integrated circuit package
CN309468615SActive Publication Date: 2025-08-29GUANGDONG XINZHI MFG SEMICON CO LTD
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Patent Information
- Application Number
- CN202530011521.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2040-01-08
Smart Images
Figure 000001_ABST
Abstract
1. Name of the product of this design: integrated circuit package. 2. Application of this design product: used for MOS tube packaging. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the key points of the design: Design 1 3D drawing. 5. Designate Design 1 as the base design.
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