Wafer chuck
CN310053988SActive Publication Date: 2026-06-26TOPO TECH (SUZHOU) CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- TOPO TECH (SUZHOU) CO LTD
- Filing Date
- 2025-11-12
- Publication Date
- 2026-06-26
Smart Images
Figure 000007_ABST
Abstract
1. The name of the design product: wafer chuck. 2. The use of the design product: for placing wafer. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: perspective view 1. 5. Other circumstances that need to be explained: the A and B parts of the logo are transparent material.
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