Printed circuit board with embedded high-frequency RFID, manufacturing process and RFID system

Abstract

Printed circuit board (102) with embedded RFID, comprising: a plate with a non-conductive substrate (103) and one or more conductive traces (105); one or more electronic components (108) coupled to the plate, wherein the one or more electronic components (108) are mechanically supported by the non-conductive substrate (103) and electrically coupled by the conductor tracks (105); and a high-frequency RFID tag (104) embedded in a cavity (110) of the non-conductive substrate of the plate, wherein the label (104) comprises a first antenna and a second antenna (202) formed on opposite sides of a flexible label substrate and electrically coupled to each other via a bore through the flexible label substrate.

Description

Field of the invention

[0001] The present invention relates to the field of high-frequency radio frequency identification (RFID). In particular, the present invention relates to printed circuit boards with embedded high-frequency RFID tags. State of the art

[0002] Printed circuit boards (PCBs) are key components in almost every application in the electronics industry. However, as manufactured, this component of an electronic or electrical system offers no protection against counterfeiting and cannot be easily detected automatically. As a result, barcodes are often used to identify a PCB. Generally, the barcodes are etched into the surface of the PCB or affixed to the surface like a barcode sticker. However, the etched barcodes require a lot of space on the PCB, and the sticker barcodes must be affixed to the surface of the PCB by hand and can therefore be easily counterfeited and / or removed. As a result, the barcodes often do not last the entire lifetime of the PCB without being removed or otherwise damaged, rendering the PCBs inadequately identifiable.Alternatively, many companies are using radio frequency identification (RFID) tags instead of barcodes. These tags are added to the other components on their PCB. Specifically, the tag's RFID chip is bonded to the PCB surface using a conductive adhesive or solder, and a tag antenna is printed onto the surface of the RFID chip. However, like barcodes, these RFID tags can be damaged and / or removed and therefore do not last the entire lifespan of the PCB.

[0003] DE 10 2011 007 293 A1 discloses a printed circuit board with embedded RFID, comprising a board with a non-conductive substrate and one or more conductive traces, one or more electronic components coupled to the board, wherein the one or more electronic components are mechanically supported by the non-conductive substrate and electrically coupled by the conductive traces, and a high-frequency RFID tag embedded in a cavity of the non-conductive substrate of the board. WO 2012 / 036 844 A1 discloses a similar subject matter.

[0004] Furthermore, DE 698 30 846 T2 and US 2010 / 0 230 672 A1 should be mentioned, which concern a radio frequency identification label on a flexible substrate and the manufacture of integrated circuits with various components, respectively. Summary of the invention

[0005] A system, method, and apparatus with embedded radio frequency RFID includes a PCB with a non-conductive substrate and conductive traces on the substrate. The non-conductive substrate mechanically supports the PCB, and the conductive traces electrically couple electronic components (e.g., microchips, resistors, capacitors) on the board, allowing the PCB to function. Furthermore, the PCB advantageously includes a radio frequency RFID tag embedded within the PCB itself and held in place by a non-conductive adhesive. As a result, the embedded radio frequency system, method, and apparatus provides the ability for each PCB to store data, giving each PCB sold to a customer a unique ID that is readable throughout the product's lifetime.The label is particularly protected against damage and disassembly because it is sealed within the PCB itself and not simply exposed on the PCB's surface. Furthermore, the label embedded in the PCB can be read wirelessly and stores data for tracking the entire production chain, from the transportation phase to the final product. The stored data can include information about how, when, and where the PCB and / or chips on the PCB were tested, which can be used to determine the effectiveness of positions and testing procedures and to locate errors that cause product defects. Furthermore, the unique ID / stored information can be used to access data regarding the PCB's production, quality, and / or serviceability, stored in a PCB database that links each unique ID to data about the PCB in which the label is embedded.

[0006] A first aspect relates to a printed circuit board with embedded RFID. The printed circuit board comprises a board with a non-conductive substrate and one or more conductive traces, one or more electronic components coupled to the board, wherein the one or more electronic components are mechanically supported by the non-conductive substrate and electrically coupled by the conductive traces, and a radio-frequency RFID tag embedded in a cavity of the non-conductive substrate of the board. The tag can be secured in the cavity with a cavity adhesive that couples the tag to the board. The tag comprises a first antenna and a second antenna formed on opposite sides of a flexible tag substrate and electrically coupled to each other via a bore through the flexible tag substrate.The tag may include an RFID chip electrically coupled to the first and second antennas and the flexible tag substrate by a conductive adhesive. The first and second antennas may be uncoated on the flexible tag substrate so that the cavity adhesive is in direct contact with the antennas. The tag may be a passive tag, so that the tag is powered solely by incoming electromagnetic signals received by one or more of the antennas. The cavity may have a depth of 200 to 300 micrometers, and the first and second antennas have a thickness of 5 to 10 micrometers. The bottom of the cavity of the non-conductive substrate may include one or more through-holes, each forming feedthroughs from the cavity through the non-conductive substrate to the opposite side of the non-conductive substrate.The cavity adhesive may surround at least the top surface of the label to protect the label and seal the label within the cavity. The label may store an identifier that uniquely identifies the circuit board.

[0007] A second aspect relates to a method for manufacturing a printed circuit board with embedded RFID. The method comprises providing a board having a non-conductive substrate and one or more conductive traces coupling one or more electronic components coupled to the board, wherein the one or more electronic components are mechanically supported by the non-conductive substrate and electrically coupled by the conductive traces, forming a cavity within the non-conductive substrate of the board and embedding a radio-frequency RFID tag within the cavity of the non-conductive substrate of the board. The method may further comprise securing the tag within the cavity with a cavity adhesive that couples the tag to the board.The tag includes a first antenna and a second antenna formed on opposite sides of a flexible tag substrate and electrically coupled to each other via a bore through the flexible tag substrate. The tag may include an RFID chip electrically coupled to the first and second antennas and the flexible tag substrate by a conductive adhesive. The first and second antennas may be uncoated on the flexible tag substrate so that the cavity adhesive is in direct contact with the antennas. The tag may be a passive tag, so that the tag is powered solely by incoming electromagnetic signals received by one or more of the antennas. The cavity may have a depth of 200 to 300 micrometers, and the first and second antennas have a thickness of 5 to 10 micrometers.The method may further comprise forming one or more through-holes in the bottom of the cavity of the non-conductive substrate, each forming a feedthrough from the cavity through the non-conductive substrate to the opposite side of the non-conductive substrate. The cavity adhesive may surround at least the top surface of the label to protect the label and seal the label within the cavity. The label may store an identifier that uniquely identifies the circuit board. The method may further comprise testing the board, the electronic components, and the label for defects prior to coupling the embedded label in the board.

[0008] Another aspect relates to an RFID system. The system includes a board with a non-conductive substrate and one or more conductive traces, one or more electronic components coupled to the board, the one or more electronic components being mechanically supported by the non-conductive substrate and electrically coupled by the conductive traces, a radio-frequency RFID tag embedded in a cavity of the non-conductive substrate of the board that stores data, and a tag reader capable of reading the data stored on the radio-frequency RFID tag. The tag can be secured in the cavity with a cavity adhesive that couples the tag to the board. The tag includes a first antenna and a second antenna formed on opposite sides of a flexible tag substrate and electrically coupled to each other via a bore through the flexible tag substrate.The tag may include an RFID chip electrically coupled to the first and second antennas and the flexible tag substrate by a conductive adhesive. The first and second antennas may be uncoated on the flexible tag substrate so that the cavity adhesive is in direct contact with the antennas. The tag may be a passive tag, so that the tag is powered solely by incoming electromagnetic signals received by one or more of the antennas. The cavity may have a depth of 200 to 300 micrometers, and the first and second antennas have a thickness of 5 to 10 micrometers. The bottom of the cavity of the non-conductive substrate may include one or more through-holes, each forming feedthroughs from the cavity through the non-conductive substrate to the opposite side of the non-conductive substrate.The cavity adhesive may surround at least the top surface of the label to protect the label and seal the label within the cavity. The data may include an identifier that uniquely identifies the circuit board.

[0009] Further features of the present invention will become apparent from consideration of the following description in conjunction with the accompanying drawings. Short description of the drawings

[0010] The novel features of the invention are set forth in the appended claims. However, for illustrative purposes, various embodiments of the invention are set forth in the following drawings. In the drawings: Fig. 1 a system with embedded high-frequency RFID according to some embodiments, Fig. 2 is a functional block diagram of a system with embedded RFID according to some embodiments of the invention, Fig. 3 is a flow diagram of a method for manufacturing a printed circuit board with embedded radio frequency RFID according to some embodiments. Detailed description

[0011] In the following description, for purposes of explanation, numerous details and alternatives are set forth. However, those skilled in the art will recognize that the invention may be practiced without the use of these specific details. In other instances, well-known structures and devices are shown in block diagram form in order not to obscure the description of the invention with unnecessary detail.

[0012] The embedded RFID system, method, and apparatus described herein are designed to provide a cost-effective way to track printed circuit boards or other products throughout their life cycle. Unlike prior art stage-based systems, the cascade topology of the embedded RFID system described herein can provide a feedback loop isolated from the system output, thereby simplifying the feedback control algorithm and eliminating the need for output isolation electronics within the feedback loop. In particular, because the cascade topology allows the system output to be measured by the feedback loop before being exposed to the transformer, the system controller does not need to compensate for transformer effects on the output signal.Furthermore, since this feedback loop is already isolated from the output by the transformer, no additional costly isolation circuitry, such as that used in step-based converters, is required. By cascade-configuring an isolated converter with a non-isolated converter, the embedded RFID system can benefit from the advantages of both converters.

[0013] Fig. 1 shows a system 100 with embedded high-frequency RFID according to some embodiments. As shown in Fig. 1, the system 100 includes a circuit board 102 having an embedded RFID tag 104 and in communication with an RFID tag reader 106. The tag 104 is sealed within a cavity 110 of the non-conductive substrate 103 with an adhesive material 112. The adhesive material 112 may, in particular, comprise one or more polyurethanes, acrylics, epoxies, other adhesive types, or a combination thereof. In some embodiments, the tag 104 is completely covered or encapsulated by the adhesive material 112 and / or the adhesive material 112 fills the cavity 110 such that the tag 104 is not exposed to the surface of the substrate 103. Alternatively, one or more portions of the tag 104 may be exposed and / or the adhesive material 112 may fill only a portion of the cavity 110. The circuit board 102 may include a rigid or semi-rigid non-conductive substrate 103, one or more conductive portions 105 (e.g.B. Conductive traces) and / or one or more electrical components 108 (e.g., microchip, diode, capacitor, resistor, inductor, amplifier). The conductive portions 105 are electrically coupled to the one or more conductive components 108, and the non-conductive substrate provides mechanical support to the conductive portions 105 and / or the electrical components 108. The non-conductive substrate 103 may comprise one or more composites, such as L4, and / or other types of non-conductive material. The conductive portions 105 may comprise copper and / or other conductive materials (e.g., palladium, gold, silver).

[0014] The label 104 and / or the cavity 110 may be located anywhere within the circuit board 102, however, the label 104 (and thus the cavity 110) may advantageously be located away from some or all of the electrical components 108 and / or the conductive portions 105. In particular, the spacing between the label 104 and the electrical components 108 and / or the conductive portions 105 makes it possible to reduce interference with radio frequency signals 99 transmitted between the label reader 106 and the label 104. As shown in Fig. 1, the surface above (and below) the label 104 may be free of electrical components 108 and / or conductive portions 105 to reduce the possibility of interference with the signals 99. The cavity 110 may have a depth slightly greater than the width of the label 104, which is typically 50 to 100 micrometers. In some embodiments, the depth of the cavity 110 is 200 to 300 micrometers. Alternatively, the cavity 110 may optionally have other or different depths. Furthermore, the cavity 110 may have a circumference and shape such that the cavity 110 conforms to the label 104. For example, if the label 104 is a flat square, the cavity 110 may be a slightly larger flat square or another larger shape that fits the square.In some embodiments, the cavity 110 includes one or more cutouts or holes (not shown) that form openings or passages from the interior of the cavity 110 through the circuit board 102 (e.g., the non-conductive substrate 103) to the other side of the circuit board 102. In such embodiments, these holes provide the opportunity for ventilation after the label 104 is embedded in the cavity 110 and sealed with the adhesive 112.

[0015] The tag reader 106 may be any type of radio frequency tag reader capable of wirelessly reading RFID tags (e.g., passive, semi-passive, and / or active tags). Although the circuit board 102, as shown in Fig. 1 comprises a single label 104 and a single electrical component 108, any number of labels 104 and / or electrical components 108 may be used. Furthermore, one or more portions of the non-conductive substrate 103 and / or the remainder of the circuit board may be flexible. Fig. 2 shows the high-frequency RFID tag 104 according to some embodiments. As in Fig. 2, the label 104 includes one or more antennas or inductors 202, an insulated label substrate 204, a label circuit 206 (e.g., silicone or other microchip type), and one or more contact pads 208. Alternatively, the label 104 may include more or fewer components. In some embodiments, the label substrate 204 is made of polyimide. Alternatively, the label substrate 204 may include polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), liquid crystalline polymer (LCP), Mylar, paper, plastic, Kapton, polyimide, and / or the like, or any combinations thereof. In some embodiments, the label substrate 204 is flexible, having a thickness of 50 micrometers. Alternatively, one or more portions of the label substrate 204 may be rigid and / or have higher or lower thicknesses.The tag circuitry 206 is coupled to the substrate 204 and / or the contact pads 208 by a conductive adhesive material. In some embodiments, the conductive adhesive material is an anisotropic conductive paste. Alternatively, other conductive adhesives are usable. The conductive adhesive material may be filled or unfilled. For example, the adhesive material may be filled with one or more conductive particles, such as NiAu particles. Alternatively, other types of fillers are usable. The tag 104 may include two antennas 202 that may be disposed on a top and a bottom surface of an insulated tag substrate 204. In particular, in such embodiments, the tag 104 may include one or more holes (not shown) that couple the antenna 202 on the top surface to the antenna 202 on the bottom surface. To reduce the size of the label 104, the holes can be 1 mm micro-holes.Alternatively, holes of other sizes can be used. Alternatively, a single antenna 202 can be used, so no holes are required.

[0016] To reduce the size of the tag 104, the antennas 202 can have a thickness of just 5 to 10 micrometers, allowing the wires of the antennas 202 to be arranged closer together. Alternatively, the antennas 202 can have larger or smaller thicknesses. The tag circuitry 206 can be arranged on the inside of the antenna 202 on one side of the substrate 204. Alternatively, the circuitry 206 can be arranged at other locations on the side of the substrate 204 and / or on both sides of the substrate 204. The contact pads 208 can be used to connect each end of the antenna 202 to the circuitry 206 of the RFID tag 104. The contact pads 208 can, for example, be electrically coupled to one or more chip pads of a microchip of the circuitry 206 (e.g., gold chip pads). As a result, the number of contact surfaces 208 can be adapted to the number of antennas 202 and / or the number of contacts of the circuit 206.The circuitry 206 may include a non-transitory computer-readable memory that stores data. For example, the memory may store a unique identifier used to identify the circuit board 102. In addition, the memory may store other information about the circuit board 102 and / or the RFID tag 104, such as data about when and where it and its components were manufactured, functional requirements, and / or other types of data. Alternatively or additionally, the information in the memory may include a product identifier uniquely associated with one or more entries in a database that can be accessed to obtain information regarding the product. This data may be read by the reader 106 when it communicates with the tag 104. In some embodiments, the reader 106 may also add new data and / or edit the data on the tag 104.In other words, the memory can be a random access memory, a read-only memory, a write-once, read-many-time memory, or another type of memory.

[0017] As in Fig. 2, the antenna 202 may include a spiral coil comprising a plurality of straight sections arranged at angles of substantially 90° to each other. Although the antenna 202 is illustrated in the shape of a square spiral, other configurations (e.g., rectangular spiral, circular spiral, hexagonal spiral, other spirals, or other configurations) are alternatively contemplated. In some embodiments, the antenna 202 is constructed of copper. Alternatively, some or all of the antennas 202 may be constructed of one or more of copper, aluminum, refined metal, electrically conductive organic and inorganic materials, other electrically conductive material types, or combinations thereof.Conventionally, the antennas 202 and / or the circuitry 206 are protected with a solder mask, covercoat, or similar coating; however, in some embodiments, the antennas 202 may not be coated by such a mask because they are bare copper. This lack of coating may be compensated for by the possible coverage of the label 104 by the adhesive 112, reducing the cost of the label 104. In some embodiments, the antennas 202 and / or the circuitry 206 may be protected by a first-generation organic solder preservative (OSP) (e.g., using imidazoles or benzotriazoles).Alternatively, the antennas 202 and / or the circuitry 206 may be protected by hot air solder leveling (HASL), electroless nickel / immersion gold (ENIG), immersion silver, immersion tin, or other types of PCB surface treatment alternatives. The RFID tag 104 may have a relatively small footprint (e.g., a 5 mm by 5 mm square or less) so that it can be attached to or integrated into the circuit board 102 or other device without interfering with its intended purpose. Furthermore, by using a small tag 104, the cost of the RFID tag 104 may be relatively low because less material is required. In some embodiments, the tag 104 is capable of operating at a frequency of 13.56 MHz or higher. Alternatively, the label 104 can operate at lower frequencies. As shown in . Fig. As shown in Figure 2, the RFID tag 104 is a passive tag. Alternatively, the tag 104 can be active (with a battery to power active transmission), semi-passive (with a battery to power circuit 206 but not to power active transmission), or passive (without a battery).

[0018] In operation, the circuit board 102 and thus the embedded tag 104 are brought into a reading range formed by the reader 106, so that the reader 106 can transmit an RF interrogation signal 99, which is modulated upon receipt by the tag 104. For example, the reader 106 can generate an electromagnetic interference with an undamped waveform (continuous wave, CW) at a specific (carrier) frequency, and this interference can be modulated by the RFID tag 104 to correspond to data to be transmitted back to the reader 106 via the interference. The modulated interference or signal can thus transmit the information at a data rate lower than the carrier frequency. The RFID tag 104 may modulate the RF signal 99 to impart information stored within the RFID tag 104 to the signal and transmit the modulated RF signal back to the reader 106.As a result, the information about the printed circuit board 102 is easily readable and can be used to uniquely identify the board and determine other characteristics of the board (e.g., type, date of manufacture, location of manufacture, tests performed). In some embodiments, the RFID tag 104 can be replaced by cutting the tag 104 from the cavity 110, optionally reading the data on the tag 104 and storing the read data on a replacement tag, and sealing the replacement tag in the cavity 110 in the same manner as the previous tag 104 was sealed. Interchangeability offers the advantage that defective or outdated tags can be replaced with new or updated tags without damaging or otherwise affecting the printed circuit boards 102.

[0019] Fig.3 shows a flow diagram of a method for manufacturing a printed circuit board with embedded radio frequency RFID according to some embodiments. In step 302, the antennas 202, the contact pads 208, and / or the circuitry 206 are applied to the tag substrate 204 in the desired configuration. In some embodiments, the antennas 202 (and / or contact pads 208) are applied to the surface of the tag substrate 204 by photolithography or another application method. Alternatively, the antennas 202 (and / or the contact pads 208) may be applied to the surface of the tag substrate 204 by creating an engraved groove in the substrate 204 and then filling the groove with the material forming the antennas 202. In particular, the groove may have a desired pattern (e.g.,a square spiral) so that the antennas 202 form the same pattern when deposited into the groove. The method used to engrave the grooves may include laser ablation, hot stamping, molding, and / or other suitable methods. In embodiments where the antennas 202 are deposited on both sides of the substrate 204, step 302 further includes creating one or more holes within the substrate 204 such that the antennas 202 on the respective sides of the substrate 204 are electrically coupled to each other. The holes may be created in substantially the same manner as the grooves. In some embodiments, step 302 may include depositing an organic surface preservative (OSP) or other PCB surface coating on the circuitry 206, the contact pads 208, and / or the antennas 202.In some embodiments, step 302 includes ensuring that the antennas 202 are bare after step 302 and are not coated by any solder mask, cover layer, or other coating so that they will be bare when coated with the non-conductive adhesive as described above. In some embodiments, step 302 includes attaching the tag circuit 206 to the contact pads 208 and / or the substrate 204 with a conductive adhesive material. In some embodiments, step 302 may be a roll-to-roll process to save costs. Alternatively, one or more sections from step 302 may be combined with foils.

[0020] In step 304, the one or more conductive portions 105 and / or the one or more electrical components 108 are applied and / or glued to the circuit board 102. In step 306, one or more cavities 110 are created in the circuit board 102. The one or more cavities 110 can be created in the circuit board by lasering, routing, photolithography, etching, or another suitable ablation process. In some embodiments, creating the cavities 110 further comprises creating one or more holes extending from the cavity 110 to the other side of the board to allow for ventilation. This hole creation can occur in substantially the same manner and at the same time as the creation of the cavity 110. Alternatively, a different method for creating the holes can be used at the same time or at a different time than the creation of the cavity 110.In step 308, an RFID tag 104 can be embedded in each of the cavities 110. The tags 104 can be inserted into the cavities 110 manually or automatically. In some embodiments, the tags 104 are first pre-adhered in the cavity 110. Alternatively, the tags 104 can be temporarily held in place by vacuum or simply inserted into the cavity without anything holding the tags 104 in place.

[0021] In step 310, the labels 104 are sealed within the cavities 110 with the non-conductive adhesive 112. In some embodiments, sealing the labels 104 with the adhesive 112 includes fully or partially covering the labels 104 with the adhesive 112 and immediately curing the adhesive 112 using UV curing. Alternatively, UV curing, thermal curing, other curing methods, and / or a combination thereof may be used directly or indirectly. In step 312, the label reader 106 reads the labels 104 in the plate to determine if they are functioning properly. In some embodiments, the method further includes pre-testing one or more of the tags 104 (and their components), the circuitry 108, the conductive portions 105, and / or the remaining circuit board 102 to determine if they are functional before being incorporated into the circuit boards with embedded radio frequency RFID.As a result, the method can offer the advantage that only error-free labels 104 and circuit boards 102 are used, thereby saving costs.

[0022] The embedded radio-frequency RFID system, method, and apparatus described herein offer numerous advantages. In particular, the embedded RFID system allows each PCB to store data, giving each PCB sold to a customer a unique ID that is readable throughout the product's lifetime. Specifically, the label embedded in the PCB can be wirelessly read and store data for tracking the entire production chain, from the transportation phase to the final product. The stored data can include information about how, when, and where the PCB and / or chips on the PCB were tested, which can be used to determine the effectiveness of positions and testing procedures and to locate defects that cause product defects.Furthermore, the unique ID / stored information can be used to access data about the PCB's production, quality, and / or usability, stored in a PCB database that links each unique ID to data about the PCB in which the tag is embedded. Finally, the system offers the advantage of allowing RFID tags to be embedded into any injection-molded part through the injection molding process. In particular, the system allows for the RFIDs to be used directly in the mold while it is still hot, as the tags are resistant to high temperatures.

[0023] The embedded RFID system has been described with respect to specific embodiments, including details to facilitate understanding of the design and operating principles of the embedded RFID system. The specific configurations and methods illustrated, as well as those described with respect to the various components and their relationships to one another, are provided as examples only. Any reference to specific embodiments and details thereof is not intended to limit the scope of the appended claims. Those skilled in the art will recognize that changes may be made to the embodiments chosen for illustrative purposes without departing from the spirit and scope of the embedded RFID system.For example, although the above explanations refer to the embedding of RFID tags in a PCB, it is conceivable to use the same process to embed RFID tags in other objects, such as ink cartridges, glasses, ampoules or other injection-molded products.

Claims

[1] Printed circuit board (102) with embedded RFID, comprising: a board with a non-conductive substrate (103) and one or more conductive tracks (105); one or more electronic components (108) coupled to the plate, wherein the one or more electronic components (108) are mechanically supported by the non-conductive substrate (103) and electrically coupled by the conductive traces (105); and a high-frequency RFID tag (104) embedded in a cavity (110) of the non-conductive substrate of the plate, wherein the label (104) comprises a first antenna and a second antenna (202) formed on opposite sides of a flexible label substrate and electrically coupled to each other via a bore through the flexible label substrate. [2] The circuit board (102) of claim 1, wherein the label (104) is secured in the cavity (110) with a cavity adhesive (112) that couples the label (104) to the board. [3] The circuit board (102) of claim 2, wherein the label (104) comprises an RFID chip electrically coupled to the first and second antennas (202) and the flexible label substrate by a conductive adhesive. [4] The circuit board (102) of claim 3, wherein the first and second antennas (202) are uncoated on the flexible label substrate such that the cavity adhesive (112) is in direct contact with the antennas (202). [5] The circuit board (102) of claim 4, wherein the label (104) is a passive label such that the label (104) is powered exclusively by incoming electromagnetic signals received by one or more of the antennas (202). [6] The circuit board (102) of claim 5, wherein the cavity (110) has a depth of 200 to 300 micrometers and the first and second antennas (202) have a thickness of 5 to 10 micrometers. [7] The printed circuit board (102) of claim 1, wherein a bottom of the cavity (110) of the non-conductive substrate (103) comprises one or more through holes each forming feedthroughs from the cavity (110) through the non-conductive substrate (103) to an opposite side of the non-conductive substrate (103). [8] The circuit board (102) of claim 1, wherein the cavity adhesive (112) surrounds at least a top surface of the label (104) to protect the label (104) and seal the label (104) within the cavity (110). [9] The printed circuit board (102) of claim 1, wherein the label (104) stores an identifier that uniquely identifies the printed circuit board (102). [10] A method for manufacturing a printed circuit board (102) with embedded RFID, comprising: Providing a board comprising a non-conductive substrate (103) and one or more conductive tracks (105); coupling one or more electronic components (108) coupled to the plate, wherein the one or more electronic components (108) are mechanically supported by the non-conductive substrate (103) and electrically coupled by the conductive tracks (105); Creating a cavity (110) within the non-conductive substrate (103) of the plate; and Embedding a high-frequency RFID label (104) in the cavity (110) of the non-conductive substrate (103) of the plate, wherein the label (104) comprises a first antenna and a second antenna (202) formed on opposite sides of a flexible label substrate and electrically coupled to each other via a bore through the flexible label substrate. [11] The method of claim 10, further comprising securing the label (104) within the cavity (110) with a cavity adhesive (112) that couples the label (104) to the plate. [12] The method of claim 11, wherein the label (104) comprises an RFID chip electrically coupled to the first and second antennas (202) and the flexible label substrate by a conductive adhesive. [13] The method of claim 12, wherein the first and second antennas (202) are uncoated on the flexible label substrate such that the cavity adhesive (112) is in direct contact with the antennas (202). [14] The method of claim 13, wherein the tag (104) is a passive tag such that the tag (104) is powered exclusively by incoming electromagnetic signals received by one or more of the antennas (202). [15] The method of claim 14, wherein the cavity (110) has a depth of 200 to 300 micrometers and the first and second antennas (202) have a thickness of 5 to 10 micrometers. [16] The method of claim 10, further comprising forming one or more through holes in a bottom of the cavity (110) of the non-conductive substrate (103), each forming feedthroughs from the cavity (110) through the non-conductive substrate (103) to an opposite side of the non-conductive substrate (103). [17] The method of claim 10, wherein the cavity adhesive (112) surrounds at least a top surface of the label (104) to protect the label (104) and seal the label (104) within the cavity (110). [18] The method of claim 10, wherein the label (104) stores an identifier that uniquely identifies the circuit board (102). [19] The method of claim 10, further comprising testing the board, the electronic components (108) and the label (104) for defects before the label (104) is embedded in the board. [20] RFID system comprising: a board with a non-conductive substrate (103) and one or more conductive tracks (105); one or more electronic components (108) coupled to the board, wherein the one or more electronic components (108) are mechanically supported by the non-conductive substrate (103) and electrically coupled by the conductive traces (105); a radio frequency RFID tag (104) embedded in a cavity (110) of the non-conductive substrate (103) of the plate and storing data; and a label reader (106) that can read the data stored on the high-frequency RFID label (104), wherein the label (104) comprises a first antenna and a second antenna (202) formed on opposite sides of a flexible label substrate and electrically coupled to each other via a bore through the flexible label substrate. [21] The RFID system of claim 20, wherein the label (104) is secured in the cavity (110) with a cavity adhesive (112) that couples the label (104) to the plate. [22] The RFID system of claim 21, wherein the label (104) comprises an RFID chip electrically coupled to the first and second antennas (202) and the flexible label substrate by a conductive adhesive. [23] The RFID system of claim 22, wherein the first and second antennas (202) are uncoated on the flexible label substrate such that the cavity adhesive (112) is in direct contact with the antennas (202). [24] The RFID system of claim 23, wherein the tag (104) is a passive tag such that the tag (104) is powered solely by incoming electromagnetic signals received by one or more of the antennas (202). [25] The RFID system of claim 24, wherein the cavity (110) has a depth of 200 to 300 micrometers and the first and second antennas (202) have a thickness of 5 to 10 micrometers. [26] The RFID system of claim 20, wherein a bottom of the cavity (110) of the non-conductive substrate (103) comprises one or more through holes each forming passages from the cavity (110) through the non-conductive substrate (103) to an opposite side of the non-conductive substrate (103). [27] The RFID system of claim 20, wherein the cavity adhesive (112) surrounds at least a top surface of the label (104) to protect the label (104) and seal the label (104) within the cavity (110). [28] The RFID system of claim 20, wherein the data comprises an identifier that uniquely identifies the plate.

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