Heat sink for earphone pad
CN310023542SActive Publication Date: 2026-06-09GUANGDONG TAKSTAR ELECTRONIC CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- GUANGDONG TAKSTAR ELECTRONIC CO LTD
- Filing Date
- 2025-11-19
- Publication Date
- 2026-06-09
Smart Images
Figure 000009_ABST
Abstract
1. The name of the design product: earphone pad heat dissipation piece. 2. The use of the design product: for headphone heat dissipation. 3. The design points of the design product: the combination of the shape and pattern of the claimed partial design. 4. The picture or photo that best shows the design points: perspective view 1. 5. Other circumstances that need to be explained: the dashed line in the figure is not claimed.
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