A ball mounting tool for a semiconductor package module

Abstract

The utility model provides a kind of ball mounting tool for semiconductor packaging module, comprising: base unit, including base body, the base body is equipped with several for placing base plate's placement slot, several placement slots are arranged in rectangular array, the depth of placement slot is less than the thickness of base plate, the bottom of placement slot is provided with negative pressure hole;First deep groove is provided in along the width direction of base body, and first deep groove partially coincides with placement slot;Glue applying unit, including glue applying template, glue applying template is used to be installed above base body, and glue applying template is provided with several first hole arrays, and first hole array corresponds with ball pad position;Ball mounting unit, including ball mounting template, ball mounting template is used to be installed above base body, and ball mounting template is provided with several second hole arrays, and second hole array corresponds with ball pad position, when ball mounting, negative pressure hole makes base plate be adsorbed in placement slot, simultaneously, placement slot can both guarantee the fixation of base plate and make base plate higher than base body, and the base plate after ball mounting is conveniently taken out.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging, and in particular to a ball-mounting fixture for semiconductor packaging modules. Background Technology

[0002] Currently, semiconductor packaging modules (FCBGA / SIPBGA) products require SMT / FCA, dispensing, LA / molding, printing, cutting, and ball placement processes in their manufacturing. Among these, ball placement is a critical process in product manufacturing, and the quality of the ball placement directly affects the product quality and reliability in subsequent assembly or application.

[0003] Generally, before solder ball placement, the substrate is fixed back-side up on a professional fixture. Then, a solder ball screen is fixed on top of the substrate. The solder ball screen has mesh openings. Flux is applied to the screen, allowing it to fall through the mesh onto the solder balls on the back of the substrate. If there is too little flux, the solder ball quality will be poor; if there is too much flux, it will overflow the mesh openings, causing solder ball bridging. Excess flux may even leave visible marks on the sides of the substrate after reflow cleaning, resulting in poor appearance. Furthermore, since flux is an adhesive material, if the gap between the substrate and the solder ball screen is inconsistent, the flux will flow towards the side with the larger gap, causing the flux to stick to the solder ball screen and the substrate, resulting in adhesion.

[0004] After the coating is completed, the printed ball mesh is removed, and the ball-planting mesh is fixed above the substrate. The ball-planting mesh also has mesh holes for solder balls to pass through. A certain amount of solder balls are poured onto the ball-planting mesh, and the solder balls are filled into the corresponding holes with a brush. Finally, the solder balls fall onto the ball pads through the holes.

[0005] After ball implantation, the substrate is difficult to remove from the fixture, which can easily cause damage to the four corners of the substrate. At the same time, the unreasonable internal structure of the fixture also affects the quality of ball implantation. Utility Model Content

[0006] This invention provides a ball-mounting fixture for semiconductor packaging modules, which aims to solve the problem of low substrate quality in the existing semiconductor ball-mounting process.

[0007] To achieve the above objectives, embodiments of this utility model provide a ball-mounting fixture for a semiconductor packaging module, comprising:

[0008] The base unit includes a base body, on the upper surface of which are provided a plurality of mounting grooves for mounting substrates. The plurality of mounting grooves are arranged in a rectangular array along the length and width directions of the base body. The depth of the mounting grooves is less than the thickness of the substrate. Each mounting groove has a negative pressure hole at the bottom, which is used to connect to a negative pressure device.

[0009] A first deep groove is provided between adjacent mounting grooves along the width direction of the base body. The depth of the first deep groove is greater than the depth of the mounting groove, and the outline of the first deep groove near the two ends of the mounting groove coincides with the outline of the mounting groove.

[0010] The adhesive application unit includes an adhesive application template, which is detachably mounted on the base body. The adhesive application template is provided with a plurality of first hole arrays, and the projection of the first hole in the first hole array in the mounting groove coincides with the projection of the ball pad of the substrate in the mounting groove.

[0011] The ball-planting unit includes a ball-planting template, which is detachably mounted on top of the base body. The ball-planting template is provided with a plurality of second hole arrays, and the projection of the second hole in the second hole array in the placement groove coincides with the projection of the ball pad of the substrate in the placement groove.

[0012] Preferably, the depth of the mounting groove is 2 / 3 of the substrate thickness.

[0013] Preferably, the first hole and the second hole have the same diameter, and the ratio of the diameter of the first hole to the diameter of the solder ball is 1.2:1.

[0014] Preferably, the distance between the upper surface of the base body and the lower surface of the adhesive coating template or the ball-planting template is equal to the diameter of the solder ball, and the thickness of the adhesive coating template and the ball-planting template is at most 1 / 3 of the diameter of the solder ball.

[0015] Preferably, a weight-reducing groove is provided between adjacent mounting grooves along the length direction of the base body, and the weight-reducing groove is connected to the adjacent mounting groove.

[0016] The weight-reducing groove is a straight weight-reducing groove. Two straight weight-reducing grooves are provided between two adjacent placement grooves along the length direction of the base body, and the two straight weight-reducing grooves are spaced apart along the width direction of the base body.

[0017] Preferably, the two ends of the placement grooves located on both sides of the length direction of the matrix formed by the placement grooves are provided with clearance grooves; the outer ends of the placement grooves located on both sides of the width direction of the matrix formed by the placement grooves are provided with second deep grooves, the second deep grooves having the same depth as the first deep grooves.

[0018] Preferably, the base unit further includes a workbench, the base body is fixed on the workbench, and a plurality of air branches are provided in the workbench. One end of each air branch is connected to the negative pressure hole, and the other end is connected to a main air line, which is used to connect to the negative pressure equipment.

[0019] Preferably, the glue application unit further includes an upper glue application frame and a lower glue application frame, the glue application template is fixed between the upper glue application frame and the lower glue application frame, the inner frame of the lower glue application frame is used to fit over the base body, and the height of the lower glue application frame is 2 / 3 of the solder ball diameter and the height of the base body.

[0020] Preferably, the ball-planting unit further includes an upper ball-planting frame and a lower ball-planting frame, the ball-planting template is fixed between the upper ball-planting frame and the lower ball-planting frame, the inner frame of the lower ball-planting frame is used to fit over the base body, and the height of the lower ball-planting frame is 2 / 3 of the diameter of the solder ball and the height of the base body.

[0021] The above-mentioned solution of this utility model has the following beneficial effects:

[0022] In this application, by setting a negative pressure hole at the bottom of the mounting groove and operating a negative pressure device, the substrate is firmly adsorbed in the mounting groove. At the same time, the depth of the mounting groove is only 2 / 3 of the substrate thickness, so that the upper surface of the substrate protrudes from the upper surface of the base body. The adhesive application template is fixed by the adhesive application lower frame to ensure that the gap between the adhesive application template and the substrate is the same size, ensuring that the flux is evenly distributed through the first hole of the first hole array onto the ball pad, improving the uniformity of flux coating, and thus ensuring the quality of the soldering.

[0023] Other features and advantages of this invention will be described in detail in the following detailed description section. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the base unit and the glue application unit;

[0025] Figure 2 This is a schematic diagram of the base unit and the ball-planting unit;

[0026] Figure 3 This is a 3D view of the base unit;

[0027] Figure 4 This is a top view of the base unit;

[0028] Figure 5 yes Figure 4 Enlarged view of section B.

[0029] [Explanation of Labels in the Attached Image]

[0030] 100 - Base unit, 110 - Base body, 111 - Mounting slot, 112 - Negative pressure hole, 113 - First deep slot, 114 - Weight reduction slot, 115 - Clearance slot, 116 - Second deep slot, 117 - Buffer blind slot

[0031] 120-workbench,

[0032] 200 - Glue application unit, 210 - Glue application template, 220 - First hole array, 230 - Upper glue application frame, 240 - Lower glue application frame.

[0033] 300 - Planting unit, 310 - Planting template, 320 - Second hole array, 330 - Upper frame for planting, 340 - Lower frame for planting, 350 - Dividing beam.

[0034] A-Substrate. Detailed Implementation

[0035] To make the technical problems, technical solutions and advantages of this utility model clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0036] like Figure 1-5 As shown, an embodiment of this utility model provides a ball-mounting fixture for a semiconductor packaging module, including a base unit 100, a coating unit 200, and a ball-mounting unit 300. The base unit 100 includes a base body 110, on which a plurality of mounting grooves 111 (marked by dashed lines) are formed on the upper surface. These mounting grooves 111 are used to accommodate a substrate A. The mounting grooves 111 are arranged in a rectangular array along the length and width directions of the base body 110. In this embodiment, six mounting grooves 111 are arranged along the length direction and three along the width direction. The depth of the mounting grooves 111 is less than the thickness of the substrate A, so that when the substrate A is flipped into the mounting grooves 111, its back surface is higher than the upper surface of the base body 110. A negative pressure hole 112 is provided at the bottom of each mounting groove 111. The negative pressure hole 112 is used to connect to a negative pressure device. When the negative pressure device is turned on, the substrate A is firmly adsorbed in the mounting groove 111 under the action of negative pressure, thereby preventing the substrate A from shaking. Preferably, a buffer blind groove 117 is also provided at the bottom of the mounting groove 111. The negative pressure hole 112 is located in the buffer blind groove 117. By providing the buffer blind groove 117, a larger vacuum cavity can be formed below the substrate A (compared to the vacuum cavity formed by the negative pressure hole 112), providing a greater negative pressure adsorption force.

[0037] Furthermore, a first deep groove 113 is provided between adjacent mounting grooves 111 in the width direction of the base body 110. The depth of the first deep groove 113 is greater than the depth of the mounting groove 111, and the contours of the first deep groove 113 near the two ends of the mounting groove 111 partially coincide with the contours of the mounting groove 111. (Refer to...) Figures 3-5As shown, since this embodiment has three mounting slots 111 in the width direction, the base body 110 has two first deep slots 113 in the width direction. In the width direction, one end of the first deep slot 113 is close to one mounting slot 111 and coincides with the outline of the mounting slot 111, and the other end is close to the other mounting slot 111 and coincides with the outline of the other mounting slot 111. This makes the substrate A partially suspended in the part of the mounting slot 111 that coincides with the first deep slot 113 when the substrate A is fixed in the mounting slot 111.

[0038] The aforementioned adhesive application unit 200 includes an adhesive application template 210, which is detachably mounted above the base body 110. The template 210 has a plurality of first hole arrays 220, arranged according to the ball-pad arrangement on the substrate A. The projection of the first hole in the first hole array 220 onto the bottom of the mounting groove 111 coincides with the projection of the ball-pad on the substrate A onto the bottom of the mounting groove 111. When the substrate A is fixed in the mounting groove 111, flux can drip through the first holes onto the ball-pad of the substrate A during flux application, ensuring a one-to-one correspondence between the first hole and the ball-pad.

[0039] Understandably, in order to achieve a one-to-one correspondence between the first hole and the ball pad, the arrangement of the first hole array 220 should also be the same as the arrangement of the mounting groove 111. That is, in this embodiment, six first hole arrays 220 are arranged along the length direction and three are arranged along the width direction, so that the first hole array 220 is located directly above the mounting groove 111.

[0040] The aforementioned ball-planting unit 300 includes a ball-planting template 310, which is detachably mounted on the base body 110. The ball-planting template 310 is provided with a plurality of second hole arrays 320. The second hole arrays 320 are arranged according to the ball pad arrangement on the substrate A. The projection of the second hole in the second hole array 320 onto the bottom of the mounting groove 111 coincides with the projection of the ball pad on the substrate A onto the bottom of the mounting groove 111. That is, when the substrate A is fixed in the mounting groove 111, during ball planting, the solder ball can fall onto the ball pad on the substrate A through the second hole, satisfying the one-to-one correspondence between the second hole and the ball pad.

[0041] Understandably, in order to achieve a one-to-one correspondence between the second hole and the ball pad, the arrangement of the second hole array 320 should also be the same as the arrangement of the mounting groove 111. That is, in this embodiment, six second hole arrays 320 are arranged along the length direction and three are arranged along the width direction, so that the second hole array 320 is located directly above the mounting groove 111.

[0042] When using this application, first place the substrate A with its back facing up in the placement groove 111, turn on the negative pressure device, and when the negative pressure device draws the environment below the substrate A into a negative pressure state through the negative pressure hole 112, the atmospheric pressure above the substrate A will firmly press the substrate A into the placement groove 111, thereby preventing the substrate A from shaking.

[0043] The adhesive application template 210 is fixed above the base body 110. Flux is applied to the adhesive application template 210, and the flux drips onto the ball pad of the substrate A through the first hole under the action of gravity. If necessary, a scraping motion can be used to accelerate the dripping of flux.

[0044] After the flux drips down, the adhesive application template 210 is removed, and the solder ball placement template 310 is fixed above the base body 110. Solder balls are added to the top of the solder ball placement template 310, and another scraper is used to scrape the surface so that each second hole contains a solder ball. The solder balls fall onto the ball pads and adhere to the ball pads with the help of flux. After adhesion, the adhesive application template 210 is removed, and the substrate A is removed from the position where the first deep groove 113 overlaps with the placement groove 111 using tweezers or other tools for reflow soldering.

[0045] In this application, multiple substrates A can be ball-planted at once, improving the efficiency of ball-planting. Furthermore, the ball-planted substrates A are easier to remove after ball-planting.

[0046] Preferably, the depth of the mounting groove 111 is two-thirds of the thickness of the substrate A. This setting can ensure that the mounting groove 111 has a limiting effect, preventing the substrate A from wobbling in the length or width direction, and also ensure that the back of the substrate A is higher than the upper surface of the base body 110.

[0047] Preferably, the first hole and the second hole have the same diameter, and the ratio of the diameter of the first hole to the diameter of the solder ball is 1.2:1. The diameters of the first hole and the second hole are slightly larger than the diameter of the solder ball to ensure that the flux can drip smoothly and the solder ball can fall smoothly onto the flux.

[0048] The distance between the upper surface of the base body 110 and the lower surface of the adhesive coating template and the ball-planting template 310 is the diameter of the solder ball. The thickness of the adhesive coating template 210 and the ball-planting template 310 is at most one-third of the diameter of the solder ball. Preferably, the thickness of the adhesive coating template 210 and the ball-planting template 310 is between 0.8mm and 1.0mm.

[0049] A weight-reducing groove 114 is also provided on the base body 110. Specifically, the weight-reducing groove 114 is arranged along the length direction of the base body 110, and the weight-reducing groove 114 is provided in multiple segments. Each segment of the weight-reducing groove 114 connects to adjacent placement grooves 111 along the length direction of the base body 110. In this embodiment, the placement groove 111 is set as a rectangle. The weight-reducing groove 114 is a straight weight-reducing groove, and each segment is provided with two straight weight-reducing grooves. The two straight weight-reducing grooves are arranged along the width direction of the base body 110. Preferably, the two straight weight-reducing grooves are located at the two corners of the rectangular placement groove 111 along the width direction.

[0050] Avoidance grooves 115 are provided at both ends of the placement grooves 111 located on both sides of the matrix formed by the placement grooves 111 along the length direction. In this embodiment, avoidance grooves 115 are provided at the corners of the placement grooves 111 closest to the two ends of the length in the rectangular array formed by the placement grooves 111. The two avoidance grooves 115 and the two straight weight reduction grooves cooperate to form avoidance space at the four corners of the rectangular placement grooves 111, so as to avoid bumping the corners of the substrate A when the substrate A is taken out.

[0051] Furthermore, a second deep groove 116 is provided at the outer end of the mounting grooves 111 on both sides of the matrix formed by the mounting grooves 111 in the width direction. The second deep groove 116 has the same depth as the first deep groove 113. In this embodiment, the aforementioned second deep groove 116 is provided at the mounting grooves 111 on both sides of the rectangular array formed by the mounting grooves 111 in the width direction. The second deep groove 116 cooperates with the first deep groove 113 to facilitate the smooth removal of the substrate A from both sides of the mounting groove 111 using tools such as tweezers.

[0052] Furthermore, the base unit 100 also includes a worktable 120 with a flat upper surface. The base body 110 is fixed on the worktable 120. Several branch pipes are installed within the worktable 120 as air branches. One end of each air branch is connected to a negative pressure port 112, and the other end is connected to a main air path. The other end of the main air path is connected to a negative pressure device. Understandably, the main air pipe constitutes the main air path, and the several branch pipes are connected in parallel to the main air pipe, with control valves installed on the main air pipe. The several branch air paths operate synchronously.

[0053] The aforementioned glue application unit 200 also includes an upper glue application frame 230 and a lower glue application frame 240. A glue application template 210 is fixed between the upper glue application frame 230 and the lower glue application frame 240. Both the lower glue application frame 240 and the upper glue application frame 230 have inner frames. The inner frame of the lower glue application frame 240 is used to fit over the base body 110, serving a limiting function. In this embodiment, since the glue application template 210 has a certain thickness, an upward-facing receiving groove is provided on the bottom surface of the upper glue application frame 230. The depth of this receiving groove is the same as the thickness of the glue application template 210. Therefore, when the upper glue application frame 230 and the lower glue application frame 240 sandwich the glue application template 210 between them, the lower surface of the glue application template 210 is coplanar with the upper surface of the lower glue application frame 240. At this point, the height of the lower adhesive application frame 240 is set to the sum of the height of the base body 110 and 2 / 3 of the solder ball diameter. When the lower adhesive application frame 240 is fitted onto the base body 110, it is in contact with the upper surface of the worktable 120. The adhesive application template 210 is parallel to each substrate A, ensuring that the vertical gap between the adhesive application template 210 and each substrate A remains consistent, thus preventing flux from flowing into spaces with larger gaps. In this embodiment, the structural features of the lower adhesive application frame 240 achieve rapid positioning, avoiding the need to repeatedly adjust the height of the adhesive application template 210 before application, making it convenient and quick.

[0054] Preferably, the upper adhesive application frame 230 and the lower adhesive application frame 240 are detachably connected. In this embodiment, the upper adhesive application frame 230 and the lower adhesive application frame 240 are connected by bolts. It should be noted that when bolts connect the lower adhesive application frame 240 to the upper adhesive application frame 230, countersunk bolts with countersunk holes should be selected to avoid the bolts protruding from the lower surface of the lower adhesive application frame 240 and affecting the positioning accuracy of the adhesive application template 210.

[0055] Similarly, the ball-planting unit 300 also includes an upper ball-planting frame 330 and a lower ball-planting frame 340, with the ball-planting template 310 fixed between the upper ball-planting frame 330 and the lower ball-planting frame 340. The structure of the upper ball-planting frame 330 and the lower ball-planting frame 340 fixing the ball-planting template 310 is the same as that of the glue-applying unit 200. Similarly, the height of the lower ball-planting frame 340 is 2 / 3 of the solder ball diameter plus the height of the base body 110.

[0056] Preferably, a plurality of partition beams 350 are also provided in the inner frame of the ball-planting upper frame 330. The partition beams 350 divide the inner frame of the ball-planting upper frame 330 into several interval regions. It can be understood that when the partition beams 350 divide the inner frame, the integrity of the second hole array 320 should be ensured. The setting of the partition beams 350 enables the interval regions to avoid mutual interference and prevents the solder balls from rolling around randomly.

[0057] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A ball-mounting fixture for semiconductor packaging modules, characterized in that, include: The base unit (100) includes a base body (110). A plurality of mounting grooves (111) for mounting a substrate (A) are provided on the upper surface of the base body (110). The plurality of mounting grooves (111) are arranged in a rectangular array along the length and width directions of the base body (110). The depth of the mounting grooves (111) is less than the thickness of the substrate (A). A negative pressure hole (112) is provided at the bottom of each mounting groove (111). The negative pressure hole (112) is used to connect to a negative pressure device. A first deep groove (113) is provided between adjacent mounting grooves (111) along the width direction of the base body (110). The depth of the first deep groove (113) is greater than the depth of the mounting groove (111). The contours of the first deep groove (113) near the two ends of the mounting groove (111) coincide with the contour of the mounting groove (111). The glue application unit (200) includes a glue application template (210), which is detachably mounted on the base body (110). The glue application template (210) is provided with a plurality of first hole arrays (220). The projection of the first hole in the first hole array (220) in the mounting groove (111) coincides with the projection of the ball pad of the substrate (A) in the mounting groove (111). The ball-planting unit (300) includes a ball-planting template (310), which is detachably mounted on the base body (110). The ball-planting template (310) is provided with a plurality of second hole arrays (320). The projection of the second hole in the second hole array (320) in the placement groove (111) coincides with the projection of the ball pad of the substrate (A) in the placement groove (111).

2. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: The depth of the mounting groove (111) is 2 / 3 of the thickness of the substrate (A).

3. The ball-mounting fixture for semiconductor packaging modules according to claim 1, characterized in that: The first hole and the second hole have the same diameter, and the ratio of the diameter of the first hole to the diameter of the solder ball is 1.2:

1.

4. The ball-mounting fixture for semiconductor packaging modules according to claim 2, characterized in that: The distance between the upper surface of the base body (110) and the lower surface of the glue-coating template (210) or the ball-planting template (310) is the diameter of the solder ball, and the thickness of the glue-coating template (210) and the ball-planting template (310) is at most 1 / 3 of the diameter of the solder ball.

5. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: A weight-reducing groove (114) is provided between adjacent mounting grooves (111) along the length direction of the base body (110), and the weight-reducing groove (114) connects the adjacent mounting grooves (111). The weight reduction groove (114) is a straight weight reduction groove. Two straight weight reduction grooves are provided between two adjacent placement grooves (111) along the length direction of the base body (110). The two straight weight reduction grooves are spaced apart along the width direction of the base body (110).

6. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: The two ends of the placement grooves (111) located on both sides of the length direction of the matrix formed by the placement grooves (111) are provided with clearance grooves (115); the outer ends of the placement grooves (111) located on both sides of the width direction of the matrix formed by the placement grooves (111) are provided with second deep grooves (116), and the second deep grooves (116) have the same depth as the first deep grooves (113).

7. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: The base unit (100) also includes a workbench (120). The base body (110) is fixed on the workbench (120). The workbench (120) is provided with several air branches. One end of each air branch is connected to the negative pressure hole (112), and the other end is connected to the main air line. The main air line is used to connect to the negative pressure equipment.

8. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: The glue application unit (200) further includes an upper glue application frame (230) and a lower glue application frame (240). The glue application template (210) is fixed between the upper glue application frame (230) and the lower glue application frame (240). The inner frame of the lower glue application frame (240) is used to fit over the base body (110). The height of the lower glue application frame (240) is 2 / 3 of the diameter of the solder ball and the height of the base body (110).

9. The ball-mounting fixture for a semiconductor packaging module according to claim 1, characterized in that: The ball-planting unit (300) also includes an upper ball-planting frame (330) and a lower ball-planting frame (340). The ball-planting template (310) is fixed between the upper ball-planting frame (330) and the lower ball-planting frame (340). The inner frame of the lower ball-planting frame (340) is used to fit over the base body (110). The height of the lower ball-planting frame (340) is 2 / 3 of the diameter of the solder ball and the height of the base body (110).

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