Semiconductor package structure
CN310018710SActive Publication Date: 2026-06-05HANGZHOU SILAN MICROELECTRONICS CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- HANGZHOU SILAN MICROELECTRONICS CO LTD
- Filing Date
- 2025-08-28
- Publication Date
- 2026-06-05
Smart Images
Figure 000007_ABST
Abstract
1. Name of the design product: semiconductor package structure. 2. Use of the design product: package structure for semiconductor device. 3. Design points of the design product: in shape. 4. Picture or photo best indicating the design points: perspective view.
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