Wafer ring cutting equipment
CN310070343SActive Publication Date: 2026-07-03吉姆西半导体科技(无锡)股份有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Designs(China)
- Current Assignee / Owner
- 吉姆西半导体科技(无锡)股份有限公司
- Filing Date
- 2025-12-15
- Publication Date
- 2026-07-03
Smart Images
Figure 000007_ABST
Abstract
1. Name of the product in this design: Wafer circumferential cutting equipment. 2. Purpose of this design: A wafer circumferential cutting device used to trim the outer edge of a wafer to prevent damage during the thinning process after bonding, as the beveled shape cannot withstand the pressure. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.
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