Module housing of interconnect module components

CN309763196SActive Publication Date: 2026-01-30SAMTEC INC
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Patent Information

Application Number
CN202430612783.3
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2023-06-29
Filing Date
2023-08-09
Publication Date
2026-01-30
Estimated Expiration
2038-08-09

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Abstract

1. Name of the product in this design: Module housing of interconnect module assembly. 2. Intended use of this design: The overall intended use is for interconnect module assemblies, including interconnect modules configured to mate with ring sockets, and ring sockets configured to mate with interconnect modules. Specifically, it is used for components having interconnect modules in the form of optical transceivers, module housings of interconnect modules, components of interconnect modules in the form of electrical transceivers, components of ring sockets, latches of ring sockets, and cable latches of interconnect modules in the form of optical transceivers; and for partial applications, module housings of interconnect module components. 3. The key design feature of this product is its shape. 4. The picture or photo that best illustrates the key design points: Design 1 3D diagram 1. 5. Design 1 is designated as the basic design. 6. Other situations requiring explanation: Other explanation: Dashed lines do not constitute part of the design for which protection is sought.
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