Memory module with a heat dissipation vest
CN309358419SActive Publication Date: 2025-06-27MESTOR ELECTRONICS (ZHUHAI) CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430719091.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-06-27
- Estimated Expiration
- 2039-11-13
Smart Images

Figure 000007_ABST
Abstract
1. Name of the design product: Memory module with heat dissipation vest. 2. Use of the design product: The memory module with heat dissipation vest is used for storing data, and the heat dissipation vest dissipates heat for the memory module. 3. Design key points of the design product: Lies in the shape. 4. Picture or photograph that best shows the design key points: Perspective view 1.
Need to check novelty before this filing date? Find Prior Art