Microstructure lens glue waterproof module (IP68)
CN309724825SActive Publication Date: 2026-01-06MYNICE OPTOELECTRONICS CO LTD
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Patent Information
- Application Number
- CN202530205349.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-16
- Publication Date
- 2026-01-06
- Estimated Expiration
- 2040-04-16
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: microstructure lens glue filling waterproof module (IP68). 2. The use of the design product: used as a microstructure lens glue filling waterproof module for LED lamp. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view 1. 5. Other circumstances that need to be explained: the partial enlarged view is the front view A, and B, C, D and E are transparent materials.
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