Power module (SSOP package)
CN309876332SActive Publication Date: 2026-03-27SICHUAN MOUNTEK ELECTRONIC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-07
- Publication Date
- 2026-03-27
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Figure 000001_ABST
Abstract
1. Name of the designed product: power module (SSOP package). 2. Use of the designed product: used as semiconductor component for driving control. 3. Design points of the designed product: in shape. 4. Picture or photo best indicating the design points: design 1 perspective view 1. 5. Design 2 left view is the same as design 1 left view, and design 2 left view is omitted; design 2 right view is the same as design 1 right view, and design 2 right view is omitted. 6. Design 1 is designated as the basic design.
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