Digital microfluidic chip packager
CN309963325SActive Publication Date: 2026-05-05XIAMEN UNIV
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- XIAMEN UNIV
- Filing Date
- 2025-10-16
- Publication Date
- 2026-05-05
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Figure 000001_ABST
Abstract
1. Name of the product in this design: Digital microfluidic chip packager. 2. Purpose of this design: For packaging digital microfluidic chips. 3. The key design features of this product are the combination of shape and pattern. 4. The image or photograph that best illustrates the design's key features: the front view.
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