solid state relay lower shell (double fuse)
CN309899880SActive Publication Date: 2026-04-07JIANGSU GOLD ELECTRIC CONTROL TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-31
- Publication Date
- 2026-04-07
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Figure 000001_ABST
Abstract
1. The name of the design product: solid-state relay lower shell (double fuse). 2. The use of the design product: for protecting the circuit board on the solid-state relay. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: front view.
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