Controller electronic chip attaching device and anti-deviation structure

CN224936056UActive Publication Date: 2026-11-03CHANGSHA HENGZHI SOFTWARE CO LTD
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Patent Information

Application Number
CN202522050480.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-09-23
Publication Date
2026-11-03
Estimated Expiration
2035-09-23

AI Technical Summary

Technical Problem

During long-term operation, the surface of the suction cup of existing electronic chip bonding devices is easily clogged by dust and particles, resulting in uneven air pressure, which affects the chip gripping and positioning accuracy and is prone to displacement, poor contact and damage.

Method used

Design a controller electronic chip bonding device, which employs a pusher and a cleaning module, including a lifting cylinder, a cleaning rod, and a vision sensor, to automatically clean the suction cup, prevent clogging, and ensure uniform air pressure distribution.

Benefits of technology

It achieves automatic cleaning of the suction cup, avoiding the inefficiency of manual cleaning and the problems of frequent disassembly and aging, improving the positioning accuracy of chip gripping, and preventing displacement and damage.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a kind of controller electronic chip attaching device and anti-deviation structure, comprising: rack, the lateral installation of rack upside is used for feeding and carrying out attaching work attaching workstation, the grabbing component includes manipulator, the end of the manipulator is provided with mounting bracket for installing the grabbing head of grabbing chip, the side of the mounting bracket away from grabbing head is equipped with pusher for installing cleaning module to clean the suction cup on grabbing head, compared with prior art, the utility model has the beneficial effects as follows: the setting of cleaning module effectively reduces the risk of suction cup air hole blockage, and then makes the grabbing head when grabbing chip attachment, does not appear blockage will directly affect the uniform distribution of internal air pressure of suction cup, so that suction cup cannot uniformly adsorb chip, so that uneven stress of chip in the process of grabbing, appear tilt even sliding phenomenon, chip can be prevented from deviating when attaching.
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Description

Technical Field

[0001] This utility model belongs to the field of chip bonding technology, and specifically relates to a controller electronic chip bonding device and an anti-displacement structure. Background Technology

[0002] During prolonged operation, existing electronic chip bonding devices are prone to clogging of the pores on the robotic suction cup surface due to continuous contact with chip surfaces or environmental impurities such as dust and particles. This clogging directly affects the uniform distribution of air pressure inside the suction cup, preventing it from evenly adsorbing the chip. This results in uneven force on the chip during gripping, causing tilting or even slippage. When the chip is gripped at an angle and placed in the target position, its positioning accuracy will significantly decrease, easily leading to serious problems such as chip misalignment, poor contact, or even damage to the chip's internal structure. Conventional solutions to this problem include periodically cleaning the suction cup surface manually, using higher-precision sensors to monitor the suction cup status in real time, or using an airflow backflushing device to clear pore blockages. However, manual cleaning is inefficient and difficult to maintain, and frequent disassembly may accelerate the aging of the suction cup; high-precision sensors will significantly increase equipment costs and maintenance difficulty; while airflow backflushing can alleviate the blockage problem, it has limited effect on removing micron-sized particles, and long-term use will lead to increased complexity of the air circuit system and higher maintenance costs. Therefore, we hope to design a chip bonding device with a novel structure to solve this problem. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a controller electronic chip bonding device and an anti-displacement structure to solve the problems mentioned in the background art.

[0004] This utility model is achieved through the following technical solution: a controller electronic chip bonding device and anti-offset structure, comprising: a frame, a bonding worktable for feeding and bonding is horizontally installed on the upper side of the frame, a gripping component for gripping chips and bonding is installed on the upper side of the frame, the gripping component includes a robot arm, and a mounting frame is provided at the end of the robot arm for mounting the gripping head for gripping the chips; A pusher is installed on the side of the mounting bracket away from the gripper head for installing a cleaning module to facilitate cleaning of the suction cups on the gripper head. A light source is installed on the upper left and upper right sides between the pusher and the gripper head to provide sufficient brightness for the vision sensor on the robotic arm to perform positioning.

[0005] In a preferred embodiment, the pushing component includes a lifting cylinder, which is installed on the side of the mounting frame away from the gripping head. A frame plate with an inverted L-shaped cross-section is installed laterally at its lower end. A propulsion cylinder is installed on the side of the frame plate away from the gripping head. In actual use, the side of the mounting box near the propulsion cylinder is fixedly connected to the propulsion cylinder through a double piston rod. The rear part of the mounting box can be guided and connected to the frame plate through a guide rod.

[0006] In a preferred embodiment, the cleaning module includes a mounting box, a small servo motor is mounted on the left side of the mounting box, and a lead screw is rotatably mounted inside the mounting box. The left end of the lead screw is connected to the small servo motor via a coupling shaft.

[0007] In a preferred embodiment, a rack is movably mounted inside the mounting box on the side near the frame plate via a nut and a screw, and multiple gears are horizontally mounted inside the mounting box on the side near the gripping head.

[0008] In a preferred embodiment, the multiple gears are rotatably mounted in the mounting box via bearings and a rotating shaft, and the multiple gears are meshed with a rack for transmission. The rotating shaft has a spline hole running vertically through it, and a cleaning rod is slidably mounted inside the shaft through the spline hole. The lower end of the cleaning rod is provided with a spline rod for engaging with the spline hole.

[0009] In a preferred embodiment, the upper outer wall of the cleaning rod is provided with a rubber layer and has spiral-structured plastic bristles. A miniature cylinder is installed on the left and right sides of the mounting box, and the lower ends of the two miniature cylinders are fixedly connected to a support plate. In actual use, the overall diameter of the upper side of the cleaning rod is slightly larger than the inner diameter of the suction cup vent on the gripping head. After the upper side of the cleaning rod is inserted into the suction cup vent, it can be aligned for cleaning. At the same time, the top of the cleaning rod can be set into a pointed cone shape to facilitate unblocking.

[0010] In a preferred embodiment, the upper side of the tray is provided with a plurality of blind holes, the number and distribution of which are matched with the number and distribution of the cleaning rods. The lower end of the cleaning rod passes through the rotating shaft and the mounting box downward and extends into the blind hole on the tray. The upper end of the cleaning rod passes through the rotating shaft and the mounting box downward, and the bottom of the cleaning rod is rotatably connected to the blind hole.

[0011] In a preferred embodiment, the mounting box has a suction channel horizontally arranged on the front side of one end near the gripping head and connected to an external suction tube. The mounting box has multiple suction holes opening downward on the upper side of one end near the gripping head. The multiple suction holes are respectively located on the front side of multiple cleaning rods, and the bottom of the multiple suction holes communicates with the suction channel.

[0012] After adopting the above technical solution, the beneficial effects of this utility model are: 1. By setting a pushing component, it is convenient to adjust the position of the cleaning module, so that it can extend to work when needed and retract when the equipment is working normally, thus avoiding hindering the normal operation of the gripping head.

[0013] 2. The cleaning module effectively solves the problems of low efficiency and difficulty in guaranteeing the frequency of manual cleaning, and the possibility that frequent disassembly may accelerate the aging of the suction cup. It can automatically clean the suction cup on the gripping head when needed, effectively reducing the risk of blockage of the suction cup vents. As a result, when the gripping head grips and attaches the chip, blockage will not directly affect the uniform distribution of air pressure inside the suction cup, making it impossible for the suction cup to evenly adsorb the chip. This will cause uneven force on the chip during the gripping process, resulting in tilting or even sliding. It can prevent the chip from shifting during attachment. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of the controller electronic chip bonding device and anti-displacement structure of this utility model.

[0016] Figure 2 This is a schematic diagram of the connection structure between the gripping component and the frame of the controller electronic chip bonding device and the anti-offset structure according to this utility model.

[0017] Figure 3 This is a schematic diagram of the gripping component structure of a controller electronic chip bonding device and an anti-offset structure according to the present invention.

[0018] Figure 4 for Figure 3 A schematic diagram of the enlarged structure at point A in the middle.

[0019] Figure 5 This is a schematic diagram of the rack and gear connection structure of a controller electronic chip bonding device and an anti-offset structure according to the present invention.

[0020] In the diagram, 100 represents the rack. 200- Fits the worktable; 300-Grip component, 310-Robot arm, 320-Mounting frame, 330-Grip head, 340-Light source, 350-Pushing component, 360-Cleaning module, 361-Mounting box, 362-Miniature cylinder, 363-Cleaning rod, 364-Suction channel, 365-Suction hole, 366-Thread hole, 367-Rack and pinion, 368-Gear, 369-Shaft. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] As the first embodiment of this utility model: Please see Figures 1 to 5 A controller electronic chip bonding device and anti-offset structure include: a frame 100, a bonding worktable 200 for feeding and bonding is horizontally mounted on the upper side of the frame 100, and a gripping component 300 for gripping chips and bonding is mounted on the upper side of the frame 100. The gripping component 300 includes a robot arm 310, and a mounting frame 320 is provided at the end of the robot arm 310 for mounting a gripping head 330 for gripping chips. A pusher 350 is installed on the side of the mounting bracket 320 away from the gripper head 330 for installing the cleaning module 360 ​​to facilitate cleaning of the suction cups on the gripper head 330. A light source 340 is installed on the upper left and upper right sides between the pusher 350 and the gripper head 330 to provide sufficient brightness for the vision sensor on the robot arm 310 to perform positioning.

[0023] The pusher 350 includes a lifting cylinder, which is installed on the side of the mounting frame 320 away from the gripper head 330. A frame plate with an inverted L-shaped cross-section is installed laterally at its lower end. A pusher cylinder is installed on the side of the frame plate away from the gripper head 330. In actual use, the side of the mounting box 362 near the pusher cylinder is fixedly connected to the pusher cylinder through a double piston rod. The rear part of the mounting box 362 can be guided and connected to the frame plate through a guide rod.

[0024] Specifically, by setting the pusher 350, in actual use, before starting the machine or when stopping production, the user can lift the gripper head 330 on the mounting frame 320 (in actual use, the gripper head 330 is connected to the mounting frame 320 via a cylinder to achieve height adjustment), so that the bottom height of the gripper head 330 is greater than the top height of the cleaning module 360. Then, the pusher cylinder located on the frame plate can be activated to push the entire cleaning module 360 ​​to the bottom of the gripper head 330. Subsequently, the cleaning module 360 ​​can be activated to clean the suction cup on the gripper head 330. The setting of the pusher 350 facilitates the position adjustment of the cleaning module 360, so that it can extend to work when needed and retract when the equipment is working normally, thus avoiding obstructing the normal operation of the gripper head 330.

[0025] As a second embodiment of this utility model: Please see Figures 1 to 5 The cleaning module 360 ​​includes a mounting box 362. A small servo motor is mounted on the left side of the mounting box 362. A lead screw is rotatably mounted inside the mounting box 362. The left end of the lead screw is connected to the small servo motor via a coupling shaft.

[0026] A rack 367 is movably mounted inside the mounting box 362 on the side near the frame plate via a nut and a screw. Multiple gears 368 are horizontally mounted inside the mounting box 362 on the side near the gripper head 330.

[0027] Multiple gears 368 are rotatably mounted in the mounting box 362 via bearings and a rotating shaft 369, and multiple gears 368 are meshed with a rack 367 for transmission. The rotating shaft 369 has a spline hole running vertically through its interior, and a cleaning rod 363 is slidably mounted inside the spline hole. The lower end of the cleaning rod 363 is provided with a spline rod for engaging with the spline hole.

[0028] The cleaning rod 363 has a rubber layer on its upper outer wall and is equipped with spiral plastic bristles. A miniature cylinder 362 is installed on the left and right sides of the mounting box 362. The lower ends of the two miniature cylinders 362 are fixedly connected to a support plate. In actual use, the overall diameter of the upper side of the cleaning rod 363 is slightly larger than the inner diameter of the suction cup vent on the gripping head 330. After the upper side of the cleaning rod 363 is inserted into the suction cup vent, it can be aligned for cleaning. At the same time, the top of the cleaning rod 363 can be set into a pointed cone shape to facilitate unblocking.

[0029] Multiple blind holes are provided on the upper side of the tray. The number and distribution of the blind holes are matched with the number and distribution of the cleaning rods 363. The lower end of the cleaning rod 363 passes through the rotating shaft 369 and the mounting box 362 and extends into the blind hole on the tray. The upper end of the cleaning rod 363 passes through the rotating shaft 369 and the mounting box 362. The bottom of the cleaning rod 363 is rotatably connected to the blind hole.

[0030] The mounting box 362 has a suction channel 364 horizontally arranged on the front side of one end near the gripping head 330, which is connected to the external suction tube. Multiple suction holes 365 are opened downward on the upper side of one end of the mounting box 362 near the gripping head 330. The multiple suction holes 365 are respectively located on the front side of multiple cleaning rods 363, and the bottom of the multiple suction holes 365 is connected to the suction channel 364.

[0031] Based on the first embodiment described above, further, the cleaning module 360 ​​is configured such that, in actual use, after the mounting box 362 moves to the bottom of the gripping head 330 (when the push cylinder is at full stroke, the top of the cleaning rod 363 is exactly below the vent hole of the suction cup), the micro cylinder 362 is activated to lift the tray, thereby raising the cleaning rod 363 located inside the mounting box 362. Subsequently, the upper end of the cleaning rod 363 enters the suction cup of the gripping head 330 under the movement of the tray, and then the suction cup of the gripping head 330 is activated. The small servo motor on the left side of the mounting box 362 drives the rack 367 inside the mounting box 362 to move left and right. Since multiple gears 368 are meshed with the rack 367, they drive the multiple gears 368 and the rotating shaft 369 to rotate. Driven by the rotating shaft 369, the cleaning rod 363 can synchronously follow the forward and reverse rotation. During this process, the micro cylinder 362 can be controlled to drive the tray to move up and down, so that the top of the cleaning rod 363 can rotate up and down to clean the air hole of the suction cup through the plastic bristles. At the same time, the external suction device is activated to draw air out of the suction channel 364 through the suction tube, thereby creating negative pressure in the multiple suction holes 365 to suck up the cleaned dust and prevent it from re-adhering to the gripping head 330. This effectively solves the problems of low efficiency, difficulty in guaranteeing the frequency of manual cleaning, and the possibility of frequent disassembly accelerating the aging of the suction cup. It can automatically clean the suction cup on the gripping head 330 when needed, effectively reducing the risk of blockage of the suction cup vent holes. As a result, when the gripping head 330 grips and attaches the chip, blockage will not directly affect the uniform distribution of air pressure inside the suction cup, making it impossible for the suction cup to evenly adsorb the chip. This will cause uneven force on the chip during the gripping process, resulting in tilting or even sliding. This can prevent the chip from shifting during attachment.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A controller electronic chip bonding device and anti-misalignment structure, comprising: A frame (100) is characterized in that a bonding worktable (200) for feeding and bonding is horizontally mounted on the upper side of the frame (100), and a gripping assembly (300) for gripping chips and bonding is mounted on the upper side of the frame (100). The gripping assembly (300) includes a robot arm (310), and the end of the robot arm (310) is provided with a mounting bracket (320) for mounting a gripping head (330) for gripping chips. A pusher (350) is installed on the side of the mounting bracket (320) away from the gripper head (330) for installing the cleaning module (360) to facilitate cleaning of the suction cups on the gripper head (330). A light source (340) is installed on the upper left and upper right sides of the pusher (350) and the gripper head (330) to provide sufficient brightness for the vision sensor on the robot arm (310) to perform positioning.

2. The controller electronic chip bonding device and anti-misalignment structure as described in claim 1, characterized in that: The pusher (350) includes a lifting cylinder, which is installed on the side of the mounting frame (320) away from the gripper head (330). A frame plate with an inverted L-shaped cross-section is installed laterally at its lower end. A pusher cylinder is installed on the side of the frame plate away from the gripper head (330).

3. The controller electronic chip bonding device and anti-misalignment structure as described in claim 1, characterized in that: The cleaning module (360) includes a mounting box (361), a small servo motor is mounted on the left side of the mounting box (361), and a lead screw is rotatably mounted inside the mounting box (361). The left end of the lead screw is connected to the small servo motor through a coupling shaft.

4. The controller electronic chip bonding device and anti-misalignment structure as described in claim 3, characterized in that: A rack (367) is movably mounted inside the mounting box (361) on the side near the frame plate via a screw thread and a lead screw. Multiple gears (368) are horizontally mounted inside the mounting box (361) on the side near the gripper head (330).

5. The controller electronic chip bonding device and anti-misalignment structure as described in claim 4, characterized in that: Multiple gears (368) are rotatably mounted in the mounting box (361) via bearings and a rotating shaft (369), and multiple gears (368) are meshed with a rack (367) for transmission. The rotating shaft (369) has a spline hole running through its interior, and a cleaning rod (363) is slidably mounted inside the spline hole. The lower end of the cleaning rod (363) is provided with a spline rod for engaging with the spline hole.

6. The controller electronic chip bonding device and anti-misalignment structure as described in claim 5, characterized in that: The cleaning rod (363) has a rubber layer on its upper outer wall and is provided with plastic bristles in a spiral structure. A miniature cylinder (362) is installed on the left and right sides of the mounting box (361), and the lower ends of the two miniature cylinders (362) are fixedly connected to a support plate.

7. The controller electronic chip bonding device and anti-misalignment structure as described in claim 6, characterized in that: The upper side of the tray is provided with a plurality of blind holes, the number and distribution of which are matched with the number and distribution of the cleaning rods (363); The lower end of the cleaning rod (363) passes downward through the rotating shaft (369) and the mounting box (361) and extends into the blind hole on the tray. The upper end of the cleaning rod (363) passes downward through the rotating shaft (369) and the mounting box (361). The bottom of the cleaning rod (363) is rotatably connected to the blind hole.

8. The controller electronic chip bonding device and anti-misalignment structure as described in claim 3, characterized in that: The mounting box (361) has a suction channel (364) horizontally arranged on the front side of one end near the gripping head (330) and connected to an external suction tube. The mounting box (361) has multiple suction holes (365) opening downward on the upper side of one end near the gripping head (330). The multiple suction holes (365) are respectively located on the front side of multiple cleaning rods (363), and the bottom of the multiple suction holes (365) is connected to the suction channel (364).