Cmp apparatus
CN309949952SActive Publication Date: 2026-04-28SUZHOU XINLUN SEMICON TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SUZHOU XINLUN SEMICON TECH CO LTD
- Filing Date
- 2025-10-09
- Publication Date
- 2026-04-28
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Figure 000001_ABST
Abstract
1. The name of the design product: CMP equipment. 2. The use of the design product: used for finishing the flatness of wafer surface. 3. The design points of the design product: in shape. 4. The picture or photo that can best show the design points: perspective view. 5. The part of the design product that is not easy to see or cannot be seen when in use is omitted, and the top view is omitted.
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