Semiconductor silicon material fusion welding furnace
CN309308779SActive Publication Date: 2025-05-27HEFEI FISHERRO THERMAL EQUIP CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430417526.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-04
- Publication Date
- 2025-05-27
- Estimated Expiration
- 2039-07-04
Smart Images

Figure 000015_ABST
Abstract
1. The name of this design product: Semiconductor silicon material welding furnace. 2. The use of this design product: This design product is used for the melting and processing of semiconductor silicon materials. 3. The design key points of this design product: lies in the shape. 4. The picture or photo that best shows the design key points: the combined use state diagram. 5. Other situations that need to be explained - Component description: This design product is a component product. Component 1 is the furnace body of the semiconductor silicon material welding furnace, and Component 2 is the controller of the semiconductor silicon material welding furnace.
Need to check novelty before this filing date? Find Prior Art