Assembling the heat insulation board (greenhouse multi-layer square transparent PC board module)
CN309757702SActive Publication Date: 2026-01-27JIANGSU SHENGZHIYUAN AGRICULTURAL SCIENCE & TECHNOLOGY DEVELOPMENT CO LTD
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Patent Information
- Application Number
- CN202530383199.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-02
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2040-07-02
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Assembled heat insulation board (multi-layer square transparent PC board module for greenhouse). 2. Purpose of this design: To solve the problem of overheating or overcooling caused by the thickness of the item, and to provide thermal insulation. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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