Silicone mold (Cupid card insert)

CN309477886SActive Publication Date: 2025-09-05SHENZHEN ZHONGCHENG SILICONE PROD CO LTD
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Patent Information

Application Number
CN202430828243.9
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2024-12-26
Publication Date
2025-09-05
Estimated Expiration
2039-12-26

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Abstract

1. The name of this design product: Silicone mold (Cupid insert card). 2. Purpose of this design product: Silicone mold for making insert cards by dripping glue. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: Stereoscopic drawing 1.
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