Hollow support rod for semiconductor devices
CN309948003SActive Publication Date: 2026-04-28SHANGHAI MORISEAL NEW MATERIAL TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SHANGHAI MORISEAL NEW MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2025-08-27
- Publication Date
- 2026-04-28
Smart Images

Figure 000001_ABST
Abstract
1. The name of the design product: hollow support rod for semiconductor equipment. 2. The use of the design product: the product is a component of semiconductor etching equipment, installed on a compression ring, used to pass the sensor signal line (such as a temperature sensor) through the hollow support rod to monitor the process parameters in real time and ensure the stability of the production process. 3. The design points of the design product: in shape. 4. The picture or photo that best indicates the design points: perspective view.
Need to check novelty before this filing date? Find Prior Art