heat dissipation shell
CN309962737SActive Publication Date: 2026-05-05SICHUAN SONGZHENG AVIATION POWER TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- SICHUAN SONGZHENG AVIATION POWER TECHNOLOGY CO LTD
- Filing Date
- 2025-11-03
- Publication Date
- 2026-05-05
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Figure 000007_ABST
Abstract
1. Name of the product in this design: Heat sink housing. 2. Purpose of this design: To dissipate heat from the power transistors and other electronic components of the motor controller. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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