Interconnect modules of an interconnect module assembly
CN309777349SActive Publication Date: 2026-02-06SAMTEC INC
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Patent Information
- Application Number
- CN202430828987.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Priority Date
- 2023-06-29
- Filing Date
- 2023-08-09
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2038-08-09
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Figure 000007_ABST
Abstract
1. The name of the present design product: interconnect module of interconnect module assembly. 2. The use of the present design product: overall use for interconnect module assembly, including interconnect module configured to mate with ring socket, and ring socket configured to mate with interconnect module; in particular, for assembly of interconnect module in form of optical transceiver, module housing of interconnect module, assembly of interconnect module in form of electrical transceiver, assembly of ring socket, latch of ring socket, and cable latch of interconnect module in form of optical transceiver. Part design as interconnect module of interconnect module assembly. 3. The design features of the present design product: in shape. 4. The picture or photograph that best shows the design features: perspective view 1. 5. The dotted line does not constitute part of the claimed design.
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