Lead part of semiconductor package

CN309106701SActive Publication Date: 2025-02-11WOLFSPEED GMBH
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Patent Information

Application Number
CN202430418166.X
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2022-08-24
Filing Date
2023-02-23
Publication Date
2025-02-11
Estimated Expiration
2038-02-23

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Abstract

1. Name of the product of this design: Lead portion of a semiconductor package. 2. Purpose of the product of this design: Overall use: semiconductor package; Local use: part of a semiconductor package. 3. The design key point of this appearance design product lies in the shape. 4. The picture or photo that best illustrates the design points: Stereoscopic diagram 1. 5. Other situations that need to be explained Other explanations: The dotted lines in the figure indicate the parts that are not required to be protected.
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