Mechanical hand for transferring wafers

Abstract

The embodiment of the present application relates to semiconductors, and discloses a mechanical hand for transferring wafers, comprising: a first adsorption panel, internally configured with a first flow channel, and externally configured with a plurality of first suction nozzles connected with the first flow channel, used for adsorbing wafers; a first limiting device, arranged at a connecting end of the first adsorption panel, and avoiding the first flow channel and the first suction nozzles; wherein, along the extending direction of the first adsorption panel, the first limiting device can move relative to the first adsorption panel. The cooperative design of the first adsorption panel and the first limiting device greatly improves the reliability of wafer transfer; the first suction nozzles can form a uniform adsorption force field on the wafer surface; the movable first limiting device can move to the edge of the wafer after the wafer is adsorbed, and provide additional lateral restraint for the wafer by abutting against the edge of the wafer; such a double fixing mechanism greatly reduces the risk of wafer falling off.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and more particularly to a robotic arm for transferring wafers. Background Technology

[0002] In the semiconductor manufacturing sector, with the continuous development of industrial automation and intelligent thinning processes, the global demand for wafer transfer is showing an increasing trend. This trend stems from the continuous expansion of the semiconductor industry; the demand for chips from various electronic devices is driving the continuous expansion of wafer manufacturing scale, and correspondingly, the requirements for wafer transfer efficiency and accuracy are also becoming increasingly stringent.

[0003] In actual production, some wafers, after undergoing special processing, cannot be transferred by rigid clamping. However, when transferred by adsorption, the stability is poor and they are prone to falling off, thus affecting the chip's performance and yield. Utility Model Content

[0004] One object of this application is to provide a robotic arm for transferring wafers, which at least solves the above-mentioned problems.

[0005] To achieve the above objectives, some embodiments of this application provide a robotic arm for transferring wafers, comprising: a first adsorption panel having a first flow channel internally and a plurality of first suction nozzles communicating with the first flow channel on its surface for adsorbing wafers; and a first limiting device disposed at the connecting end of the first adsorption panel and disposed to avoid the first flow channel and the first suction nozzles; wherein, the first limiting device is movable relative to the first adsorption panel along the extension direction of the first adsorption panel.

[0006] In some embodiments, the first limiting device includes: a first connecting plate, which is arranged parallel to the first adsorption panel; and a first limiting plate, which is detachably connected to the first connecting plate and whose connection point avoids the first adsorption panel; wherein the first limiting plate and the first connecting plate are clamped on both sides of the first adsorption panel to limit the position of the wafer on the first adsorption panel.

[0007] In some embodiments, the first limiting plate is disposed on the same side as the first suction nozzle, and the first edge of the first limiting plate is arc-shaped to adapt to the edge shape of the wafer.

[0008] In some embodiments, the first limiting plate includes: a first limiting part detachably connected to a first end of the first connecting plate; and a second limiting part detachably connected to a second end of the first connecting plate; wherein the first limiting part and the second limiting part are disposed opposite to each other and are spaced apart by a preset distance.

[0009] In some embodiments, the device further includes: a first stop block disposed at the free end of the first adsorption panel to define the position of the wafer on the first adsorption panel; wherein the first stop block is disposed on the same side as the first suction nozzle.

[0010] In some embodiments, the first stop block and the first limiting plate of the first limiting device are located on the same side of the first adsorption panel; wherein the distance between the first limiting plate and the first stop block is adjustable to accommodate wafers of different sizes.

[0011] In some embodiments, the device further includes: a second adsorption panel having a second flow channel internally and a plurality of second suction nozzles communicating with the second flow channel on its surface for adsorbing wafers; wherein the second adsorption panel is arranged parallel to the first adsorption panel and spaced apart by a preset distance.

[0012] In some embodiments, the second adsorption panel is located above the first adsorption panel and its length is less than that of the first adsorption panel.

[0013] In some embodiments, the device further includes a second limiting device disposed at the connection end of the second adsorption panel and disposed to avoid the second flow channel and the second suction nozzle; wherein the second limiting device is movable relative to the second adsorption panel along the extension direction of the second adsorption panel.

[0014] In some embodiments, the device further includes: a second stop block disposed at the free end of the second adsorption panel to define the position of the wafer on the second adsorption panel; wherein the distance between the second stop block and the second limiting device is adjustable to accommodate wafers of different sizes.

[0015] Compared with related technologies, the solution provided in this application, with its coordinated design of the first adsorption panel and the first limiting device, greatly improves the reliability of wafer handling. The first flow channel is connected to multiple first suction nozzles, forming a uniform adsorption force field on the wafer surface. The movable first limiting device can move to the wafer edge after adsorption, providing additional lateral constraint by contacting the wafer edge. This dual fixing mechanism effectively resists interference factors such as vibration and airflow disturbances that may occur during handling, significantly reducing the risk of wafer detachment and minimizing damage caused by wafer detachment. Attached Figure Description

[0016] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0017] Figure 1 This is a schematic diagram of the structure of the robotic arm provided in the embodiments of this disclosure;

[0018] Figure 2 This is a schematic diagram of the structure of the robotic arm provided in another embodiment of the present disclosure;

[0019] Figure 3 This is a schematic diagram of the structure of the robotic arm provided in another embodiment of the present disclosure;

[0020] Figure 4 This is a schematic diagram of the structure of the first adsorption panel provided in an embodiment of this disclosure;

[0021] Figure 5 This is a schematic diagram of the structure of the first adsorption panel provided in an embodiment of this disclosure from another perspective;

[0022] Figure 6 This is an assembly diagram of the robotic arm provided in an embodiment of this disclosure;

[0023] Figure 7 yes Figure 6 A magnified view of a portion of point A in the middle.

[0024] Figure label:

[0025] 10: First adsorption panel; 101: First flow channel; 102: First suction nozzle; 103: First plate surface; 104: Second plate surface;

[0026] 20: First limiting device; 201: First connecting plate; 202: First limiting plate; 2021: First limiting part; 2022: Second limiting part;

[0027] 30: First stop block;

[0028] 40: Second suction panel; 401: Second suction nozzle;

[0029] 50: Second limiting device;

[0030] 60: Second stop block. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0032] The terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this disclosure are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this disclosure described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0033] In this disclosure, the terms "upper," "lower," "inner," "middle," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for better description of the embodiments of this disclosure and their implementations, and are not intended to limit the indicated devices, elements, or components to having a specific orientation, or to require them to be constructed and operated in a specific orientation. Furthermore, some of the aforementioned terms may be used to indicate other meanings besides orientation or positional relationship; for example, the term "upper" may in some cases indicate a dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in the embodiments of this disclosure according to the specific circumstances.

[0034] Furthermore, the terms "set up," "connect," and "fix" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this disclosure according to the specific circumstances.

[0035] Unless otherwise stated, the term "multiple" means two or more.

[0036] In this embodiment of the disclosure, the character " / " indicates that the objects before and after it are in an "or" relationship. For example, A / B means: A or B.

[0037] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0038] It should be noted that, unless otherwise specified, the embodiments and features described in the present disclosure can be combined with each other.

[0039] Combination Figures 1 to 7 As shown in the embodiments of this disclosure, the robotic arm for transferring wafers includes: a first adsorption panel 10, with a first flow channel 101 internally and a plurality of first suction nozzles 102 communicating with the first flow channel 101 on its surface for adsorbing wafers; and a first limiting device 20 disposed at the connecting end of the first adsorption panel 10 and disposed to avoid the first flow channel 101 and the first suction nozzles 102; wherein, along the extension direction of the first adsorption panel 10, the first limiting device 20 is movable relative to the first adsorption panel 10. When the wafer is adsorbed on the first adsorption panel 10, the first limiting device 20 can move to the edge of the wafer, abutting against the wafer, further fixing the wafer and preventing it from falling off.

[0040] The robotic arm for wafer transport provided in this disclosure, with its coordinated design of the first adsorption panel 10 and the first limiting device 20, significantly improves the reliability of wafer handling. The first flow channel 101 is connected to multiple first suction nozzles 102, forming a uniform adsorption force field on the wafer surface. For example, in actual semiconductor manufacturing, when a wafer needs to be transferred from one process station to another, this uniform adsorption force ensures that the wafer remains stable during the initial adsorption stage, avoiding tilting problems caused by uneven adsorption. The movable first limiting device 20 can move to the wafer edge after adsorption is complete, providing additional lateral constraint by contacting the wafer edge. This dual fixing mechanism effectively resists interference factors such as vibration and airflow disturbances that may occur during transport, significantly reducing the risk of wafer detachment and minimizing damage caused by detachment.

[0041] In this embodiment, the first suction nozzle is made of a flexible material, which can avoid damage to the precision circuits and tiny components on the wafer through gas adsorption and lateral constraint, thus avoiding affecting the chip's performance and yield.

[0042] Optionally, the first adsorption panel 10 includes a first plate surface 103 and a second plate surface 104 opposite each other, and the first plate surface 103 is configured with a first suction nozzle 102.

[0043] The clear layout of the first suction nozzle 102 on the first plate surface 103 facilitates the optimization of adsorption performance. During manufacturing, the first plate surface 103 can undergo specialized surface treatment, such as using a special frosting process, to increase the friction between the first suction nozzle 102 and the wafer, further enhancing the adsorption effect. The second plate surface 104 can be used to design the structure for connection with the robotic arm. This functional partitioning design avoids interference from the connection structure on the adsorption function. For example, by designing the connection structure as a shock-absorbing elastic connection component installed on the second plate surface 104, even if the robotic arm experiences slight vibrations during handling, it can effectively buffer the impact and will not affect the adsorption stability of the first suction nozzle 102 on the wafer, thereby ensuring the accuracy of wafer handling.

[0044] Optionally, a first flow channel 101 is milled inside the first adsorption panel 10.

[0045] The first flow channel 101 is machined using a milling process, enabling high-precision flow channel manufacturing. CNC milling equipment allows for precise control of the flow channel's diameter, depth, and direction. Precise flow channel dimensions ensure uniform gas flow resistance within the channel, resulting in a stable and consistent airflow supply to each first suction nozzle 102. For example, in a vacuum adsorption system, a stable airflow supply ensures that the adsorption force deviation of each first suction nozzle 102 is controlled within a minimal range, ensuring uniform force on the wafer during adsorption and preventing wafer deformation due to excessively large or small local adsorption forces. This is crucial for high-precision semiconductor wafer processing and effectively improves product quality.

[0046] Optionally, the first adsorption panel 10 includes a substrate and a cover plate. A first flow channel 101 is milled into the substrate or the cover plate and then sealed to prevent it from affecting the adsorption force of the first suction nozzle 102.

[0047] The combined structure of the substrate and cover plate enhances the convenience of manufacturing and maintenance. During manufacturing, if the first flow channel 101 is milled into the substrate, when wear or blockage occurs requiring repair, only the cover plate needs to be removed for cleaning or repair, eliminating the need to replace the entire adsorption panel and reducing maintenance costs. The sealing design effectively prevents gas leakage, ensuring stable gas pressure within the first flow channel 101. Stable gas pressure ensures the stability of the adsorption force of the first nozzle 102, improving the reliability of wafer handling and product yield.

[0048] Optionally, the first limiting device 20 includes: a first connecting plate 201, which is arranged parallel to the first adsorption panel 10;

[0049] The first limiting plate 202 is detachably connected to the first connecting plate 201, and the connection point avoids the first adsorption panel 10; wherein the first limiting plate 202 and the first connecting plate 201 are clamped on both sides of the first adsorption panel 10 to limit the position of the wafer on the first adsorption panel 10.

[0050] The first connecting plate 201 is arranged parallel to the first adsorption panel 10, ensuring the stability and directionality of the first limiting device 20 during movement. For example, using a linear guide rail to connect the first connecting plate 201 and the first adsorption panel 10 allows the first limiting device 20 to maintain high-precision linear motion during movement. The first limiting plate 202 is detachably connected to the first connecting plate 201, facilitating the replacement of the first limiting plate 202 to suit different wafer sizes. For instance, when producing wafers with different chip specifications, the first limiting plate 202 can be quickly replaced without redesigning and remanufacturing the entire first limiting device 20, improving equipment versatility and production efficiency. The clamping structure connects and limits the first adsorption panel 10 from both sides, which, compared to a single-sided arrangement, more effectively ensures the stability of the connection with the first adsorption panel 10 and also avoids friction from contact with the first adsorption panel 10.

[0051] Optionally, neither the first limiting plate 202 nor the first connecting plate 201 shall come into contact with the surface of the first adsorption panel 10, so as to reduce or avoid the friction between the first limiting plate 202 and the first connecting plate 201 and the first adsorption panel 10 when they move.

[0052] In this way, by avoiding friction caused by contact, the movement of the first limiting device 20 is made smoother. In actual operation, reducing friction also reduces wear on components and extends the service life of the first limiting device 20 and the first adsorption panel 10.

[0053] Optionally, the first connecting plate 201 has a T-shaped structure. For ease of description, the two parts of the first connecting plate 201 are defined as the first plate and the second plate. The first plate is connected to the drive device at the rear end, and the second plate is detachably connected to the first limiting plate 202.

[0054] The T-shaped first connecting plate 201 effectively partitions functions. Connected to the drive unit, it efficiently transmits driving force, ensuring the first limiting device 20 responds quickly and accurately to drive commands. The second plate is detachably connected to the first limiting plate 202, facilitating the replacement of first limiting plates 202 of different specifications. When handling wafers of different sizes, the first limiting plate 202 can be quickly disassembled and installed, improving equipment adaptability, reducing downtime caused by equipment or component replacement, and increasing production efficiency.

[0055] Optionally, the first limiting plate 202 is disposed on the same side as the first suction nozzle 102, and the first edge of the first limiting plate 202 is arc-shaped to adapt to the edge shape of the wafer.

[0056] The first limiting plate 202 is positioned on the same side as the first suction nozzle 102, allowing the suction and limiting actions to be performed simultaneously, thus improving operational efficiency. The first limiting plate 202 can immediately limit the wafer upon suction, reducing operation time. The arc-shaped first edge matches the wafer edge shape, increasing the contact area between them. During handling, this design can more evenly distribute the pressure on the wafer, preventing edge breakage or damage due to localized pressure concentration. For fragile semiconductor wafers, protecting their edge integrity is crucial for subsequent chip manufacturing processes, effectively improving product yield.

[0057] Optionally, the first limiting plate 202 includes: a first limiting part 2021, which is detachably connected to the first end of the first connecting plate 201; and a second limiting part 2022, which is detachably connected to the second end of the first connecting plate 201; wherein the first limiting part 2021 and the second limiting part 2022 are disposed opposite to each other and are spaced apart by a preset distance.

[0058] The first limiting plate 202 is designed as two detachable parts, further enhancing its flexibility and versatility. In actual production, the spacing between the first limiting part 2021 and the second limiting part 2022 can be adjusted, or limiting parts of different lengths can be replaced, depending on the wafer size. For example, for wafers with smaller diameters, the spacing can be shortened to improve the accuracy of the limiting; for wafers with larger diameters, the spacing can be increased or a longer limiting part can be used. This adjustable structural design reduces the cost of developing dedicated limiting devices for different wafer sizes, improving the economy and practicality of the equipment.

[0059] Optionally, it also includes: a first stop block 30, disposed at the free end of the first adsorption panel 10, for limiting the position of the wafer on the first adsorption panel 10; wherein the first stop block 30 is disposed on the same side as the first suction nozzle 102.

[0060] The first stop block 30 provides additional limiting protection for the wafer. During handling, if the robotic arm experiences sudden vibrations, acceleration, or deceleration, the first stop block 30 prevents the wafer from sliding towards the free end of the suction panel. Located on the same side as the first suction nozzle 102, the first stop block 30 can function immediately after the wafer is suctioned, without requiring additional action time. For example, during rapid wafer handling, the first stop block 30 can instantly block wafer displacement, working together with the first limiting device 20 and the first suction nozzle 102 to form a stable fixing structure, improving the stability and reliability of the wafer during handling.

[0061] Optionally, the shape of the first stop block 30 is adapted to the free end of the first adsorption panel 10. Preferably, the first stop block 30 is arc-shaped. When the first suction nozzle 102 adsorbs the wafer, the first stop block 30 and the first limiting device 20 abut and fix the wafer from opposite sides, further improving the stability and reliability of the wafer transfer process.

[0062] The arc-shaped first stop block 30 conforms to the edge shape of the wafer, increasing the contact area and improving the limiting effect. After the first suction nozzle 102 picks up the wafer, the first stop block 30 and the first limiting device 20 abut and fix the wafer from opposite sides, forming a stable clamping structure. During horizontal movement, vertical lifting, or rotation, this structure effectively limits the wafer's displacement in all directions. For example, during high-speed rotation, the wafer will not shift due to centrifugal force, ensuring the stability and reliability of the wafer during transport, reducing the risk of product damage due to wafer displacement, and improving production quality.

[0063] Optionally, the first stop block 30 and the first limiting plate 202 of the first limiting device 20 are located on the same side of the first adsorption panel 10; wherein, the distance between the first limiting plate 202 and the first stop block 30 is adjustable to accommodate wafers of different sizes.

[0064] The first stop block 30 and the first limiting plate 202 are located on the same side and their distance is adjustable, greatly improving the robot's adaptability to wafers of different sizes. When producing wafers with various chip specifications, the distance between the first limiting plate 202 and the first stop block 30 can be precisely adjusted according to the wafer's diameter. For example, the distance can be adjusted by an electric adjustment mechanism or by manually adjusting the position of the first limiting device 20, ensuring that the wafer can be accurately fixed on the first adsorption panel 10. This adjustable limiting structure reduces the cost and time of developing dedicated equipment for different wafer sizes, improves production efficiency, and enhances the equipment's versatility and flexibility.

[0065] Optionally, it also includes: a second adsorption panel 40, which has a second flow channel inside and a plurality of second suction nozzles 401 connected to the second flow channel on its surface for adsorbing wafers; wherein the second adsorption panel 40 is arranged parallel to the first adsorption panel 10 and is spaced apart by a preset distance.

[0066] In some embodiments, the addition of the second adsorption panel 40 enhances the adsorption and support capabilities for the wafer. The two adsorption panels are parallel and spaced at a preset distance, which can be adjusted according to the thickness of the wafer. For thinner wafers, appropriately reducing the spacing distance can improve the stability of adsorption; for thicker wafers, the spacing distance is increased. Multiple second suction nozzles 401 cooperate with the second flow channel, increasing the adsorption points and making the force on the wafer more uniform during handling. For example, when handling large-sized wafers, the second adsorption panel 40 can share some of the weight, reducing the burden on the first adsorption panel 10, avoiding wafer deformation due to excessive local force, and improving the safety and reliability of handling.

[0067] Optionally, the second suction nozzle 401 of the second adsorption panel 40 is disposed facing the first adsorption panel 10. Optionally, the second suction nozzle 401 of the second adsorption panel 40 is disposed away from the first adsorption panel 10.

[0068] Optionally, the second adsorption panel 40 is located above the first adsorption panel 10, and its length is less than that of the first adsorption panel 10. This allows for further adaptation to wafers of different sizes.

[0069] In some embodiments, the design of the second adsorption panel 40 being positioned at the top and shorter in length increases the flexibility of adapting to wafers of different sizes. For small wafers, adsorption and handling can be completed using only the shorter second adsorption panel 40, avoiding unnecessary coverage of small wafers by the large adsorption panel and reducing the problem of uneven adsorption that may be caused by an excessively large adsorption area. For large wafers, both the first and second adsorption panels 40 can be used simultaneously, and stable handling of large wafers can be achieved by adjusting the adsorption force and relative position of the two adsorption panels. This design improves the versatility of the equipment, reduces the frequency of equipment replacement and adjustment, and increases production efficiency.

[0070] Optionally, it further includes: a second limiting device 50, which is disposed at the connection end of the second adsorption panel 40 and is disposed to avoid the second flow channel and the second suction nozzle 401; wherein, along the extension direction of the second adsorption panel 40, the second limiting device 50 can move relative to the second adsorption panel 40.

[0071] The second limiting device 50 provides additional stability to the wafer on the second adsorption panel 40. During handling, when the wafer is subjected to external forces, the movable second limiting device 50 can adjust its position in time to limit the wafer. For example, when encountering airflow impact, the second limiting device 50 can move to the edge of the wafer to prevent wafer displacement. The design of avoiding the second flow channel and the second suction nozzle 401 avoids the limiting device's influence on the adsorption function, ensuring that the adsorption force of the second suction nozzle 401 is stable and reliable. This dual protection mechanism improves the stability of the wafer on the second adsorption panel 40 and enhances the reliability of the entire handling process.

[0072] Optionally, the second limiting device 50 includes: a second connecting plate, which is arranged parallel to the second adsorption panel 40;

[0073] The second limiting plate is detachably connected to the second connecting plate, and the connection point avoids the second adsorption panel 40; wherein the second limiting plate and the second connecting plate are clamped on both sides of the second adsorption panel 40 to limit the position of the wafer on the second adsorption panel 40.

[0074] The second connecting plate is arranged parallel to the second adsorption panel 40, ensuring the stability and accuracy of the movement of the second limiting device 50. The detachable connection between the second limiting plate and the second connecting plate facilitates the replacement of limiting plates of different specifications to accommodate wafers of different sizes. The clamping structure limits the wafer from both sides, enhancing the wafer's fixation effect. Similar to the first limiting device 20, this structural design improves the versatility of components. During production and maintenance, the same components can be used for replacement, reducing production costs and maintenance difficulty, and improving equipment maintainability and production efficiency.

[0075] Optionally, neither the second limiting plate nor the second connecting plate comes into contact with the surface of the second adsorption panel 40, so as to reduce or avoid the friction between the second limiting plate and the second connecting plate and the second adsorption panel 40 when they move.

[0076] This avoids friction caused by contact, making the movement of the second limiting device 50 smoother and reducing drive energy consumption. During long-term operation, the reduced friction effectively decreases component wear. For example, under frequent daily use, the service life of the second limiting device 50 can be extended, reducing the frequency of replacement due to component wear and lowering maintenance costs. Simultaneously, stable movement performance ensures the accuracy of the second limiting device 50 in positioning the wafer, improving the precision and reliability of the handling process.

[0077] Optionally, the second connecting plate has the same structure as the first connecting plate 201. This improves the versatility of components and helps reduce costs.

[0078] The second connecting plate has the same structure as the first connecting plate 201. During manufacturing, the same molds and production processes can be used, reducing mold development costs and production preparation time. During equipment maintenance, the two connecting plates are interchangeable, reducing spare parts inventory costs. For example, when maintaining different robotic arms, it is unnecessary to stock different specifications of connecting plates separately, improving spare parts utilization. This universal design not only reduces production costs but also improves equipment maintenance efficiency and enhances the product's market competitiveness.

[0079] Optionally, the second limiting plate is disposed on the same side as the second suction nozzle 401, and the first edge of the second limiting plate is arc-shaped to adapt to the edge shape of the wafer.

[0080] The second limiting plate is positioned on the same side as the second suction nozzle 401, achieving synchronization of adsorption and limiting actions and improving operational efficiency. The arc-shaped first edge adapts to the shape of the wafer edge, increasing the contact area and distributing pressure more evenly. During handling, this effectively prevents wafer edge damage caused by excessive localized pressure. For example, when handling ultra-thin wafers, this design better protects the integrity of the wafer edge, improving product quality and yield. A design similar to the first limiting plate 202 also improves the versatility of components and the maintainability of the equipment.

[0081] Optionally, the second limiting plate has the same structure as the first limiting plate 202. This improves the versatility of components and helps reduce costs.

[0082] The second limit plate has the same structure as the first limit plate 202, further improving the versatility of parts. During production, a unified manufacturing process and quality standards can be used, reducing the complexity of production management. During equipment maintenance and repair, the two limit plates can be used interchangeably, reducing spare parts inventory costs and maintenance difficulty. For example, in the event of an emergency replacement of the limit plate, there is no need to distinguish between the first and second limit plates, improving the equipment's emergency response capabilities, reducing downtime due to equipment failure, and increasing production efficiency.

[0083] Optionally, it also includes: a second stop block 60, disposed at the free end of the second adsorption panel 40, for limiting the position of the wafer on the second adsorption panel 40; wherein the distance between the second stop block 60 and the second limiting device 50 is adjustable to accommodate wafers of different sizes.

[0084] The second stop block 60 provides additional limiting protection for the wafers on the second adsorption panel 40. Working in conjunction with the second limiting device 50, it effectively prevents wafer slippage during handling. The adjustable spacing design allows the robot arm to precisely limit the movement of wafers of different sizes. For example, through an automated spacing adjustment system, the distance between the second stop block 60 and the second limiting device 50 can be quickly adjusted to accommodate the handling needs of wafers of different sizes. This adjustable limiting structure improves the versatility and flexibility of the equipment, reduces equipment adjustment time and costs caused by changes in wafer size, and increases production efficiency.

[0085] Optionally, the shape of the second stop block 60 is adapted to the free end of the second adsorption panel 40. Preferably, the second stop block 60 is arc-shaped. When the second suction nozzle 401 adsorbs the wafer, the second stop block 60 and the second limiting device 50 abut and fix the wafer from opposite sides, further improving the stability and reliability of the wafer transfer process.

[0086] The arc-shaped second stop 60 conforms to the edge shape of the wafer, increasing the contact area and improving the limiting effect. After the second suction nozzle 401 picks up the wafer, the second stop 60 and the second limiting device 50 abut and fix the wafer from opposite sides, forming a stable clamping structure. In various handling operations, this structure effectively limits wafer displacement, ensuring the wafer remains in the accurate position during rapid handling and high-precision positioning. This stable fixing method greatly improves the stability and reliability of wafer transfer, reduces the risk of product damage due to wafer displacement, and improves production quality and efficiency.

[0087] The foregoing description and accompanying drawings fully illustrate embodiments of the present disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The embodiments represent only possible variations. Individual components and functions are optional unless explicitly required, and the order of operation may vary. Parts and features of some embodiments may be included or substituted for parts and features of other embodiments. Embodiments of the present disclosure are not limited to the structures described above and shown in the accompanying drawings, and various modifications and changes may be made without departing from its scope. The scope of the present disclosure is limited only by the appended claims, and the foregoing embodiments should be considered exemplary and non-limiting.

Claims

1. A robotic arm for transferring wafers, characterized in that, include: The first adsorption panel has a first flow channel inside and a plurality of first suction nozzles connected to the first flow channel on its surface for adsorbing wafers. The first limiting device is located at the connection end of the first adsorption panel and is arranged to avoid the first flow channel and the first suction nozzle; The first limiting device can move relative to the first adsorption panel along the extension direction of the first adsorption panel.

2. The robotic arm according to claim 1, characterized in that, The first limiting device includes: The first connecting plate is set parallel to the first adsorption panel; The first limiting plate is detachably connected to the first connecting plate, and the connection point avoids the first adsorption panel; The first limiting plate and the first connecting plate are positioned on opposite sides of the first adsorption panel to define the position of the wafer on the first adsorption panel.

3. The robotic arm according to claim 2, characterized in that, The first limiting plate is disposed on the same side as the first suction nozzle, and the first edge of the first limiting plate is arc-shaped to adapt to the edge shape of the wafer.

4. The robotic arm according to claim 2, characterized in that, The first limiting plate includes: The first limiting part is detachably connected to the first end of the first connecting plate; The second limiting part is detachably connected to the second end of the first connecting plate; The first limiting part and the second limiting part are arranged opposite to each other and are spaced apart by a preset distance.

5. The robotic arm according to claim 1, characterized in that, Also includes: The first stop block is located at the free end of the first adsorption panel to limit the position of the wafer on the first adsorption panel. The first stop block is located on the same side as the first suction nozzle.

6. The robotic arm according to claim 5, characterized in that, The first stop block and the first limiting plate of the first limiting device are located on the same side of the first adsorption panel; The distance between the first limiting plate and the first stop block is adjustable to accommodate wafers of different sizes.

7. The robotic arm according to claim 1, characterized in that, Also includes: The second adsorption panel has a second flow channel inside and multiple second suction nozzles connected to the second flow channel on its surface for adsorbing wafers. The second adsorption panel is arranged parallel to the first adsorption panel and is spaced at a preset distance.

8. The robotic arm according to claim 7, characterized in that, The second adsorption panel is located above the first adsorption panel and its length is less than that of the first adsorption panel.

9. The robotic arm according to claim 7, characterized in that, Also includes: The second limiting device is located at the connection end of the second adsorption panel and is arranged to avoid the second flow channel and the second suction nozzle; The second limiting device can move relative to the second adsorption panel along the extension direction of the second adsorption panel.

10. The robotic arm according to claim 9, characterized in that, Also includes: The second stop block is located at the free end of the second adsorption panel to limit the position of the wafer on the second adsorption panel. The distance between the second stop block and the second limiting device is adjustable to accommodate wafers of different sizes.

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