A single wafer spin cleaning apparatus

Abstract

The utility model discloses a single wafer rotation cleaning device belongs to single wafer processing technical field, including the cleaning shell, the inner wall fixed connection of cleaning shell has the clamping mechanism, and the lateral surface fixed connection of cleaning shell has the cleaning mechanism, the clamping mechanism includes fixed connection in the cleaning shell inner wall seal casing and cross, the upper surface fixed connection of cross has the second electric telescopic handle, and the output fixed connection of second electric telescopic handle has the lifting casing, this single wafer rotation cleaning device provides firm support for electric telescopic handle through cross, and fixed plate through -hole is accurate guidance for sliding block, through the linkage of hinged plate, and single power source can drive multiple sliding blocks synchronous movement, and the position of rotating seat is adjusted flexibly, adapts to different specifications wafer, reduces the equipment replacement cost, and rubber pad supports wafer, avoids hard contact and scratches, and also can assist wafer and rotating seat separation, and the convenient dismounting.

Description

Technical Field

[0001] This utility model relates to the field of single-wafer processing technology, specifically a single-wafer rotary cleaning device. Background Technology

[0002] In the semiconductor manufacturing industry, the cleanliness of a single wafer directly affects the precision and yield of subsequent processes such as photolithography and etching. Therefore, wafer cleaning equipment is a key supporting equipment.

[0003] Traditional clamping mechanisms are mostly designed with fixed specifications, which can only accommodate wafers of a single size. When the wafer size changes, the entire clamping assembly needs to be replaced, which not only increases equipment costs but also extends production and debugging time. In addition, the clamping process often uses a hard contact method, which can easily cause scratches on the wafer surface. At the same time, cleaning fluid can easily seep into the clamping mechanism, causing corrosion of transmission components and shortening the service life of the equipment. Furthermore, wafer disassembly requires manual assistance, which is cumbersome and poses a risk of wafers falling. It is also inconvenient to clean wafers of different sizes.

[0004] To address these issues, this invention provides a single-wafer rotary cleaning device. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides a single-wafer rotary cleaning device, which solves the aforementioned problems.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a single-wafer rotary cleaning device, comprising a cleaning housing, a clamping mechanism fixedly connected to the inner wall of the cleaning housing, and a cleaning mechanism fixedly connected to the side surface of the cleaning housing. The clamping mechanism includes a sealing shell and a cross fixedly connected to the inner wall of the cleaning housing. A first electric telescopic rod is fixedly connected to the upper surface of the cross, and a lifting shell is fixedly connected to the output end of the first electric telescopic rod. A fixing plate is fixedly connected to the inner wall of the cleaning housing, and a first through hole and a second through hole are formed on the outer surface of the fixing plate. The cleaning mechanism includes a first sliding block and a second sliding block that are slidably connected together. A rotating seat is rotatably connected to the upper surfaces of the first sliding block and the second sliding block. A single wafer body is attached to the outer surface of the rotating seat. The cleaning mechanism includes a water tank that is fixedly connected to the side surface of the cleaning housing. A third electric telescopic rod is fixedly connected to the upper surface of the water tank. A lifting plate is fixedly connected to the output end of the third electric telescopic rod. A second motor is fixedly connected to the outer surface of the lifting plate. A cleaning roller is fixedly connected to the output end of the second motor. A blower is fixedly connected to the outer surface of the lifting plate. An air outlet duct is fixedly connected to the air outlet of the blower.

[0007] Furthermore, the outer surface of the second sliding block is slidably connected to the inner wall of the second through hole, and a waterproof motor is fixedly connected to the lower surface of the second sliding block, with the output end of the waterproof motor fixedly connected to the outer surface of the rotating seat.

[0008] By adopting the above technical solution, the sliding cooperation between the second sliding block and the second through hole ensures smooth movement. The waterproof motor prevents water from entering the motor during the cleaning process and causing malfunctions, thus extending the service life of the equipment. The waterproof motor directly drives the rotating seat to rotate, which has high transmission efficiency and can drive the wafer to rotate synchronously and stably, providing a foundation for subsequent rotational cleaning and uniform decontamination, and ensuring that the cleaning intensity of each area on the wafer surface is consistent.

[0009] Furthermore, the outer surface of the second sliding block is slidably connected to the outer surface of the first through hole, and the outer surfaces of the second sliding block and the first sliding block are hinged with a hinge plate, the other end of which is hinged to the outer surface of the lifting housing.

[0010] By adopting the above technical solution, the sliding fit between the sliding block and the through hole is highly accurate, reducing jamming during the movement; the hinge plate realizes the linkage between the sliding block and the lifting housing, and multiple sliding blocks can be driven to move synchronously by a single power source, ensuring symmetrical adjustment of the clamping mechanism, avoiding wafer clamping offset, and improving clamping accuracy and stability.

[0011] Furthermore, a sealing shell is slidably connected to the inner wall of the lifting housing, the lower surface of the sealing shell is fixedly connected to the inner wall of the cleaning shell, and a second electric telescopic rod is fixedly connected to the upper surface of the lifting housing. A rubber pad is fixedly connected to the output end of the second electric telescopic rod, and the rubber pad is located below the monolithic wafer body.

[0012] By adopting the above technical solution, the sliding cooperation between the lifting housing and the sealing housing combines sealing and mobility, preventing cleaning fluid from seeping into the internal transmission structure; the second electric telescopic rod drives the rubber pad to rise and fall. The rubber pad is soft and can provide stable support for the lower surface of the wafer, while avoiding wafer scratches caused by hard contact. At the same time, the support function separates the wafer from the rotating seat, which facilitates the quick disassembly and replacement of the wafer and improves the convenience of operation.

[0013] Furthermore, a limiting rod is fixedly connected to the upper surface of the water tank, the outer surface of the limiting rod is slidably connected to the outer surface of the lifting plate, a water outlet pipe is fixedly connected to the side surface of the lifting plate, and a drain valve is fixedly connected to the side surface of the cleaning shell.

[0014] The above technical solution uses a limit rod to guide and limit the lifting movement of the lifting plate, avoiding uneven wafer cleaning or collision damage caused by the deviation of the cleaning roller; the water outlet pipe can accurately deliver the cleaning solution to the wafer cleaning area, improving the utilization rate of the cleaning solution; the drain valve facilitates the timely discharge of waste liquid after use, keeping the inside of the cleaning housing clean.

[0015] Furthermore, a water pump is fixedly connected to the side surface of the water tank, and a connecting pipe is fixedly connected to the air outlet of the water pump. The other end of the connecting pipe is fixedly connected to one end of the water outlet pipe. A control panel is fixedly connected to the outer surface of the water tank. The control panel is electrically connected to the third electric telescopic rod, the water pump, the blower, the second motor, the first electric telescopic rod, and the second electric telescopic rod via wires.

[0016] By adopting the above technical solution, a water pump provides stable power to the cleaning fluid, ensuring a continuous and uniform supply of the cleaning fluid and improving the cleaning effect; the connecting pipes enable efficient connection between the water tank and the outlet pipe, reducing cleaning fluid leakage.

[0017] Beneficial effects This invention provides a single-wafer rotary cleaning device. Compared with the prior art, it has the following advantages: 1. This single-wafer rotary cleaning device provides stable support for the electric telescopic rod through the cross, and the through hole of the fixed plate provides precise guidance for the sliding block. Through the linkage of the hinge plate, a single power source can drive multiple sliding blocks to move synchronously, flexibly adjust the position of the rotating seat, adapt to wafers of different specifications, reduce equipment replacement costs, and the rubber pad supports the wafer to avoid hard contact scratches and can also help separate the wafer from the rotating seat for easy disassembly.

[0018] 2. This single-wafer rotary cleaning device precisely adjusts the height of the cleaning roller via a third electric telescopic rod to adapt to different cleaning stages. The rotation of the cleaning roller enhances the cleaning power, and the synchronous liquid supply outlet pipe improves the cleaning effect and reduces liquid waste. The blower and air outlet pipe enable rapid drying after cleaning, avoiding moisture residue that could damage the wafer. It does not require high temperatures, thus protecting the wafer material yield. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a perspective view of the external structure of this utility model; Figure 2 This is a front sectional view of the structure of this utility model; Figure 3 This is a side sectional view of the structure of this utility model; Figure 4 This is a top sectional view of the structure of this utility model.

[0021] In the diagram: 1. Cleaning housing; 2. Clamping mechanism; 201. First sliding block; 202. Second sliding block; 203. Rotating seat; 204. Fixing plate; 205. Hinge plate; 206. Lifting housing; 207. First electric telescopic rod; 208. Sealing housing; 209. Cross; 210. Rubber pad; 211. Second electric telescopic rod; 212. First through hole; 213. Waterproof motor; 214. Second through hole; 3. Cleaning mechanism; 301. Blower; 302. Air outlet duct; 303. Cleaning roller; 304. Second motor; 305. Water outlet duct; 306. Connecting duct; 307. Water pump; 308. Third electric telescopic rod; 309. Limiting rod; 310. Drain valve; 311. Water tank; 312. Lifting plate; 4. Control panel; 5. Monolithic wafer body. Detailed Implementation

[0022] It should be noted that in the description of the embodiments of this application, the terms "front," "rear," "left," "right," "up," "down," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0023] The present application will be further described in detail below with reference to the accompanying drawings and embodiments.

[0024] Reference Figures 1 to 4This application provides a single-wafer rotary cleaning device, including a cleaning housing 1. A clamping mechanism 2 is fixedly connected to the inner wall of the cleaning housing 1, and a cleaning mechanism 3 is fixedly connected to the side surface of the cleaning housing 1. The clamping mechanism 2 includes a sealing housing 208 and a cross 209 fixedly connected to the inner wall of the cleaning housing 1. A first electric telescopic rod 207 is fixedly connected to the upper surface of the cross 209. A lifting housing 206 is fixedly connected to the output end of the first electric telescopic rod 207. A fixing plate 204 is fixedly connected to the inner wall of the cleaning housing 1. A first through hole 212 and a second through hole 214 are opened on the outer surface of the fixing plate 204. A first sliding block 201 and a second through hole 214 are slidably connected to the upper surface of the fixing plate 204. Two sliding blocks 202, a rotating seat 203 is rotatably connected to the upper surface of the first sliding block 201 and the second sliding block 202, and a single wafer body 5 is attached to the outer surface of the rotating seat 203. The cleaning mechanism 3 includes a water tank 311 fixedly connected to the side surface of the cleaning housing 1. A third electric telescopic rod 308 is fixedly connected to the upper surface of the water tank 311. A lifting plate 312 is fixedly connected to the output end of the third electric telescopic rod 308. A second motor 304 is fixedly connected to the outer surface of the lifting plate 312. A cleaning roller 303 is fixedly connected to the output end of the second motor 304. A blower 301 is fixedly connected to the outer surface of the lifting plate 312. An air outlet duct 302 is fixedly connected to the air outlet of the blower 301.

[0025] Furthermore, the outer surface of the second sliding block 202 is slidably connected to the inner wall of the second through hole 214, and a waterproof motor 213 is fixedly connected to the lower surface of the second sliding block 202. The output end of the waterproof motor 213 is fixedly connected to the outer surface of the rotating seat 203. The outer surface of the second sliding block 202 is slidably connected to the outer surface of the first through hole 212. A hinge plate 205 is hinged to the outer surfaces of the second sliding block 202 and the first sliding block 201. The other end of the hinge plate 205 is hinged to the outer surface of the lifting housing 206. A sealing housing 208 is slidably connected to the inner wall of the lifting housing 206. The lower surface of the sealing housing 208 is fixedly connected to the inner wall of the cleaning housing 1. A second electric telescopic rod 211 is fixedly connected to the upper surface of the lifting housing 206. A rubber pad 210 is fixedly connected to the output end of the second electric telescopic rod 211. The rubber pad 210 is located below the monolithic wafer body 5.

[0026] Specifically, the cross 209 provides stable support for the electric telescopic rod, the through hole of the fixing plate 204 provides precise guidance for the sliding block, and the linkage plate 205 enables a single power source to drive multiple sliding blocks to move synchronously, flexibly adjusting the position of the rotating seat 203 to adapt to different specifications of wafers, reducing equipment replacement costs, and the rubber pad 210 supports the wafer, avoids hard contact scratches, and can also assist in separating the wafer from the rotating seat 203 for easy disassembly.

[0027] Reference Figures 1 to 4In one aspect of this embodiment, a limiting rod 309 is fixedly connected to the upper surface of the water tank 311, the outer surface of the limiting rod 309 is slidably connected to the outer surface of the lifting plate 312, a water outlet pipe 305 is fixedly connected to the side surface of the lifting plate 312, and a drain valve 310 is fixedly connected to the side surface of the cleaning housing 1. The waterproof motor 213 is a QC080A1K030E-8DHHS motor from Qiaochuan Electric Machinery Co., Ltd., and the electric telescopic rods are all from the Shanghai Shuntuo ANT-35 series. The second motor 304 is a QC090A1K030C3-10DTHS motor from Qiaochuan Electric Machinery Co., Ltd., the blower 301 is a small high-pressure blower 301, model Sensen HG-1100, and the control panel 4 is a Weintek TK6071IP.

[0028] Furthermore, a water pump 307 is fixedly connected to the side surface of the water tank 311, and a connecting pipe 306 is fixedly connected to the air outlet of the water pump 307. The other end of the connecting pipe 306 is fixedly connected to one end of the water outlet pipe 305. A control panel 4 is fixedly connected to the outer surface of the water tank 311. The control panel 4 is electrically connected to the third electric telescopic rod 308, the water pump 307, the blower 301, the second motor 304, the first electric telescopic rod 207, and the second electric telescopic rod 211 via wires.

[0029] Specifically, the height of the cleaning roller 303 is precisely adjusted by the third electric telescopic rod 308 to adapt to different cleaning stages. The rotation of the cleaning roller 303 enhances the cleaning power. In conjunction with the synchronous liquid supply water pipe 305, the cleaning effect is improved and liquid waste is reduced. The blower 301 and the air outlet pipe 302 enable rapid drying after cleaning, avoiding moisture residue that could damage the wafer. No high temperature is required, thus protecting the wafer material.

[0030] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0031] Working principle: First, the third electric telescopic rod 308 is activated. The output end of the third electric telescopic rod 308 drives the lifting plate 312 to move upward, causing the lifting plate 312 to slide along the outer surface of the limiting rod 309, thus separating the cleaning roller 303 from the single wafer body 5. Then, the second electric telescopic rod 211 is activated. The output end of the second electric telescopic rod 211 drives the rubber pad 210 to move upward, facilitating support for the lower surface of the single wafer body 5, thus separating the single wafer body 5 from the rotating seat 203, thereby facilitating the disassembly of the single wafer body 5. By activating the first electric telescopic rod 207, the output end of the first electric telescopic rod 207 drives the lifting housing 206 to slide on the outer surface of the sealing housing 208. The sliding of the lifting housing 206 causes the hinge plate 205 to rotate. The rotation of the hinge plate 205 causes the first sliding block 201 to slide in the second through hole 214, and the second sliding block 202 to slide in the first through hole 212, thereby facilitating the synchronous adjustment of the position of the rotating seat 203, thus facilitating the disassembly of the single wafer body 5. To clamp and limit the movement of single-wafer bodies 5 of different specifications, a waterproof motor 213 is activated. The output of the waterproof motor 213 drives the rotating base 203 to rotate, which in turn drives the single-wafer body 5 to rotate. Simultaneously, the third electric telescopic rod 308 and the second motor 304 are activated, so that the rotating cleaning roller 303 contacts the outer surface of the single-wafer body 5, facilitating the cleaning of the upper surface of the single-wafer body 5. At the same time, the water pump 307 is activated, and the water pump 307 pumps water from the water tank 311. The cleaning fluid is pumped into the outlet pipe 305, so that the cleaning fluid is discharged from the bottom of the outlet pipe 305, which facilitates the cleaning of the single wafer body 5. After cleaning, the third electric telescopic rod 308 is activated again to separate the cleaning roller 303 from the single wafer body 5. Then the blower 301 is activated, and clean air is pumped into the air outlet pipe 302 of the blower 301, which facilitates the blowing off of residual moisture on the surface of the single wafer body 5, thus facilitating the cleaning of the single wafer body 5.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A single-wafer rotary cleaning apparatus, comprising a cleaning housing (1), characterized in that: The inner wall of the cleaning housing (1) is fixedly connected to a clamping mechanism (2), and the side surface of the cleaning housing (1) is fixedly connected to a cleaning mechanism (3). The clamping mechanism (2) includes a sealing shell (208) and a cross (209) fixedly connected to the inner wall of the cleaning shell (1). A first electric telescopic rod (207) is fixedly connected to the upper surface of the cross (209). A lifting shell (206) is fixedly connected to the output end of the first electric telescopic rod (207). A fixing plate (204) is fixedly connected to the inner wall of the cleaning shell (1). A first through hole (212) and a second through hole (214) are opened on the outer surface of the fixing plate (204). A first sliding block (201) and a second sliding block (202) are slidably connected to the upper surface of the fixing plate (204). A rotating seat (203) is rotatably connected to the upper surfaces of the first sliding block (201) and the second sliding block (202). A single wafer body (5) is attached to the outer surface of the rotating seat (203). The cleaning mechanism (3) includes a water tank (311) fixedly connected to the side surface of the cleaning housing (1). A third electric telescopic rod (308) is fixedly connected to the upper surface of the water tank (311). A lifting plate (312) is fixedly connected to the output end of the third electric telescopic rod (308). A second motor (304) is fixedly connected to the outer surface of the lifting plate (312). A cleaning roller (303) is fixedly connected to the output end of the second motor (304). A blower (301) is fixedly connected to the outer surface of the lifting plate (312). An air outlet pipe (302) is fixedly connected to the air outlet of the blower (301).

2. The single-wafer rotary cleaning apparatus according to claim 1, characterized in that: The outer surface of the second sliding block (202) is slidably connected to the inner wall of the second through hole (214), and a waterproof motor (213) is fixedly connected to the lower surface of the second sliding block (202). The output end of the waterproof motor (213) is fixedly connected to the outer surface of the rotating seat (203).

3. The single-wafer rotary cleaning apparatus according to claim 1, characterized in that: The outer surface of the second sliding block (202) is slidably connected to the outer surface of the first through hole (212), and the outer surfaces of the second sliding block (202) and the first sliding block (201) are hinged with a hinge plate (205), the other end of the hinge plate (205) being hinged to the outer surface of the lifting housing (206).

4. The single-wafer rotary cleaning apparatus according to claim 3, characterized in that: The inner wall of the lifting housing (206) is slidably connected to a sealing housing (208). The lower surface of the sealing housing (208) is fixedly connected to the inner wall of the cleaning housing (1). The upper surface of the lifting housing (206) is fixedly connected to a second electric telescopic rod (211). The output end of the second electric telescopic rod (211) is fixedly connected to a rubber pad (210). The rubber pad (210) is located below the monolithic wafer body (5).

5. A single-wafer rotary cleaning apparatus according to claim 4, characterized in that: A limiting rod (309) is fixedly connected to the upper surface of the water tank (311), and the outer surface of the limiting rod (309) is slidably connected to the outer surface of the lifting plate (312). A water outlet pipe (305) is fixedly connected to the side surface of the lifting plate (312), and a drain valve (310) is fixedly connected to the side surface of the cleaning shell (1).

6. A single-wafer rotary cleaning apparatus according to claim 5, characterized in that: A water pump (307) is fixedly connected to the side surface of the water tank (311), and a connecting pipe (306) is fixedly connected to the air outlet of the water pump (307). The other end of the connecting pipe (306) is fixedly connected to one end of the water outlet pipe (305), and a control panel (4) is fixedly connected to the outer surface of the water tank (311). The control panel (4) is electrically connected to the third electric telescopic rod (308), the water pump (307), the blower (301), the second motor (304), the first electric telescopic rod (207), and the second electric telescopic rod (211) through wires.

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