Semiconductor power module (L8 package)
CN310069542SActive Publication Date: 2026-07-03ZHEJIANG GULAN ELECTRONICS TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- ZHEJIANG GULAN ELECTRONICS TECH CO LTD
- Filing Date
- 2025-12-24
- Publication Date
- 2026-07-03
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Semiconductor Power Module (L8 Package). 2. Purpose of this design: Primarily used for electronic components. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.
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