Interconnect modules of an interconnect module assembly

CN309777349SActive Publication Date: 2026-02-06SAMTEC INC
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Patent Information

Application Number
CN202430828987.0
Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
Priority Date
2023-06-29
Filing Date
2023-08-09
Publication Date
2026-02-06
Estimated Expiration
2038-08-09

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Abstract

1. The name of the present design product: interconnect module of interconnect module assembly. 2. The use of the present design product: overall use for interconnect module assembly, including interconnect module configured to mate with ring socket, and ring socket configured to mate with interconnect module; in particular, for assembly of interconnect module in form of optical transceiver, module housing of interconnect module, assembly of interconnect module in form of electrical transceiver, assembly of ring socket, latch of ring socket, and cable latch of interconnect module in form of optical transceiver. Part design as interconnect module of interconnect module assembly. 3. The design features of the present design product: in shape. 4. The picture or photograph that best shows the design features: perspective view 1. 5. The dotted line does not constitute part of the claimed design.
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