Lifting device (for wafer inspection equipment)
CN309866266SActive Publication Date: 2026-03-24SHANGHAI BERLING TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-30
- Publication Date
- 2026-03-24
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Figure 000007_ABST
Abstract
1. The name of the design product: lifting device (for wafer detection equipment). 2. The use of the design product: the design product is applied to semiconductor wafer detection equipment, so that the wafer is separated from the conveying belt. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
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