A ceramic substrate for electronic components generating waste heat and a method of its manufacture

Abstract

The ceramic substrate (1) is monolithic, and it contains an integrated channel (2) for the passage of heat-transfer medium. From the outside the ceramic substrate (1) is adapted for direct printing using conductive patterns (3, 4) and for the direct mounting of electronic components (5) generating waste heat, particularly for the power module applications, for the effective dissipation of waste heat.