw through its ceramic plate mounting hole.

[0008] In the heat dissipation structure of this utility model, a rectangular heat dissipation channel is provided inside the mounting part, and the rectangular heat dissipation channel penetrates the mounting part along a first direction; the first direction is perpendicular to the first mounting side and the second mounting side.

[0009] In the heat dissipation structure of this utility model, the fin portion includes a top plate, a fin mounting portion extending from the top plate toward the mounting portion, and a first fin group and a second fin group extending backward from a first side and a second side opposite to each other on the fin mounting portion.

[0010] In the heat dissipation structure described in this utility model, the first fin group includes a plurality of first fins arranged at equal intervals; the second fin group includes a plurality of second fins arranged at equal intervals.

[0011] In the heat dissipation structure of this utility model, the first heat-generating device includes a first MOS transistor, the second heat-generating device includes a second MOS transistor, the third heat-generating device includes a third MOS transistor, and the fourth heat-generating device includes a fourth MOS transistor. A MOS transistor mounting hole is provided in the center of the first MOS transistor, the second MOS transistor, the third MOS transistor, and the fourth MOS transistor; The first fixing screw, the second fixing screw, the third fixing screw, and the fourth fixing screw fix the first MOS transistor, the second MOS transistor, the third MOS transistor, and the fourth MOS transistor respectively through the MOS transistor mounting hole.

[0012] In the heat dissipation structure described in this utility model, thermally conductive silicone grease is coated on the first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink. Thermal grease is applied to the side of the first heating device, the second heating device, the third heating device, and the fourth heating device facing the first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink, respectively.

[0013] The heat dissipation structure of this utility model includes a heat sink and multiple heat-generating devices to be installed. The heat sink includes a finned portion and a mounting portion. The mounting portion includes a first mounting side and a second mounting side facing away from each other. The first mounting side and the second mounting side include multiple mounting positions, which are used to install the heat-generating devices in a one-to-one correspondence manner. Therefore, the heat dissipation structure of this utility model can install multiple heat-generating devices at one time, and the finned portion is adjacent to the upper part of the heat-generating devices, which is beneficial for heat dissipation. Attached Figure Description

[0014] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings: Figure 1 This is an exploded view of the heat dissipation structure of this utility model; Figure 2 This is a perspective view of the heat dissipation structure of this utility model; Figure 3 This is a front view of the heat dissipation structure of this utility model; Figure 4 This is a side view of the heat dissipation structure of this utility model. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0016] Figure 1 This is an exploded view of the heat dissipation structure of this utility model. Figure 2 This is a three-dimensional view of the heat dissipation structure of this utility model. Figure 3 This is a front view of the heat dissipation structure of this utility model. Figure 4 This is a side view of the heat dissipation structure of this utility model. (See attached image.) Figures 1-4As shown, a heat dissipation structure of this utility model includes a heat sink 100 and a plurality of heat-generating devices 200. The heat sink 100 includes a finned portion 110 and a mounting portion 120; the mounting portion 120 includes a first mounting side 121 and a second mounting side 122 facing each other; the first mounting side 121 and the second mounting side 122 include a plurality of mounting positions, which are used to mount the heat-generating devices in a one-to-one correspondence manner, that is, the plurality of heat-generating devices 200 are mounted one-to-one on the plurality of mounting positions.

[0017] In a preferred embodiment of this invention, the heating device is preferably a MOSFET. The first mounting side 121 and the second mounting side 122 each include two mounting positions, for a total of four mounting positions.

[0018] The heat dissipation structure of this utility model includes a heat sink and multiple heat-generating devices to be installed. The heat sink includes a finned portion and a mounting portion. The mounting portion includes a first mounting side and a second mounting side facing away from each other. The first mounting side and the second mounting side include multiple mounting positions, which are used to install the heat-generating devices in a one-to-one correspondence manner. Therefore, the heat dissipation structure of this utility model can install multiple heat-generating devices at one time, and the finned portion is adjacent to the upper part of the heat-generating devices, which is beneficial for heat dissipation.

[0019] Further as Figures 1-4 As shown, a first mounting position and a second mounting position are arranged side by side on the first mounting side 121. A first mounting hole 1211 is provided in the center of the first mounting position, and a second mounting hole 1212 is provided in the center of the second mounting position. A third mounting position and a fourth mounting position are arranged side by side on the second mounting side 122. A third mounting hole is provided in the center of the third mounting position, and a fourth mounting hole is provided in the center of the fourth mounting position.

[0020] The plurality of heating devices 200 includes a first heating device 210, a second heating device 220, a third heating device 230, and a fourth heating device 240; the first heating device 210 is fixed to the first mounting position by a first fixing screw 310 and a first mounting hole 1211, the second heating device 220 is fixed to the second mounting position by a second fixing screw 320 and a second mounting hole, the third heating device 230 is fixed to the third mounting position by a third fixing screw 330 and a third mounting hole, and the fourth heating device 240 is fixed to the fourth mounting position by a fourth fixing screw 340 and a fourth mounting hole. Preferably, the first heating device 210, the second heating device 220, the third heating device 230, and the fourth heating device 240 are the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET, respectively; a MOSFET mounting hole is provided in the center of the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET; the first fixing screw 310, the second fixing screw 320, the third fixing screw 330, and the fourth fixing screw 340 fix the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET, respectively, through the MOSFET mounting hole.

[0021] like Figures 1-4 As shown, the heat dissipation structure of this utility model further includes a first ceramic heat sink 410, a second ceramic heat sink 420, a third ceramic heat sink 430, and a fourth ceramic heat sink 440; the first ceramic heat sink 410, the second ceramic heat sink 420, the third ceramic heat sink 430, and the fourth ceramic heat sink 440 are provided with ceramic plate mounting holes; the first ceramic heat sink 410 is mounted between the first heating device 210 and the first mounting position by a first fixing screw through its ceramic plate mounting hole; the second ceramic heat sink 420 is mounted between the second heating device 220 and the second mounting position by a second fixing screw through its ceramic plate mounting hole; the third ceramic heat sink 430 is mounted between the third heating device 230 and the third mounting position by a third fixing screw through its ceramic plate mounting hole; and the fourth ceramic heat sink 440 is mounted between the fourth heating device 240 and the fourth mounting position by a fourth fixing screw through its ceramic plate mounting hole. Setting up the first ceramic heat sink 410, the second ceramic heat sink 420, the third ceramic heat sink 430 and the fourth ceramic heat sink 440 can help to further dissipate heat from the first heating device 210, the second heating device 220, the third heating device 230 and the fourth heating device 240.

[0022] Preferably, thermally conductive silicone grease is applied to the first ceramic heat sink 410, the second ceramic heat sink 420, the third ceramic heat sink 430, and the fourth ceramic heat sink 440; thermally conductive silicone grease is applied to the side of the first heating device 210, the second heating device 220, the third heating device 230, and the fourth heating device 240 facing the first ceramic heat sink 410, the second ceramic heat sink 420, the third ceramic heat sink 430, and the fourth ceramic heat sink 440.

[0023] like Figures 1-4 As shown, a rectangular heat dissipation channel 123 is provided inside the mounting part 120, and the rectangular heat dissipation channel 123 penetrates the mounting part 120 along a first direction; the first direction is perpendicular to the first mounting side 121 and the second mounting side 122.

[0024] like Figures 1-4 As shown, the fin portion 110 includes a top plate 111, a fin mounting portion 112 extending from the top plate 111 toward the mounting portion 120, and a first fin group 113 and a second fin group 114 extending back-to-back from a first side and a second side opposite to each other on the fin mounting portion 112. The first fin group 113 includes a plurality of equidistantly arranged first fins; the second fin group 114 includes a plurality of equidistantly arranged second fins.

[0025] The heat dissipation structure of this utility model includes a heat sink, four ceramic plates, four MOSFETs, and four fixing screws. First, apply thermal grease evenly to the mounting surface of the MOSFETs and the ceramic plates. Then, use the fixing screws to fix the MOSFETs and ceramic plates to the heat sink. Finally, insert the heat dissipation structure into the designated position on the PCB board and fix it with solder in a soldering iron.

[0026] The heat dissipation structure of this utility model has a compact design and occupies little installation space. MOSFETs are mounted back-to-back, allowing for up to twice the number of MOSFETs to be integrated into the same space. The central mounting section of this heat dissipation structure preferably features a thickened 8mm main rib for rapid heat conduction and dissipation. The sides are flanked by densely packed symmetrical heat dissipation fins. A rectangular heat dissipation channel 123 is designed in the center of the mounting section to quickly remove some of the heat from the MOSFETs. Cooling airflow from the heatsink fins simultaneously removes heat from both above and below, achieving a rapid heat dissipation effect.

[0027] Although this utility model has been described through specific embodiments, those skilled in the art should understand that various modifications and equivalent substitutions can be made to this utility model without departing from its scope. Furthermore, various modifications can be made to this utility model for specific situations or materials without departing from its scope. Therefore, this utility model is not limited to the specific embodiments disclosed, but should include all embodiments falling within the scope of the claims of this utility model.

[0028] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A heat dissipation structure, characterized in that, The device includes a heat sink and multiple heat-generating devices to be installed; the heat sink includes a finned portion and a mounting portion; the mounting portion includes a first mounting side and a second mounting side facing away from each other; the first mounting side and the second mounting side include multiple mounting positions, which are used to install the heat-generating devices in a one-to-one correspondence manner.

2. The heat dissipation structure according to claim 1, characterized in that, A first mounting position and a second mounting position are arranged side by side on the first mounting side. A first mounting hole is provided in the center of the first mounting position, and a second mounting hole is provided in the center of the second mounting position. A third mounting position and a fourth mounting position are arranged side by side on the second mounting side. A third mounting hole is provided in the center of the third mounting position, and a fourth mounting hole is provided in the center of the fourth mounting position.

3. The heat dissipation structure according to claim 2, characterized in that, The plurality of heating devices includes a first heating device, a second heating device, a third heating device, and a fourth heating device; The first heating element is fixed to the first mounting position by the first fixing screw and the first mounting hole, the second heating element is fixed to the second mounting position by the second fixing screw and the second mounting hole, the third heating element is fixed to the third mounting position by the third fixing screw and the third mounting hole, and the fourth heating element is fixed to the fourth mounting position by the fourth fixing screw and the fourth mounting hole.

4. The heat dissipation structure according to claim 3, characterized in that, It further includes a first ceramic heat sink, a second ceramic heat sink, a third ceramic heat sink, and a fourth ceramic heat sink; The first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink are provided with ceramic heat sink mounting holes; The first ceramic heat sink is installed between the first heating element and the first mounting position by the first fixing screw through its ceramic plate mounting hole; The second ceramic heat sink is mounted between the second heating element and the second mounting position by the second fixing screw through its ceramic mounting hole; The third ceramic heat sink is installed between the third heating element and the third mounting position by the third fixing screw through its ceramic plate mounting hole; The fourth ceramic heat sink is installed between the fourth heating element and the fourth mounting position by the fourth fixing screw through its ceramic plate mounting hole.

5. The heat dissipation structure according to claim 4, characterized in that, A rectangular heat dissipation channel is provided inside the mounting part, and the rectangular heat dissipation channel runs through the mounting part along a first direction; the first direction is perpendicular to the first mounting side and the second mounting side.

6. The heat dissipation structure according to claim 4, characterized in that, The fin portion includes a top plate, a fin mounting portion extending from the top plate toward the mounting portion, and a first fin group and a second fin group extending backward from each other on a first side and a second side opposite to each other on the fin mounting portion.

7. The heat dissipation structure according to claim 6, characterized in that, The first fin group includes a plurality of equidistant first fins; the second fin group includes a plurality of equidistant second fins.

8. The heat dissipation structure according to any one of claims 3 to 7, characterized in that, The first heating device includes a first MOSFET, the second heating device includes a second MOSFET, the third heating device includes a third MOSFET, and the fourth heating device includes a fourth MOSFET. A MOSFET mounting hole is provided in the center of the first MOSFET, the second MOSFET, the third MOSFET, and the fourth MOSFET; The first fixing screw, the second fixing screw, the third fixing screw, and the fourth fixing screw fix the first MOS transistor, the second MOS transistor, the third MOS transistor, and the fourth MOS transistor respectively through the MOS transistor mounting hole.

9. The heat dissipation structure according to any one of claims 4 to 7, characterized in that, Thermal grease is applied to the first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink. Thermal grease is applied to the side of the first heating device, the second heating device, the third heating device, and the fourth heating device facing the first ceramic heat sink, the second ceramic heat sink, the third ceramic heat sink, and the fourth ceramic heat sink, respectively.

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