High-throughput electron microscopy system
CN309525576SActive Publication Date: 2025-09-30NCS-MICRO BEAMS (BEIJING) CO LTD
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Patent Information
- Application Number
- CN202430746666.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2039-11-25
Smart Images
Figure 000007_ABST
Abstract
1. The name of the product under this design: High-throughput electron microscopy tomography system. 2. Purpose of this design product: used to observe two-dimensional and three-dimensional microstructures at the nanometer level, and to reconstruct microstructures in three dimensions with a small-scale nanometer-level spatial resolution. 3. The key point of the design of this product lies in its shape. 4. The picture or photo that best illustrates the design points: three-dimensional picture.
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