Method for manufacturing contact elements by mechanically applying a material layer with high resolution, as well as contact element and a device for manufacturing

Abstract

Method for producing at least one functional area (1) on an electrical contact element (30), wherein the at least one functional area is limited to a partial surface of the contact element, wherein at least one material layer (4) in the functional area (1) is mechanically applied to the contact element (30) and subsequently a high-energy heating radiation (9) is directed onto the at least one material layer, wherein the high-energy heating radiation (9) is a particle radiation, characterized in that the depth of the maximum energy input is controlled by means of radiation parameters depending on the desired effect.

Description

[0001] The invention relates to a method for producing at least one functional region on an electrical contact element, wherein the at least one functional region is limited to a partial surface of the contact element. The invention further relates to a contact element produced by such a method and a device for producing such a contact element, wherein at least one material layer is mechanically applied to the contact element in the functional region and high-energy heat radiation is subsequently directed onto the at least one material layer.

[0002] Such contact elements can be contacts for connectors or switching contacts. The functional areas are surface areas of the contact element that perform a specific function during operation when the contact element is installed in the respective electrical component. Functional areas include, for example, contact points where a mating contact mechanically and electrically contacts the contact element; inlet areas along which mating contacts move across the surface of the contact element, for example, when plugging connectors together; areas where the contact element is in contact with other components and which are at risk of corrosion; and connection points for crimp, solder, or other connections.

[0003] The contact elements are typically made of copper or a copper alloy. They are typically coated using electroplating processes, primarily in continuous strips. Electroplating of the contact elements with metals such as gold, silver, palladium, nickel, and tin, as well as with alloys based on or containing these metals, is particularly well-known.

[0004] Tin contacts can also be produced by hot-dip tinning.

[0005] In both processes, the selection of materials with which the contact elements can be coated is limited. Furthermore, with electroplating processes, alloys cannot be deposited in any desired quantity. With hot-dip tin coating, the process is limited by the melt temperature. With both processes, the coating properties cannot be subsequently modified, or can only be modified with great difficulty.

[0006] It is not possible to produce several different functional areas, each optimized for its own function, on one contact element.

[0007] A further disadvantage of hot-dip tinning is that selective coating of limited areas is hardly possible.

[0008] While selective electroplating processes can produce limited coating areas on the order of a few millimeters, the creation of smaller areas using selective electroplating is currently not technically feasible. This scale is excessive for the functional areas required for contact elements.

[0009] For contact elements used in switching technology, the contact points, such as the contact rivets, are manufactured separately and then joined to the contact elements. The contact points may be metallurgically processed. Due to tolerances in the manufacture of the contact rivets and their attachment, inaccuracies arise that can lead to considerable scrap.

[0010] The processes mentioned above are known from DE 30 05 662 A1 and DE 10 2009 024 962 A1. In both processes, an applied material is melted by laser light.

[0011] Furthermore, JP 2005 - 032 783 A discloses a method for producing conductive structures on substrates that transmit electrical signals. Conductive fine particles are arranged in a pattern on a substrate and then fused by the application of energy, such as light or a laser.

[0012] US Pat. No. 7,569,331 B2 discloses a method for producing conductive patterns on non-conductive coatings. These coatings consist of conductive elements, a binder, and a material that promotes the absorption of radiation (e.g., from a laser). Irradiation with a laser renders the coating conductive by liquefying the binder and moving the conductive elements into a conductive position.

[0013] In view of the disadvantages of the known methods described above, the object of the invention is to create a method which enables a simple and precise production of functional areas in contact elements and which, at the same time, has the potential to produce several functional areas on a contact element which can be optimized for their respective function.

[0014] This object is achieved by the method according to claim 1 in that the depth of maximum energy input is controlled by means of beam parameters depending on the desired effect. Furthermore, the object is achieved by the device according to claim 25 and the electrical contact element according to claim 26.

[0015] By mechanically applying the material layer, the disadvantages of electroplating and hot-dip tinning processes can be avoided. Only the material required for the specific function of the functional area needs to be applied at the exact location where the functional area is required. Subsequent irradiation allows for the selective and controlled modification of the mechanical or chemical properties of the applied material layer.

[0016] Mechanical application of the material layer avoids the costly environmental regulations associated with wet-chemical processes. Mechanical application also requires less of the expensive material to be stored in large melt or electroplating baths. This is particularly effective for material layers containing precious metals.

[0017] High-energy thermal radiation is defined as irradiation with electrons, ions, and other atomic or subatomic particles. Laser beams and X-rays can also be considered high-energy thermal radiation.

[0018] The solution according to the invention can be further developed by the following features, which are independent of one another, each advantageous in itself and can be combined with one another as desired.

[0019] According to a particularly advantageous embodiment, the at least one material layer is printed. Printing techniques such as screen printing, inkjet printing, gravure printing, stamp printing, or printing directly or indirectly via intermediate carriers, such as intermediate rollers, can be used. The functionally relevant material layer is preferably printed directly onto the base material of the contact element. However, the contact element can also be precoated using other methods.

[0020] The material layers in the functional area can be printed in particular when the contact elements are not yet isolated but in strip or band form.

[0021] Printing is preferably carried out with an accuracy of at least 0.1-1 mm so that the functional areas can be precisely positioned and / or dimensioned.

[0022] According to a further advantageous embodiment, metal-containing pastes can be used for printing. The pastes can contain or consist of powders, micro- and / or nanoparticles made of one or more pure metal components, carbon, and / or metal compounds. In particular, the metal pastes can contain metals that have previously been used for coating contact points in contact elements. Such metals include, for example, gold, silver, copper, nickel, tin, palladium, platinum, and / or ruthenium.

[0023] The materials used for printing, in particular pastes, may contain additional components from the group of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, zirconium, niobium, molybdenum, hafnium, tantalum and in particular tungsten and also mixtures of these additional components.

[0024] Preferably, metal compounds in the material layer are selected so that they reduce to metal under the influence of the high-energy heat radiation.

[0025] The basic components or additional components listed above can also be mechanically applied in a chemically stable compound if non-metallic material properties are considered relevant for the functional area. For example, the basic component or additional component can be in the form of a metal-carbon compound (Me). y C x , a metal oxide Me y O x or a metal-nitrogen compound, Me y N x used for mechanical deposition. Carbon can be present in the material to be deposited in chemical configurations such as graphite, diamond, carbon nanotubes, graphene, or fullerenes.

[0026] According to a further advantageous embodiment, the at least one material layer can be sprayed on. In particular, powders can be sprayed on. By changing the jet parameters, the spraying process can produce material layers whose layer thickness varies in the surface direction. Spraying is particularly suitable for powdered alloy materials, such as the additional components mentioned above. Excess powder can be easily collected and returned. Spraying can take place into the high-energy jet, so that the sprayed material bakes onto the surface while protected during flight. Spraying and irradiation can take place synchronously and intermittently to allow the sprayed material to solidify and harden between the radiation pulses.

[0027] According to a further advantageous embodiment, the applied material layer can consist of a wire and / or a foil, which is continuously fed into the heating beam, for example, and / or placed on the base material. Feeding wire and / or foil into the heating beam has the advantage that the material feed and melting process are carried out in a single step.

[0028] Through mechanical application in one of the above embodiments, several different material layers can be arranged one above and / or next to each other. The higher the resolution of the application process, the more precisely the material layers can be positioned relative to each other.

[0029] The individual material layers, which are applied on top of and / or next to each other on the contact element, can consist of different materials. For example, lower material layers closer to the base material of the contact element can serve as corrosion protection and / or a diffusion barrier to chemically insulate the overlying layers from the underlying layer.

[0030] The mechanically applied material forming the material layer may contain substances that evaporate during irradiation or after a preliminary drying step and that merely serve as a transport medium for the basic or additional components listed above.

[0031] After mechanical application, the material layer is heated by the high-energy heat radiation. This heating can lead to a stronger bond between the upper and lower material layers compared to mechanical application and / or to a change in the chemical and / or physical properties of the applied material layer. For example, the irradiated material layer can melt under the effect of the heat radiation or penetrate into the base material of the contact element, forming an alloy or a frozen mixed phase with it. Different material layers can also react with each other at their interfaces, forming desired chemical compounds at these locations.

[0032] To enable the heating process carried out by the radiant heat to take place more quickly after mechanical application, a further advantageous embodiment provides for the material layer to be dried after mechanical application. This preferably takes place in an oven. During drying, the material layer is preferably heated to a temperature that is below the melting temperature of the lowest-melting component of the at least one applied material layer and / or the annealing temperature or a phase transition temperature, e.g., the softening temperature of the base material.

[0033] It is particularly advantageous if the area of ​​impact, in which the high-energy heating radiation acts on and heats the contact element or functional area, encompasses at most at least one material layer. This can be achieved by bundling, focusing, and / or shielding the heating radiation so that it impinges on the material layer in the form of at least one heating beam. To achieve higher processing speeds, the heating radiation can also be divided into several heating beams, which can be directed simultaneously onto several material layers scattered across the contact element.

[0034] The material layer is preferably heated by the high-energy heat radiation at specific points with an accuracy of less than 0.1 mm, ensuring highly precise energy delivery. With this process, the largest diameter of the impact zone on the surface of the contact element is less than 0.1 mm. The smallest achievable diameter of the impact zone can roughly correspond to the wavelength of the high-energy radiation. By expanding the heat beam or, in particular, by scanning the surface to be irradiated in a grid-like pattern using a point-focused heat beam, even larger areas can be processed.

[0035] The high resolution ensures that the heat affects only small areas. This allows specific areas with dimensions within the resolution range to be melted or heated in order to locally change the chemical and / or physical properties of that area.

[0036] The local heating in the material layer is controlled by the energy density, the acceleration voltage, the particle current, and the exposure time of the heating radiation. These beam parameters are constantly adjusted depending on the position of the exposure zone and / or the material composition of the material layer currently located within the exposure zone. The beam parameters are preferably controlled such that at least one component in the material layer covered by the current exposure zone enters the molten state.

[0037] In an advantageous embodiment of the method, the base material of the contact element is heated and / or melted at most superficially by the heat radiation. The melting depth is preferably between 0.05 µm and 20 µm.

[0038] By controlled changes in the beam parameters, for example depending on the thickness and / or composition of the material layer covered by the respective area of ​​influence, the melting depth can be controlled so that a desired number of interfaces between superimposed material layers and / or between the lowest material layer and the base material are melted.

[0039] According to the invention, the beam parameters of the high-energy radiation are adjusted so that the depth at which the maximum energy input occurs can be specifically adjusted. For example, the parameters can be set such that only a boundary layer between the base material and the material layer is melted, while the surface of the material layer is only slightly heated. With high-energy particle radiation, e.g., electron, ion, or atomic radiation, the depth of the maximum energy input can be adjusted by controlling the kinetic energy. With high-energy radiation with wave characteristics, e.g., laser or X-ray radiation, this can be achieved by controlling or selecting the frequency.

[0040] In addition, by adjusting the beam parameters, the heating of the material layer in the area of ​​impact can be controlled in such a way that heating occurs in thermal equilibrium.

[0041] By heating, in particular melting, the material layer using the heating beam, the material layer can be densified and / or degassed in a further advantageous embodiment of the method. Furthermore, pores can be closed and / or material defects can be removed.

[0042] Furthermore, by controlling the beam parameters, the cooling rate of the at least one material layer heated in the exposure zone can be controlled. Thus, a gradual reduction in the energy input can achieve gradual cooling at thermal equilibrium, or a sudden reduction in the energy input can achieve sudden cooling of the at least one material layer.

[0043] The exposure zone, with typical dimensions of less than 0.1 mm, is significantly smaller than the contact element, which is usually several millimeters to centimeters in size. The mass heated by the exposure zone is therefore preferably significantly smaller than the mass of the contact element. The heating of the at least one material layer heated in the exposure zone occurs adiabatically or quasi-adiabatically, since the energy introduced by high-energy heat radiation is much greater than the energy dissipated by heat conduction in the same period. Due to the relative sizes between the exposure zone and the contact element, cooling occurs so quickly that when the heat radiation is switched off, the molten material layer in the exposure zone is frozen. Thus, the method according to the invention enables amorphous, micro- and / or nanoscale structures to be achieved in the material layer. Such structures are chemically inert and extremely wear-resistant.The adiabatic or quasi-adiabatic heating means that the thermal effect of the heating radiation is limited to very limited areas of the order of magnitude of the beam resolution.

[0044] In a further advantageous embodiment, different structures can be created in a material layer. This results in, for example, a material layer having particularly hard and wear-resistant regions that can be applied to areas of the functional area where mating contacts impact the contact element or can rub against the contact element.

[0045] The heat radiation can also be used to create a surface structure on the material layer. For example, a microstructure in the form of a grid contact can be created. The surface structure can also influence the tribological properties of the uppermost material layer. The size of the structural elements formed by the heat radiation is preferably less than 20 µm and thus preferably in the microscopic range.

[0046] Thus, within the functional area, regions with different mechanical properties can be created in areas of the same material. As explained above, these different mechanical properties can be achieved by temporally and spatially varying the energy input into the material layer and controlling the heating and cooling rates and / or the temperature in the area of ​​impact, for example, by creating different microstructures along the surface area of ​​the material layer.

[0047] According to a further advantageous embodiment, the high-energy heating radiation can be used for processing a contact element, which may be in strip or band form or individually, before and / or after the production of a functional area. For example, the high-energy rays from the same radiation source used for the heating radiation can be used in the form of electron or ion beams for cutting, drilling, hardening, and bending the contact elements.

[0048] If an electron beam is used as high-energy heating radiation, it can be used, in a further advantageous embodiment, for visualization and quality control using electron-optical imaging techniques. This can be done during the processing or in a separate step afterward. For visualization, scanning electron microscopy techniques, for example, can be used.

[0049] A contact element according to the invention as mentioned at the beginning has at least one functional area which is provided with at least one mechanically applied material layer.

[0050] A contact point can be provided as the functional area, comprising a contact point made of a material layer that has a lower electrical resistance than a material layer surrounding the contact point. The material layer surrounding the contact point can have a higher corrosion resistance than the contact point itself. In particular, the material layer of the contact surrounding area can contain less noble metal materials than the material layer of the contact point.

[0051] In a further advantageous embodiment, the functional area can be designed as a connection area intended to facilitate the application of solder and / or crimp connections. Such a connection area can, for example, have a mechanically applied, tin-containing material layer.

[0052] The invention is explained in more detail below using exemplary embodiments with reference to the drawings. The different features of the individual exemplary embodiments can be combined with one another in accordance with the above explanations. Furthermore, individual features can also be omitted from the exemplary embodiments in accordance with the above description if the advantage associated with this feature is not important in a specific application.

[0053] For the sake of simplicity, the same reference numerals are used below in the different embodiments for elements that are similar or identical in terms of structure and / or function.

[0054] They show: Fig. 1 a schematic representation of the method steps according to a first embodiment of the method according to the invention; Fig. 2 a schematic representation of the method steps according to a second embodiment of the method according to the invention; Fig. 3 a schematic representation of the method steps of a third embodiment of the device according to the invention; Fig. 4 a schematic representation of the method steps of a fourth embodiment of the invention; Fig. 5 is a schematic representation of the method steps of a fifth embodiment of the invention; Fig.6 is a schematic representation of the method steps of a sixth embodiment of the invention; Fig. 7 is a schematic representation of the method steps of a seventh embodiment of the invention; Fig. 8 is a schematic representation of the method steps of an eighth embodiment of the invention; Fig. 9 is a schematic representation of the method steps of a ninth embodiment of the invention; Fig. 10 is a schematic representation of the method steps according to a tenth embodiment of the invention; Fig. 11 is a schematic representation of the method steps of an eleventh embodiment of the invention; Fig. 12 is a schematic representation of the method steps of a twelfth embodiment of the invention; Fig.13 is a schematic representation of the method steps of a thirteenth embodiment of the invention; Fig. 14 is a schematic representation of the method steps of a fourteenth embodiment of the invention; Fig. 15 is a schematic representation of the method steps of a fifteenth embodiment of the invention; Fig. 16 is a schematic representation of the method steps of a sixteenth embodiment of the invention; Fig. 17 is a schematic representation of the method steps of a seventeenth embodiment of the invention; Fig. 18 is a schematic representation of the method steps of an eighteenth embodiment of the invention; Fig. 19 a schematic representation of a contact element according to the invention during its manufacture; Fig. 20 a detail XX of the Fig. 19; Fig.21 a schematic representation of a second embodiment of a contact element according to the invention during its manufacture; Fig. 22 a detail XXII of the Fig. 21.

[0055] First, the invention is described on the basis of Fig. 1 schematically illustrated embodiment.

[0056] Fig.1 shows a method with which at least one functional area 1 of a contact element 2 is produced. The functional area 1 is an area limited to a part of the surface 3 of the contact element 2, which area assumes a special function when the contact element 2 is installed. The functional area 1 is, for example, a contact point against which a mating contact (not shown) rests and via which electrical currents are intended to flow during operation. The functional area 1 can also be a connection area to which a conductor is firmly connected when the contact element 2 is installed, for example by crimping or soldering. The functional area 1 can also differ from the remaining area of ​​the surface 3 of the contact element 2 due to a high mechanical surface load when the contact element 2 is installed.For example, contact element 2 may be movably mounted, so increased surface wear is to be expected at the bearing points. The same applies to areas where other components rest on the contact element.

[0057] How Fig. 1 shows, at least one material layer 4 is present in the functional area 1.

[0058] The functional area 1 can be manufactured when the contact element 2 has not yet been separated and is still in the form of a strip or band material 5, from which it is then separated by punching or cutting. Alternatively, the functional area 1 can also be manufactured from already separated contact elements 2. The contact element 2 or the band material 5 is preferably made of a homogeneous base material 6, in particular copper or a copper alloy. Before the production of the functional area 1, the contact element 2, whether separated or in the form of the band material 5, may already have been coated, for example with nickel or tin.

[0059] In Fig.1, the production of a functional area 1 is shown merely by way of example with reference to a conveyor belt 10 being transported in a feed direction 7 past a merely schematically illustrated production station 8 with a radiation source 8'. The feed of the strip material 5 can be continuous or intermittent.

[0060] According to the first embodiment, the production of the functional area 1 can be carried out schematically in four process steps A, B, C, D. The process steps A to D are shown in Fig.1 are shown side by side merely for the sake of clarity. In fact, the individual process steps can be performed at successive stations in the direction of the strip feed 7 and / or at one and the same location with the strip material 5 stationary or with a production station 8 moving with the strip material 5. In particular, the direction of the high-energy heating radiation 9 can also be synchronized with the strip feed such that, with continuous strip feed, the heating radiation remains directed at only one functional area.

[0061] In a first process step A, the material layer 1 is mechanically applied to the base material 6. This is done, in particular, by printing, for example, with screen printing, inkjet printing, gravure printing, or direct stamp printing or indirect stamp printing via intermediate carriers. Intermediate rollers, for example, can be used as intermediate carriers.

[0062] The composition of material layer 1 is adapted to the function of functional area 1 and the required mechanical properties resulting from this function. In particular, material layer 4 can be composed of a printable, metal-containing paste. The paste can contain powder, micro- and / or nanoparticles made of one or more pure metal components, carbon, and / or metal compounds.

[0063] If functional area 1 is a contact point, typical base components for the material layer are gold, silver, copper, nickel, tin, palladium, platinum, and / or ruthenium. These metals can, in particular, form the base components of printable metal pastes.

[0064] Furthermore, the material layer 4 can contain additional components, in particular titanium, vanadium, chromium, manganese, iron, cobalt, niobium, zirconium, nickel, molybdenum, tantalum and / or tungsten and / or mixtures of these additional components. Metal compounds in the material layer 4 printed according to process step A are selected such that they can be chemically reduced to metal in the subsequent process steps.

[0065] The material layer 1 can also have non-metallic properties or contain non-metallic substances. A non-metallic characteristic of the material layer can also be achieved by a chemically stable metal compound, which represents the basic component of the material layer 4. For example, the material layer 4 can be composed of or contain: a metal-carbon compound in the form Me y C x , a metal oxide in the form Me y O xand / or a metal-nitrogen compound in the form Me y N x , where one or more of the basic and / or additional components listed above can be considered as metals. Carbon in material layer 4 can be present in chemical configurations such as graphite, diamond, carbon nanotubes, graphene, or fullerenes when mechanically applied.

[0066] Printing in process step A is performed with high spatial resolution, i.e., with high precision. The positioning accuracy and / or the smallest dimensions of a mechanically applied or printed, dot-shaped material layer 4 are preferably less than 0.1 mm. Larger areas can also be printed contiguously.

[0067] In the next process step B, a high-energy heating radiation 9 is directed from the radiation source 8' onto the material layer 4 or the functional area 1.

[0068] The high-energy radiation source is in particular particle radiation, such as electron or ion radiation or radiation from other subatomic particles, but radiation with wave characteristics, such as laser or X-ray radiation, can also be used.

[0069] The high-energy heating radiation 9 is preferably bundled, focused or shielded by a device 10, so that no more than the respective functional area 1 with its at least one material layer 4 is irradiated.

[0070] Before the high-energy heat radiation 9 is directed onto the at least one material layer in the functional area 1, a drying step (not shown) can be performed in which the mechanically applied or printed material layer 4 is dried. An oven is preferably used to accelerate the drying process. The drying temperature is preferably below the annealing temperature or a phase transition temperature, e.g., the softening temperature of the base material 6, and preferably also below the melting temperature of the lowest-melting component in the at least one material layer 4.

[0071] In process step B, the material layer 4 heats up with increasing exposure time until it melts in process step C. The energy input of the high-energy heat radiation 9 can be controlled such that an interface 11 between the base material 6 and the material layer 4 also melts. This creates an intimate bond at the interface 11 between the base material 6 and the material layer 4.

[0072] The high-energy heating radiation 9 is then switched off or deflected away from the material layer 4 that has just been melted, so that it cools down.

[0073] After cooling, in process step D, a material layer 4 is formed that is firmly bonded to the base material 6. The dimensions of the material layer 4 or the functional area 1 are very precise due to the mechanical application process. Due to the irradiation, this dimensioning and positioning do not change throughout process steps A to D, thus maintaining the accuracy of the application process.

[0074] Since the high-energy heating radiation 9 acts only in an impact area 12 that is very small compared to the entire contact element 2, which is essentially limited in area to the beam cross-section 13 and a small effective depth, which preferably extends only approximately 0.05 µm to 20 µm into the base material 6, the heating of the impact area 12 takes place under adiabatic or quasi-adiabatic conditions. Due to the large mass, particularly of the base material 6, the cooling occurs so quickly and causes such a steep heat dissipation gradient that frozen microstructures, particularly amorphous, micro- or nanoscale structures, are present.

[0075] The heating of the material layer 1 in the exposure zone 12 is controlled by the parameters of the high-energy heating radiation 9 or the heating beam 15 focused by the device 10. The beam parameters are adjusted depending on the geometric properties of the material layer 4, such as its thickness and structure, and / or the material properties of the material layer 4, such as its density, thermal conductivity, and the melting points of the individual components.

[0076] For the Fig. In the process illustrated in Figure 1, the radiation parameters specified in Table 1 can be set if the high-energy heating radiation 9 is electron beam with a beam diameter of 100 µm. Beam diameters from 0.2 µm to 1 cm are generally conceivable, preferably from 20 µm to 1 mm. Beam diameters larger than the intended melting depth are useful in this case.

[0077] For a beam cross-section 13 with a beam diameter of 100 µm, effective depths 14 between 1 µm and 5 mm can be achieved. Table 1 Radiation parameters Value Exposure time 0.1 - 1000 microseconds Beam deflection speed 1 - 10 3 m / s Power density 1 - 10 10 W / mm 2 , preferably 10 2 - 10 6 W / mm 2 Acceleration voltage 1 - 100 kV electron current 0.1 - 100 mA Total performance 1 - 1000 (5000) watts Heating rate 10 4 - 10 10 K / s

[0078] The high-energy heating radiation 9 can be directed in pulses onto the functional area 1, which is useful, for example, in the case of an intermittent belt feed 7. Then the functional area 1 is specifically illuminated by the radiation source 8' when it is below this, i.e. in the example of the Fig. 1 is located under production station 8.

[0079] A change in the energy input can be achieved not only by changing the radiation energy and / or radiation energy density, but also by changing the radiation pulse duration or the time intervals between radiation pulses. Thus, the thermal energy contained in a material layer 4 can be increased by shortening the time interval between radiation pulses.

[0080] Fig. Figure 2 shows a further embodiment of the method according to the invention. In process step A, several material layers 4a, 4b, 4c are applied next to one another. By way of example only, Fig. 2 three layers of material arranged next to each other.

[0081] The material layers 4a, 4b, and 4c can be composed of the same or different materials. Due to the high precision of the printing process, the material layers 4a, 4b, and 4c are placed exactly next to one another. A distance of 16 between the material layers approximately corresponds to the accuracy of the application process, which ideally is zero, but in practice is preferably 0.1 mm at worst.

[0082] The material layers 4a, 4b, 4c are part of a coherent functional area 1.

[0083] In process step B, the high-energy heating radiation 9 is again directed onto the three material layers 4a, 4b, 4c. The size and shape of the beam cross-section 13, as well as the energy distribution across the beam cross-section 13, can be preferably variably adjusted by means of a preferably variable or controllable mask 17, which can be part of the device 10, and / or a defined beam layout, for example, a diffraction pattern generated by a diffraction grating 17', as well as by means of a programmed deflection of the beam. Thus, the high-energy radiation 9 is also limited to the functional area 1 in this embodiment.

[0084] If the material layers 4a, 4b, 4c are composed of different materials, the irradiation with the high-energy heating radiation 9 takes place in a first irradiation step, initially with an energy input that melts the fastest-melting material layer—here, these are the two material layers 4a, 4c. In particular, in this irradiation step, at least one beam pulse can be directed at the entire functional area 1, which immediately melts the two fast-melting material layers 4a, 4c. The radiation parameters to be set accordingly are listed above in Table 1.

[0085] After the high-energy radiation 9 is switched off at the end of process step B, the two previously melted material layers 4a, 4c solidify.

[0086] In a second irradiation step, process step C, high-energy radiation 9 is again directed onto the functional area 1. The high-energy radiation 9 is focused on those areas that could not be melted in the previous irradiation step because they require more energy to melt. In process step C, these areas are now melted. In order to limit the exposure area 12 to the unmelted material layer 4b, the functional area 1 can be positioned below a further production station 8 during the continuous or discontinuous belt feed 7, which generates a corresponding beam cross-section adapted to the base area of ​​the material layer 4b to be melted. Alternatively, the mask 17 and / or a device 10 can be modified such that the beam cross-section 13 changes. Due to the adiabatic orIn the quasi-adiabatic process, the heat supply has no effect beyond the area of ​​influence 12, the base area of ​​which corresponds to the jet cross-section 13.

[0087] If there are still additional, unmelted material layers remaining after process step C, the next irradiation step can be performed analogously, with the beam cross-section 13 now adjusted to the base area of ​​the remaining material layer(s). This can be repeated until all material layers have been melted.

[0088] In process step D, a functional area 1 with adjacent, melted and solidified material layers 4a, 4b, and 4c is then formed. The physical properties of these material layers depend on their material composition.

[0089] By melting, gaps 18 that arise during mechanical application between the adjacent material layers 4 can be leveled, so that a smoother surface is created.

[0090] In the embodiment of the Fig. 3, the method is modified in that two material layers 4a and 4b of a functional area are now arranged one above the other. Merely for the purpose of example, Fig. 3 shows only two superimposed material layers 4a, 4b. The number of superimposed material layers is determined by the requirements for the properties of functional area 1.

[0091] How Fig.As shown in Figure 3, the lower material layer 4a can have a larger base area than the upper material layer 4b. In particular, the lower material layer 4a preferably projects beyond the upper material layer 4b all around, creating a shoulder 19 exposed to the high-energy radiation 9. The shoulder is preferably not smaller than the smallest beam diameter 13.

[0092] The material layers 4a, 4b can be made of different materials, so that they require different energies and / or temperatures for melting.

[0093] The further procedural steps B to D largely correspond to the procedural steps of the procedure according to Fig.2: First, high-energy heating radiation 9 is directed onto the entire functional area 1, with the energy input limited to the amount necessary to melt the first material layer to melt, preferably the lower material layer 4a. The high-energy radiation can again be generated in the form of a pulse.

[0094] The beam cross-section 13 in process step B corresponds to the base area of ​​the lowest layer 4a. After the high-energy radiation 9 is switched off, at the end of process step B, the material layer 4a solidifies.

[0095] In process step C, high-energy radiation 9 is again directed onto the functional area 1. The beam cross-section 13 is limited to the not yet melted material layer(s) lying on top of the already melted material layer. Due to the locally limited supply of radiation energy, only the upper material layer 4b is melted, with the penetration depth 14 extending into the interface 11 between the material layers 4a, 4b.

[0096] If there are further material layers above the material layer 4b that have not yet been melted in process step C, this step can be repeated with a beam cross-section adapted to the base area of ​​these material layers.

[0097] At the end, in process step D, there is a functional area 1 with several layers lying on top of each other, the physical properties of which depend on the respective material composition.

[0098] The lower layer 4a can, for example, be a corrosion or diffusion protection layer which either provides chemical insulation between the upper material layer 4b and the base material 6, or which protects the base material 6 against corrosion in the area around the material layer 4b, for example in the manner of a sacrificial anode.

[0099] Since the high-energy radiation 9 can be focused on a very small area, the smallest beam cross-section 13 corresponds approximately to the wavelength of the high-energy radiation 9, the beam cross-section 13 and thus the area of ​​action 12 can be adjusted very precisely.

[0100] In Fig. 4 is a modification of the procedure of Fig. 3 shown.

[0101] The process steps A to C in Fig. 4 correspond to process steps A to C of the Fig.1. In process step D, a further material layer 4a is mechanically applied, for example, by printing, to the already existing, heated and / or melted material layer 4. Here, too, the high resolution of the mechanical application process enables the precise positioning of the material layer 4a on the underlying material layer 4. Subsequently, in process step E, the material layer 4a is heated and / or melted using high-energy radiation 9, resulting in a functional area 1 composed of two superimposed material layers 4, 4a. If additional material layers are required, process steps D and E can be repeated.

[0102] The Fig.The method shown in Figure 4 is particularly suitable for upper material layers 4a that completely cover the lower material layer. The radiation parameters for each newly applied upper material layer 4a are adjusted depending on the geometric and / or material properties of the material layer 4a in order to melt the lower material layer 4 only to the desired penetration depth 14.

[0103] In Fig. Figure 5 shows a further advantageous embodiment of the method. The upper material layer 4b extends beyond the lower material layer 4a.

[0104] The procedural steps largely correspond to the procedural steps according to Fig.1. Preferably, the two material layers 4a, 4b are mechanically applied to the base material 6 simultaneously. In the following process step B, in an advantageous embodiment of the process, the beam parameters of the high-energy radiation 9 are adjusted so that both material layers 4a, 4b are melted simultaneously. Through the melting process in process step C, the upper material layer 4b completely covers the lower material layer 4a and insulates it from external influences, such as corrosion.

[0105] With the method according to the invention, a mechanically applied material layer 4 can be alloyed into the base material 6 or a further material layer lying beneath the material layer 4 in a locally narrowly limited area and within the spatial resolution of the application method, or can be mixed with the base material 6 or the further material layer 4 by means of convection in the liquid state and frozen. This is briefly explained with reference to the Fig. 6 explained.

[0106] In process step A, a material layer 4 is first mechanically applied and then, in process step B, exposed to high-energy radiation.

[0107] The radiation parameters are preferably selected such that the material layer 4 and the underlying base material 6 heat up and cool down only slowly and, in addition, a high penetration depth 14 is achieved.

[0108] If the material layer 4 contains or consists of materials that can be alloyed with the base material 6, the alloying constituents of the material layer 4 diffuse into the base material 6 due to the heating by the high-energy heat radiation 9, creating an alloyed region 20 located within the base material 6. Depending on the cooling rate, different lattice structures of the alloyed region 20 can be obtained. For example, a sudden switching off of the high-energy radiation 9 causes almost immediate cooling and thus freezing of the lattice states. This leads to a hardening of the alloyed region 20 and a correspondingly hard, wear-resistant surface.

[0109] In the case of a material layer 4 that cannot be alloyed with the base material, or in the case of a material layer 4 that can be alloyed with the base material 6 and whose diffusion rate into the base material 6 is not sufficiently high, this material layer 4, together with a portion of the base material 6, is heated by the high-energy radiation 9 to such an extent that both melt and mix in the liquid state by convection. The resulting mixed phase is cooled so rapidly by removing the high-energy radiation that its microstructure freezes and remains stable.

[0110] Fig. 7 shows by way of example how a functional area 1 is produced from a single, preferably homogeneously printed material layer 4, which has areas 21a, 21b, 21c with different mechanical properties.

[0111] First, in process step A, the material layer 4 is mechanically applied. Subsequently, the high-energy heating radiation 9 is directed onto a partial area of ​​the material layer 4. The exposure zone 12 is accordingly limited to this partial area. Due to the high resolution and strong focusability of the high-energy radiation 9, the beam cross-section 13 or the extent of the exposure zone 12 can be precisely adapted to the design specifications, for example, the size of the partial area.

[0112] If, for example, a region of low hardness is to be created in the material layer 4 in process step B, the radiation parameters of the high-energy heating radiation 9 are preferably adjusted such that the high-energy heating radiation 9 is directed at low power over a long exposure time onto the region 21a to be produced. The energy input by the high-energy radiation 9 into the exposure region 12 is also varied over time such that the exposure region 12 cools only slowly after melting, so that thermal stresses are reduced and cooling occurs at or close to thermal equilibrium.

[0113] Subsequently, the beam 15 is moved over the material layer 4 into another section in order to create a sub-area with different mechanical properties. In process step C of the Fig.7, the beam 15 is moved into an adjacent area 21b. Instead of a beam movement, a new beam can alternatively be generated, for example, by moving the strip material 5 under a new production station 8 (not shown) during the feed movement 7.

[0114] Due to the precise positioning of the beam 15 with an accuracy of preferably less than 0.1 mm, the area 21b can be approached precisely relative to the existing area 21a. For example, high hardness can be achieved in this area by rapidly heating and cooling the area of ​​application 12 with high beam power over a short exposure time. The areas 21a, 21b can be directly adjacent to one another.

[0115] In subsequent process steps D, additional regions with different mechanical properties can be created. For example, in process step D, another partial region 21c of the material layer 4 can be irradiated with different radiation parameters compared to partial regions 21a and 21b in order to achieve different hardnesses. Other physical properties, such as strength, ductility, conductivity, or corrosion resistance, can also be adjusted by controlling the heating and cooling rates.

[0116] How Fig. As shown in Figure 8, the method according to the invention can also be used to create predetermined surface structures. Microscopic surface structures with a size of preferably less than 20 µm can be created.

[0117] For this purpose, in process step A, a material layer 4 is mechanically applied to the base material 6. Subsequently, a beam 15 of high-energy radiation 9 is focused on a partial area of ​​the material layer 4. The partial area is determined by the cross-section 13 of the beam 15 and the penetration depth 14. The cross-section 13 of the beam 15 is preferably not larger than the smallest surface structure to be created. The beam 15 is moved in a grid pattern over the material layer 4 while the radiation parameters are changed, for example, with successive radiation pulses with the radiation parameters specified in Table 2.

[0118] The surface can be structured, for example, by first melting or melting, or even evaporating, the material layer 4 across its entire depth using radiation parameters adjusted for a deep effect, e.g., using one of the above methods. Then, at the same location, additional material is melted or melted away using radiation parameters adjusted for a surface effect. The released or ejected material can settle at the edge of the exposure zone 12, giving the affected area a crater-like appearance. In a process with continuous relative movement between the high-energy radiation and the material layer 4, furrows can thus form.

[0119] If the entire surface of the material layer 4 is scanned with the beam 15, a functional area 1 with a surface structure 22 is obtained.

[0120] The depth and surface effect of the radiation parameters given in Table 1 is with reference to the Fig. 9 and Fig. 10. If according to Fig. 9 If high-energy radiation 9 with, for example, low acceleration voltage, i.e. low energy, is introduced into an applied material layer 4 over a short exposure time, only a small exposure depth 14 is obtained. Melting takes place primarily in the area of ​​the surface of the material layer 4.

[0121] If, on the other hand, as in Fig. 10, a medium acceleration voltage is applied, resulting in a greater penetration depth 14 because the high-energy radiation can penetrate deeper into the base material 6. The base material 6 is still melted even at great depth and bonds with the likewise melted material layer 4.

[0122] The Fig.The raster-like scanning of the material layer 4 with a beam 15 that covers only a partial area of ​​the material layer 4 described in Figure 8 can be used in addition to or as an alternative to the scanning process described in Figures 8 and 9. Fig. 1 and Fig. 3 can be used. This is briefly explained with reference to the Fig. 11 and Fig. 12 explained.

[0123] The process step A of the Fig. The material layer 4 applied to the substrate 11 is partially covered by the beam 15 of high-energy radiation 9. The exposure area 12 therefore extends only over a portion of the material layer 4. The beam 15 can now be continuously moved along a motion grid 23 over the material layer 4. Alternatively, the beam 15 is directed in a pulsed manner onto various points arranged in a grid on the material layer 4.

[0124] In the course of this raster movement, melted areas 24 of the material layer that have already been fused or soldered to the base material 6 lie directly next to areas that are not yet melted.

[0125] If the entire surface of the material layer 4 has been recorded, the same result is obtained in process step D as in process step D of the Fig. 1.

[0126] In Fig. 12 is process step B of the Fig.3 is replaced by a grid-shaped irradiation of the shoulder 19 of the lower material layer 4a of a functional area 1. As indicated by the arrow 25, the beam 15 is guided in a grid-like manner along the shoulder 19 so that it is completely covered and melted. The radiation parameters are set so that a large penetration depth 14 is achieved. If further shoulders 19 are present in the upper layers, process step B can be repeated. Otherwise, the process is continued with process steps C and D, as already described in Fig. 3. The radiation parameters of the high-energy radiation 9 or beam 15 are modified compared to process step B depending on the geometric and material properties of the now irradiated material layer 4b. Here, too, a pulsed beam 15 can be used, which is directed successively onto the individual raster points.

[0127] The method according to the invention not only allows, as in Fig. 7, create areas with different properties next to each other in a homogeneously applied material layer 4. How Fig. As shown in Figure 13, layers with different properties can also be created on top of each other in an originally homogeneously applied material layer 4.

[0128] For this purpose, the entire material layer 4 applied in process step A and the underlying interface 11, here merely by way of example the interface between the material layer 4 and the base material 6, are first melted. The beam 15 can be guided in a grid-like and point-like manner over the material layer 4 or can irradiate the entire material layer 4 simultaneously. The radiation parameters in process step C can, in particular, be set to a large penetration depth 14. At the same time, the temporal energy input in process step B by the radiation 9 is dimensioned such that the respective melted areas cool suddenly and thus the microstructure is frozen.This hardening process is followed by a renewed heating of the material layer 4 in process step C, wherein the radiation parameters of the radiation 9 are adjusted such that only a shallow penetration depth 14 is achieved, which amounts to only a portion of a thickness 26 of the material layer 4. The temporal energy input in process step C by the radiation 9 can be controlled such that cooling in this area occurs more slowly, so that a more ductile upper layer 4b is formed on a hard lower layer 4a. Above the layer 4b, a further layer with different mechanical hardness properties can be created by a further optional process step (not shown) if the radiation parameters are adjusted according to process steps B (harder layer) or C (more ductile layer).

[0129] Alternatively, in process step B, the radiation parameters can be adjusted so that the depth of maximum energy input is at the interface 11. For particle beams, this can be achieved by controlling the kinetic energy of the particles. For high-energy heat radiation 9 with wave characteristics, this can be achieved by controlling or selecting the wavelength. This can ensure that only the material layer 4a melts, while the material layer 4b is only slightly heated.

[0130] Due to the high thermal conductivity of the metal pastes preferably used for mechanical application and the very large mass of the base material 6, which is also highly thermally conductive, compared to the material layer 4, the repeated heating of the upper material layer 4b in process step C does not impair the mechanical properties of the lower material layer 4a. The heat is dissipated so quickly from the upper material layer 4b into the base material 6 that heating of adjacent areas does not occur or only occurs to a negligible extent.

[0131] In Fig.14 schematically shows how, in a process step B, two functional areas 1', 1" spaced apart from one another, which were printed with respective material layers 4a and 4b in a process step A, can be irradiated simultaneously using two separate beams 15', 15" or a beam split into two partial beams 15' and 15". In this way, functional areas 1' and 1" arranged at a greater distance from one another are produced in one process step.

[0132] In Fig.Figure 15 schematically shows how a material layer 4 can be mechanically applied to the base material 6 by spraying it using a spraying tool 28. The spray jet 29 can be directed onto the area of ​​action 12 of the high-energy radiation 9. In the jet 15, the sprayed powder mixture, which can have a material and particle distribution, melts and impinges in droplet form on the molten base material 6, with which it bonds. The further powder layers fuse with the underlying powder layers, so that layer by layer the spray jet 29 can be built up. Powder not captured by the jet 15 can be collected and reused. The high-energy heating radiation 9 can be pulsed, so that preferably only the upper material layer 4 can repeatedly harden.

[0133] With the Fig.15 schematically illustrated method, a height-contoured functional area 1 can be created, in which the material layer 4 has different heights in the surface direction. This can be achieved, for example, by moving the jet 15 in a grid pattern over the base area of ​​the functional area 1 with the spray tool 28 continuously operated. The longer the jet 15 remains at one point, the more powder bakes at this point and the higher the material layer 4 becomes at this point. Subsequently, the functional layer 1 can be further processed according to one of the methods described above, for example with the Fig. 11 shows the process for producing layers with different mechanical properties.

[0134] By spraying, material layers 4 made of different materials can also be built up next to or on top of each other if the consistency of the spray jet 29 is changed over time.

[0135] As in Fig. 16 and Fig. 17, the mechanical application of the material layer 4 can also be carried out by applying a wire 4' or a foil 4" (not shown). In the following process step B, the beam parameters of the high-energy heating radiation 9 can be adjusted so that the wire only partially melts and bonds with the base material 6, as in Fig. 16. Alternatively, the beam parameters can be set as shown in Fig. 17, can be adjusted so that the applied wire melts completely and the resulting molten material layer has a rather flat profile. Fig.16 schematically illustrated method, a material layer 4 can be produced whose height profile varies along the surface direction.

[0136] In particular, the wire 4' or the foil 4" can be introduced into the high-energy heating radiation 9 or the area of ​​influence 12 covered by the high-energy heating radiation 9, as in Fig. 18. The material can be applied at specific points, in lines, or over a large area, whereby the supply of 4' wire or 4" foil can come from a roll.

[0137] With reference to the Fig. 19 to 22, exemplary embodiments of contact elements are described below which have functional areas 1 produced according to the method according to the invention.

[0138] When the strip material 5 is moved in the feed direction 7, the functional areas 1 are first created according to one or more of the methods described above.

[0139] Subsequently, the contact element 30 is cut from the strip material 5, preferably with the high-energy heating radiation 9, which was already used to produce the functional areas 1.

[0140] In addition to cutting, the high-energy heat radiation 9 can also be used for further processing steps of the contact element 30 or the strip material 5, such as hardening the base material 6, as well as drilling and welding. The line 31 along which the contact element 30 is cut out by the high-energy beam 9 (not shown) is shown in Fig. 19 shown in dashed lines.

[0141] The contact element 30 has, purely by way of example, two different types 32, 33 of functional areas 1. A first functional area 1 serves as a connection area 32 for crimp connections to be applied in subsequent processing steps. The contact element 30 is a contact spring for a socket contact.

[0142] The connection area 32 is coated with a large-area, homogeneous material layer 4, which preferably contains tin or consists of tin.

[0143] The further functional areas 1 are contact points 33, which are constructed from at least two material layers 4a, 4b.

[0144] In Fig. 20, which is the detail XX of the Fig.19 is an enlarged view, showing the structure of a contact point 33. The material layer 4a forms a contact point 34 of the contact point 33. At the contact point 34, a mating contact contacts the contact element 30 when the contact element 30 is installed. In the illustrated contact element 30 for a socket contact, the contact movement occurs perpendicular to the plane of the contact element 30 toward the contact point 33, so that the contact point 34 should have a high impact and wear resistance in order to withstand many mating cycles without damage.

[0145] The material layer 4b surrounds the material layer 4a and forms a contact environment region 35. The material layer 4a can be arranged next to or on the material layer 4b, as shown, for example, in the Fig. 2, Fig. 3, Fig. 12 is shown.

[0146] The contact environment area is intended to prevent corrosion of the base material 6 around and / or below the contact point 34 or the corrosion of the contact point 34. The material layer 4b can therefore be doped with a less noble metal compared to the base material 6 and the main component of the contact point 33. In particular, a thin layer thickness can be selected for this purpose, since no material removal during use, as in the run-in area, is to be expected in this area.

[0147] The functional area at the contact point 33 can be constructed from one or more material layers consisting of a hardenable material. In the area of ​​the contact point 34, at least one layer can be hardened and border on a non-hardened layer or a layer with lower hardness and greater ductility, as is the case, for example, in Fig. 7. In the contact area 35, the material layer 4 can be arranged as shown in Fig. 2 and Fig.7, and consequently have different physical properties than at contact point 34. In this way, high impact strength combined with high wear resistance can be achieved.

[0148] The material layers 4a, 4b preferably consist of different materials. The material layer 4a forming the contact point 34 has a reduced electrical resistance and increased impact resistance compared to the contact surrounding area 35.

[0149] In Fig. Figure 21 shows a strip material 5 from which contact elements 30 for a connector are cut using high-energy radiation 9 (not shown). Line 31 schematically shows the outer contour of the contact elements, which are bent into their final shape in a subsequent processing step.

[0150] In the Fig.21, two different types 32, 33 of functional areas 1 are shown merely as examples. One functional area 1 serves as a connection area 32 for soldering electrical conductors. Except for its outer contour, it essentially corresponds to the structure of the connection area 32 of the Fig. 19. The other functional area 1 serves as a contact point 33, in which, however, the structure and arrangement of the material layers 4 is optimized with regard to the different mechanical stress during operation.

[0151] Fig. 22 shows as detail XXII a contact point 33 of the contact element 30.

[0152] The functional area 1 forming the contact point 32 accordingly has three material layers 4a, 4b, 4c. The material layers 4a, 4b, 4c are preferably arranged next to one another. The material layers 4a, 4b are made of the same material, for example, according to the method according to Fig.6. The material layer 4c is surrounded by the material layer 4b and has a different composition than the material layer 4c.

[0153] The material layer 4a forms an inlet area 36 of the contact point 33, in which a counter contact strikes the contact element 30 when establishing a plug connection. In this area, it is advantageous if the material layer has increased wear and impact resistance, similar to the contact point 34 of the Fig. 19 and Fig. 20. This can be achieved, for example, by the material layer 4a being coated by the method according to Fig. 13 and, for example, has a hardened layer on top of a softer layer. In particular, this inlet region can also be made of electrically insulating materials if no current flow is desired or necessary in this inlet region 36.

[0154] During operation of the contact element 30, the mating connector is guided over the contact point 32 in a mating direction 39 during the mating movement via a lead-in area 36. The material area 4b in the lead-in area 36 is tribologically optimized. For example, it can have surface structures 22 running in the mating direction 39 that guide the mating connector. It can also or alternatively be doped with materials that provide lubrication. For example, microparticles with good lubricating properties, such as graphite, can be embedded in the material layer 4b or sprayed onto it in a matrix.

[0155] In the plug-in direction 39, the contact plug-in area 37 is adjoined by the contact point 38, which corresponds to the contact point 34 of the Fig.20 is constructed from one or more material layers with low conduction and contact resistance. Additionally, the contact point 38 can be provided with a surface structure that leads to increased friction, so that the mating contact is held more securely and any oxide layers are removed by minimal surface removal.

[0156] If one of the material layers 4a, 4b, 4c of the contact point 33 contains materials that can react with the base material 6, an intermediate layer can be provided that electrically insulates the materials of the inlet region 36 of the contact plug-in region 37 and the contact point 38 from the base material.

[0157] The high-energy radiation 9 can be used for quality control, for example by using a scanning electron microscopic imaging method for geometry and material contrast to check the manufactured functional areas.

[0158] The process according to the invention, in its variants described above, which can be combined with each other in any way, even partially, is highly environmentally friendly, unlike wet-chemical processes. Due to the precise positioning and dimensioning of the material layers, only as much material is used as is actually needed to produce the functional area.

[0159] The process enables the use of contact materials and material combinations that cannot be produced conventionally, improving product properties while reducing material usage. It is also possible to produce amorphous micro- and nanostructures as well as frozen mixed phases of non-alloyable materials, and to simultaneously display various material functions, such as good electrical contact, easy solderability, and corrosion and wear protection.

[0160] The material layers can be structured, contoured and their mechanical properties can be influenced, but only over partial areas.

[0161] Finally, high production speeds are possible and the high-energy radiation can be used simultaneously for further processing steps and for quality control. Reference symbol 1 functional area 2 contact element 3 Surface 4 material layers 4a - 4c different material layers 4' wire 4" film 5 Tape material 6 Basic material 7 Tape feed 8 production stations 8' radiation source 9 high-energy heating radiation 10 Device for focusing the high-energy radiation 11 Interface 12 Area of ​​influence 13 Beam cross-section 14 Depth of action 15 Heating beam 16 Distance between material layers 17 Mask 17' diffraction grating / grating 18 gap 19 Shoulder 20 alloyed area / frozen microstructure 21a - 21c Part of a material layer 22 Surface structure 23 movement grids 24 melted areas 25 Arrow 26 Thickness of the material layer 27 beam splitters 28 Spray tool 29 spray jet 30 contact element 31 Line 32 connection area 33 Contact point 34 contact point 35 Contact environment area 36 Inlet area 37 Contact plug-in area 38 Contact point 39 Plug-in direction

Claims

[1] Method for producing at least one functional area (1) on an electrical contact element (30), wherein the at least one functional area is limited to a partial area of the contact element, wherein at least one material layer (4) in the functional area (1) is mechanically applied to the contact element (30) and then a high-energy heating radiation (9) is directed onto the at least one material layer, wherein the high-energy heating radiation (9) is a particle radiation, characterized by that the depth of the maximum energy input is controlled by means of beam parameters depending on the desired effect. [2] Method according to claim 1, characterized by that the material layer (4) is printed. [3] Method according to claim 1 or 2, characterized by that the material layer (4) is sprayed on. [4] Method according to one of claims 1 to 3, characterized bythat the material layer is provided as a wire or foil. [5] Method according to one of claims 1 to 4, characterized by that in the functional area (1) several different material layers (4a, 4b, 4c) are mechanically applied one above the other and / or next to the other. [6] Method according to one of claims 1 to 5, characterized by that in the functional area (1) a smaller material layer (4b) is applied to a larger material layer (4a). [7] Method according to one of claims 1 to 5, characterized by that in the functional area (1) a larger material layer (4b) is applied to a smaller material layer (4a). [8] Method according to one of claims 1 to 7, characterized by that material layers (4) made of different materials are applied in the functional area (1). [9] Method according to one of claims 1 to 8, characterized bythat the material layer (4) is applied with an accuracy of less than 0.1 mm. [10] Method according to one of claims 1 to 9, characterized by that an area of action (12) of the high-energy heating radiation (9) is limited in area to the at least one material layer (4). [11] Method according to claim 10, characterized by that the high-energy heating radiation (9) is limited to a partial area of the at least one material layer (4). [12] Method according to one of claims 1 to 11, characterized by that partial regions of the at least one material layer (4) lying one above and / or below one another are melted one after the other. [13] Method according to one of claims 1 to 12, characterized by that radiation parameters of the high-energy heating radiation (9) are changed during the irradiation of the functional area (1). [14] Method according to one of claims 1 to 13, characterized bythat the same partial area (4a, 4b, 21a, 21b) is heated several times in succession. [15] Method according to one of claims 1 to 14, characterized by that the energy input of the high-energy heating radiation (9) into the material layer (4) is changed depending on the position of the exposure area (12) and / or the exposure time in the exposure area (12). [16] Method according to one of claims 1 to 15, characterized by that the energy input of the high-energy heating radiation (9) is changed depending on the material composition of the irradiated material layer (12). [17] Method according to one of claims 1 to 16, characterized by that the cooling in the area of influence (12) is controlled by the high-energy heating radiation. [18] Method according to one of claims 1 to 16, characterized by that the surface of the material layer (4) is structured with the help of the high-energy heating radiation (9). [19] Method according to one of claims 1 to 17, characterized by that with the aid of the high-energy heating radiation (9) an alloyed region (20) is produced from the material layer (4) in a base material (6) of the contact element (30). [20] Method according to claim 19, characterized by that with the help of the high-energy heating radiation the material layer (4) is melted together with the underlying base material (6) or further material layers (4) and the mixed phase resulting from convection is frozen in its microstructure by very rapid cooling. [21] Method according to one of claims 1 to 18, characterized by that in the functional area (1) within a material layer (4) of the same material sections (4a, 4b) with different mechanical properties are produced by changing the radiation parameters of the high-energy radiation (9). [22] Method according to one of claims 1 to 21, characterized by that the high-energy heating radiation (9) is used for processing the contact element (30) before and / or after the production of the functional area (1). [23] Method according to one of claims 1 to 22, characterized by that the high-energy heating radiation (9) is used for quality control. [24] Method according to one of claims 1 to 23, characterized by that the contact elements are processed in strip or band form (5). [25] Device (8) for producing contact elements with a feed device for strip material (5), with a radiation source (8) by means of which high-energy radiation (9) can be generated during operation and can be focused on a partial area of the strip material (5), wherein the radiation source (8) is a particle radiation source, characterized by that the device (8) adjusts the depth of maximum energy input by controlling the kinetic energy. [26] Electrical contact element (30), characterized by that it is produced by the process according to any one of claims 1 to 24. [27] Electrical contact element (30) according to claim 26, characterized by that the functional area (1) has material layers (4a, 4b, 4c) arranged next to and / or one above the other with different mechanical properties. [28] Electrical contact element (30) according to one of claims 26 or 27, characterized by that the functional area (1) has hardened and unhardened material layers (4a, 4b). [29] Electrical contact element (30) according to one of claims 26 to 28, characterized by that the material layer (4) has an amorphous, micro- and / or nanoscale structure. [30] Electrical contact element (30) according to one of claims 26 to 29, characterized by that the functional area (1) has an area (20) alloyed into the contact element. [31] Electrical contact element (30) according to one of claims 26 to 30, characterized by that non-alloyable materials are frozen nanocrystalline.

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