Packaging structure of ultra-thin SMD diode

Abstract

The utility model discloses a kind of packaging structure of ultrathin SMD diode, specifically related to packaging technical field, including package shell, the inner wall bottom end of package shell is fixed with ultrathin SMD diode;The side of package shell is equipped with bidirectional embedding packaging piece, bidirectional embedding packaging piece is used to carry out horizontal and vertical embedding packaging to package shell, bidirectional embedding packaging piece includes: side positioning slot is opened in the side of package shell, the upper surface of package shell is equipped with vertical slot, the upper side of vertical slot is equipped with vertical insertion strip, vertical slot is used for positioning vertical insertion strip insertion;Side plugboard is located in the side of package shell, the upper surface of side plugboard is equipped with vertical positioning hole.The utility model uses bidirectional embedding packaging piece, side positioning slot is moved and inserted for side plugboard, vertical slot cooperates with vertical insertion strip, realize package shell horizontal and vertical embedding packaging, effectively improve package shell stability, guarantee ultrathin SMD diode work stability.

Description

Technical Field

[0001] This utility model relates to the field of packaging technology, and more specifically, to a packaging structure for an ultra-thin SMD diode. Background Technology

[0002] With the trend towards thinner and smaller electronic products, the advantages of ultra-thin SMD diodes' lightweight packaging structure are becoming increasingly apparent. Their compact size significantly reduces the space they occupy on circuit boards, allowing for the integration of more electronic components within a limited space.

[0003] Among the existing publicly available documents, patent publication number CN202042516U discloses a flat-corner package structure for ultra-thin surface mount diodes (SMDs). This technology features leads extending parallel from both sides of the bottom of the molded body. The body is thin and lightweight, with no bent leads; it has a large heat dissipation area and excellent heat dissipation performance; and it is low in cost. However, this technology still has the following drawbacks.

[0004] When ultra-thin SMD diodes are packaged, they are encapsulated by vertical extrusion. However, this encapsulation is unidirectional, which has problems. It is difficult to form horizontal and vertical embedded encapsulation, resulting in poor package stability. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides the following technical solution: a packaging structure for an ultra-thin SMD diode, including a packaging shell, wherein an ultra-thin SMD diode is fixed at the bottom of the inner wall of the packaging shell. One side of the encapsulation shell is provided with a bidirectional embedding encapsulation component, which is used for horizontal and vertical embedding encapsulation of the encapsulation shell. The bidirectional embedding encapsulation component includes: A side positioning groove is formed on one side of the packaging shell. A vertical groove is formed on the upper surface of the packaging shell. A vertical insertion strip is provided above the vertical groove. The vertical groove is used to position the vertical insertion strip for insertion. A side insert plate is located on one side of the encapsulation shell, and a vertical fixing hole is provided on the upper surface of the side insert plate.

[0006] In a preferred embodiment, the side positioning groove is used for the side insert plate to move and insert, and the vertical groove is aligned with the vertical insert strip.

[0007] In a preferred embodiment, the upper surface of the vertical insert is arranged parallel to the upper surface of the packaging shell.

[0008] In a preferred embodiment, the lower surface of the side plate is higher than the upper surface of the ultra-thin SMD diode, and the upper surface of the side plate is arranged parallel to the upper surface of the package shell.

[0009] In a preferred embodiment, a mounting plate is provided below the side positioning groove, and the mounting plate is perpendicular to the encapsulation shell.

[0010] In a preferred embodiment, two mounting rings are fixed to the inner wall of the mounting plate, and the two mounting rings are symmetrically arranged about the middle of the mounting plate.

[0011] In a preferred embodiment, the upper surface of the encapsulation shell and near its corners are provided with side vertical holes, and a side insertion block is provided above the side vertical holes, the side insertion block being used to insert into the inner wall of the side vertical holes; A connecting strip is fixedly connected between the two side blocks, and two corner grooves are opened on one side of the vertical hole.

[0012] In a preferred embodiment, the side insert block is aligned with the side vertical hole, and the cross-sectional shape of the side insert block is rectangular.

[0013] The technical effects and advantages of this utility model are as follows: 1. This utility model adopts a bidirectional embedded package, with a side positioning groove for the side insert plate to move and insert, and a vertical groove and a vertical insert bar to achieve horizontal and vertical embedded packaging of the package shell, which changes the limitations of traditional unidirectional packaging, enhances the packaging firmness, effectively improves the stability of the package shell, and ensures the stable operation of the ultra-thin SMD diode.

[0014] 2. This utility model provides a side vertical hole, a side insert block, and a connecting strip at the corner of the packaging shell. The side insert block is inserted into the side vertical hole and enters the corner groove to achieve corner embedded packaging, which enhances the packaging firmness in all aspects and extends the service life of the component. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall packaging structure of the ultra-thin SMD diode of this utility model.

[0016] Figure 2 This is a schematic diagram of a partial section of the packaging shell structure of this utility model.

[0017] Figure 3 This is a schematic diagram of a partial section of the connecting strip structure of this utility model.

[0018] Figure 4 This is a partial structural diagram of the connection between the connecting strip and the side insert block of this utility model.

[0019] The attached diagram is labeled as follows: 1. Package housing; 2. Ultra-thin SMD diode; 3. Side positioning groove; 4. Vertical groove; 5. Vertical insertion strip; 6. Side insertion plate; 7. Vertical positioning hole; 8. Mounting plate; 9. Mounting ring; 10. Side vertical hole; 11. Side insertion block; 12. Connecting strip; 13. Corner groove. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0021] like Figure 1 - Figure 4 The diagram shows a packaging structure for an ultra-thin SMD diode. This packaging structure features a bidirectional embedded package, which enables both horizontal and vertical embedding of the package shell 1. This overcomes the limitations of traditional unidirectional packaging, enhances packaging robustness, effectively improves the stability of the package shell 1, and ensures stable operation of the ultra-thin SMD diode 2. The specific structural configuration of the bidirectional embedded package is as follows.

[0022] Example 1: In this embodiment, as Figure 1 - Figure 2 As shown, an ultra-thin SMD diode 2 is fixed to the bottom of the inner wall of the package shell 1. A bidirectional embedding package is provided on one side of the package shell 1. The bidirectional embedding package is used for horizontal and vertical embedding of the package shell 1. The bidirectional embedding package includes: a side positioning groove 3, located on one side of the package shell 1; a vertical groove 4 on the upper surface of the package shell 1; a vertical insertion strip 5 above the vertical groove 4; and a side insertion plate 6, located on one side of the package shell 1. A vertical positioning hole 7 is provided on the upper surface of the side insertion plate 6. The side positioning groove 3 is used for the side insertion plate 6 to move and insert, and the vertical groove 4 is aligned with the vertical insertion strip 5. The upper surface of the vertical insertion strip 5 is parallel to the upper surface of the package shell 1. The lower surface of the side insertion plate 6 is higher than the upper surface of the ultra-thin SMD diode 2, and the upper surface of the side insertion plate 6 is parallel to the upper surface of the package shell 1.

[0023] In this embodiment, as Figure 2 As shown, a mounting plate 8 is provided below the side positioning groove 3, and the mounting plate 8 is perpendicular to the encapsulation shell 1. Two mounting rings 9 are fixed to the inner wall of the mounting plate 8, and the two mounting rings 9 are symmetrically arranged about the middle of the mounting plate 8. The mounting rings 9 are fixed to the base by inserting bolts into the interior of the mounting rings 9. The mounting rings 9 support the mounting plate 8, and the mounting plate 8 supports the encapsulation shell 1, thereby improving the stability of the encapsulation shell 1.

[0024] In this embodiment, the ultra-thin SMD diode packaging structure is used such that the ultra-thin SMD diode 2 is placed inside the packaging shell 1. By applying encapsulating adhesive to the outer wall of the side insert plate 6, the side insert plate 6 is moved to the left and inserted into the side positioning groove 3, and enters the left side of the inner wall of the packaging shell 1. In this way, the vertical positioning hole 7 on the side insert plate 6 is aligned with the vertical groove 4, and the vertical insert strip 5 is aligned with the vertical groove 4. Then, encapsulating adhesive is applied to the outer wall of the vertical insert strip 5, and the vertical insert strip 5 is moved downward. The vertical insert strip 5 is inserted into the vertical positioning hole 7 inside the side insert plate 6 along the vertical groove 4. In this way, the side insert plate 6 and the packaging shell 1 are embedded and packaged in both horizontal and vertical directions, improving the robustness of the package.

[0025] Example 2: In this embodiment, as Figure 1 - Figure 4 As shown, the upper surface of the encapsulation shell 1 and near its corners are provided with side vertical holes 10, and a side insertion block 11 is provided above the side vertical hole 10. The side insertion block 11 is used to insert into the inner wall of the side vertical hole 10. A connecting strip 12 is fixedly connected between the two side insertion blocks 11. Two corner grooves 13 are provided on one side of the vertical hole 7. The side insertion blocks 11 are aligned with the side vertical holes 10, and the cross-sectional shape of the side insertion blocks 11 is rectangular.

[0026] In this embodiment, the packaging structure of the ultra-thin SMD diode is used by moving the side plate 6 to the left and inserting it below the vertical hole 10 on the blade side. This aligns the corner groove 13 on the side plate 6 with the vertical hole 10. Encapsulating adhesive is applied to the outer wall of the side block 11, and then the connecting strip 12 is moved downward. The connecting strip 12 drives the side block 11 to move downward and insert it into the vertical hole 10. The side block 11 then enters the corner groove 13 through the vertical hole 10, embedding and encapsulating the corner between the side plate 6 and the packaging shell 1. The encapsulating adhesive is then allowed to solidify, improving the packaging strength of the corner area.

[0027] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A packaging structure for an ultra-thin SMD diode, comprising a packaging shell (1), characterized in that: An ultra-thin SMD diode (2) is fixed at the bottom of the inner wall of the package (1). One side of the encapsulation shell (1) is provided with a bidirectional embedding encapsulation member, which is used to embed and encapsulate the encapsulation shell (1) both horizontally and vertically. The bidirectional embedding encapsulation member includes: A side positioning groove (3) is provided on one side of the encapsulation shell (1). A vertical groove (4) is provided on the upper surface of the encapsulation shell (1). A vertical insert (5) is provided above the vertical groove (4). The vertical groove (4) is used to position the vertical insert (5) for insertion. A side insert plate (6) is located on one side of the encapsulation shell (1), and a vertical fixing hole (7) is provided on the upper surface of the side insert plate (6).

2. The packaging structure of the ultra-thin SMD diode according to claim 1, characterized in that: The side positioning groove (3) is used for the side insert plate (6) to move and insert, and the vertical groove (4) is aligned with the vertical insert strip (5).

3. The packaging structure of the ultra-thin SMD diode according to claim 1, characterized in that: The upper surface of the vertical insert (5) is arranged parallel to the upper surface of the encapsulation shell (1).

4. The packaging structure of the ultra-thin SMD diode according to claim 1, characterized in that: The lower surface of the side plate (6) is higher than the upper surface of the ultra-thin SMD diode (2), and the upper surface of the side plate (6) is arranged parallel to the upper surface of the package shell (1).

5. The packaging structure of the ultra-thin SMD diode according to claim 1, characterized in that: The mounting plate (8) is provided below the side positioning groove (3), and the mounting plate (8) is perpendicular to the encapsulation shell (1).

6. The packaging structure of the ultra-thin SMD diode according to claim 5, characterized in that: The inner wall of the mounting plate (8) is fixed with two mounting rings (9), which are symmetrically arranged about the middle of the mounting plate (8).

7. The packaging structure of the ultra-thin SMD diode according to claim 1, characterized in that: The upper surface of the encapsulation shell (1) and near its corner are provided with side vertical holes (10), and a side insertion block (11) is provided above the side vertical hole (10). The side insertion block (11) is used to insert into the inner wall of the side vertical hole (10). A connecting strip (12) is fixedly connected between the two side inserts (11), and two corner grooves (13) are opened on one side of the vertical hole (7).

8. The packaging structure of the ultra-thin SMD diode according to claim 7, characterized in that: The side insert (11) is aligned with the side vertical hole (10), and the cross-sectional shape of the side insert (11) is rectangular.

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