Lead part of semiconductor package
CN309106701SActive Publication Date: 2025-02-11WOLFSPEED GMBH
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Patent Information
- Application Number
- CN202430418166.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2022-08-24
- Filing Date
- 2023-02-23
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2038-02-23
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Figure 000007_ABST
Abstract
1. Name of the product of this design: Lead portion of a semiconductor package. 2. Purpose of the product of this design: Overall use: semiconductor package; Local use: part of a semiconductor package. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1. 5. Other situations that need to be explained Other explanations: The dotted lines in the figure indicate the parts that are not required to be protected.
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