Semiconductor heat sinks (long live stream terms)

CN309765458SActive Publication Date: 2026-01-30曾银平
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Patent Information

Application Number
CN202530400911.2
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Filing Date
2025-07-09
Publication Date
2026-01-30
Estimated Expiration
2040-07-09

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Abstract

1. Name of the product in this design: Semiconductor Heat Sink (Long Term). 2. Purpose of this design: A heat dissipation product used to cool down mobile phones. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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