Chip (black ceramic surface mount 64-pin package)

CN310023858SActive Publication Date: 2026-06-09FUJIAN CHUANGXIN MICRO-ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Designs(China)
Current Assignee / Owner
FUJIAN CHUANGXIN MICRO-ELECTRONICS CO LTD
Filing Date
2025-09-25
Publication Date
2026-06-09

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Abstract

1. Name of the designed product: chip (black ceramic surface 64-line package). 2. Use of the designed product: chip for electronic products. 3. Design points of the designed product: in shape. 4. Picture or photo that best indicates the design points: front view.
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