backplane support
CN309962907SActive Publication Date: 2026-05-05JINGRUI ELECTRONICS (DONGGUAN) CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- JINGRUI ELECTRONICS (DONGGUAN) CO LTD
- Filing Date
- 2025-07-08
- Publication Date
- 2026-05-05
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Backplate bracket. 2. Purpose of this design: Used as a bracket for fixing the heatsink backplate at the bottom of a computer motherboard CPU. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D rendering 1.
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