Memory module shell
CN309021429SActive Publication Date: 2024-12-20BIWIN STORAGE TECH CO LTD
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Patent Information
- Application Number
- CN202430311419.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-24
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2039-05-24
Smart Images
Figure 000007_ABST
Abstract
1. The name of this design product: memory module shell. 2. The purpose of this design product: to protect the memory module and dissipate heat for the memory module. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1.
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