ball placer
CN309778312SActive Publication Date: 2026-02-06XUNKE SEMICONDUCTOR (SUZHOU) CO LTD
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Patent Information
- Application Number
- CN202530137367.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2040-03-20
Smart Images
Figure 000001_ABST
Abstract
1. The name of the design product: ball mounter. 2. The use of the design product: ball mounter for semiconductor industry, which is an automatic equipment that transfers flux or solder paste to the surface of the product in a specific area of the product surface by needle transfer printing, and then accurately mounts the solder ball on the flux or solder paste. 3. The design points of the design product: in the perspective view. 4. The picture or photo that best shows the design points: perspective view. 5. The design for which protection is sought contains colors.
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