Center portion of an adhesive sheet for semiconductor device manufacturing

Abstract

1. Name of the designed product: middle part of an adhesive sheet for semiconductor device manufacturing 2. Use of the designed product: as an adhesive sheet used in the process of semiconductor device manufacturing; the use of the partial design is to provide a mark on the surface of a substrate overlapping with a bonding layer having foreign matter, so that a purchaser of the product can detect the bonding layer having foreign matter by a sensor when using the product, thereby excluding the bonding layer. 3. Design points of the designed product: in shape 4. Picture or photograph best indicating the design points: design 1, perspective view 5. Design 1 is designated as the basic design 6. Other matters to be stated Other matters: in design 1 and design 2, reference numeral 1 to 5 in Fig. 1 represent a substrate, an adhesive layer, a bonding layer, a PET release film, and a cutting tape, respectively; reference Fig. 2 of design 1 and design 2 is a reference view of the separated state of each component, and reference numeral 1 to 4 in the figure represent the cutting tape, a mark, the PET release film, and the bonding layer, respectively; the dotted line indicates the boundary between the claimed part and the unclaimed part; the cutting tape in each view is transparent, and the part visible through the transparent area is indicated by a thin line.

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