Module housing of interconnect module components
CN309763196SActive Publication Date: 2026-01-30SAMTEC INC
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- CN202430612783.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-29
- Filing Date
- 2023-08-09
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2038-08-09
Smart Images

Figure 000007_ABST
Abstract
1. Name of the product in this design: Module housing of interconnect module assembly. 2. Intended use of this design: The overall intended use is for interconnect module assemblies, including interconnect modules configured to mate with ring sockets, and ring sockets configured to mate with interconnect modules. Specifically, it is used for components having interconnect modules in the form of optical transceivers, module housings of interconnect modules, components of interconnect modules in the form of electrical transceivers, components of ring sockets, latches of ring sockets, and cable latches of interconnect modules in the form of optical transceivers; and for partial applications, module housings of interconnect module components. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Other explanation: Dashed lines do not constitute part of the design for which protection is sought.
Need to check novelty before this filing date? Find Prior Art