Semiconductor silicon material fusion welding furnace

CN309308779SActive Publication Date: 2025-05-27HEFEI FISHERRO THERMAL EQUIP CO LTD
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Patent Information

Application Number
CN202430417526.4
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-07-04
Publication Date
2025-05-27
Estimated Expiration
2039-07-04

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Abstract

1. The name of this design product: Semiconductor silicon material welding furnace. 2. The use of this design product: This design product is used for the melting and processing of semiconductor silicon materials. 3. The design key points of this design product: lies in the shape. 4. The picture or photo that best shows the design key points: the combined use state diagram. 5. Other situations that need to be explained - Component description: This design product is a component product. Component 1 is the furnace body of the semiconductor silicon material welding furnace, and Component 2 is the controller of the semiconductor silicon material welding furnace.
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