Organic optoelectronic device and method for fabricating an organic optoelectronic device

Abstract

Organic optoelectronic device (1) comprising a first electrode (20), an organic functional layer structure (22) over the first electrode (20), a second electrode (23) over the organic functional layer structure (22), at least one contact section (18) for electrically contacting the organic optoelectronic device (1), wherein the contact section (18) is electrically connected to one of the electrodes (20, 23), and an electrically conductive elastomer connector (28) arranged over the contact section (18) and electrically connected to the contact section (18), wherein a contact pin (29) is arranged in the elastomer connector (28) and is force-fit connected to the elastomer connector (28) for releasable electrical contacting of the organic optoelectronic device (1).

Description

The invention relates to an organic optoelectronic component having an organic functional layer structure and to a method for producing such an organic optoelectronic component.The publication DE 10 2012 109 138 A1 describes an optoelectronic component and a method for producing the same.The document WO 2014 / 007 322 A1 describes an organic light-emitting module and an electrical supply device therefor.Document WO 2013 / 154 047 A1 describes an organic electroluminescent module and a power supply structure therefor.The document WO 2013 / 145 694 A1 describes a wafer for producing imaging elements and a method for producing imaging elements.Optoelectronic components which emit light can be, for example, light-emitting diodes (LEDs) or organic light-emitting diodes (OLEDs). An OLED may have an anode and a cathode with an organic functional layer system therebetween. The organic functional layer system may have one or more emitter layers in which electromagnetic radiation is generated, a charge generating layer structure comprising in each case two or more charge generating layer(s) for charge generating pair generation, and one or more electron blocking layers, also referred to as hole transport layer(s) (HTL), and one or more hole blocking layers, also referred to as electron transport layer(s) (ETL), in order to direct the current flow.Organic optoelectronic components of this type are usually produced and manufactured in wafer assemblage. After the individual layers of the organic optoelectronic components have been applied to a wafer substrate, the organic optoelectronic components are singulated. For external contacting, their contact sections are evaluated using flex-on-glass techniques such as ACF bonding. Alternatively, ultrasonic bonded or thermal / pressure assisted external contacts are provided on the component level with a conductive adhesive. A customer can solder a singled out organic optoelectronic component onto a printed circuit board, for example. Alternatively, electrical connectors matching the organic optoelectronic component are provided to the customer, with which the customer can electrically connect the organic optoelectronic component externally.Such external electrical connection techniques require organic optoelectronic components singulated from the wafer assemblage. In particular, a contact section of the organic optoelectronic component produced in the wafer assemblage cannot be used in the wafer assemblage, as a result of which, for example, a test for functionality of the individual organic optoelectronic components at the wafer level, that is to say in the wafer assemblage, is often not possible.The external electrical connection produced in a conventional manner can usually also not be released without restricting or even destroying components and / or functions of the organic optoelectronic component.The object of the invention is to specify an organic optoelectronic component which enables an external electrical connection in a simple manner, in particular without being singulated from a wafer composite for this purpose, and / or which enables a releasable external electrical connection, in particular without adversely affecting functions of the organic optoelectronic component in this case, and / or which enables a robust external electrical connection.A further object of the invention is to specify a method for producing an organic optoelectronic component which can be carried out easily and / or economically and which in particular enables external electrical contacting in the wafer composite and / or releasable and / or robust external electrical contacting.According to one aspect of the invention, the object is achieved by an organic optoelectronic component having a first electrode, an organic functional layer structure above the first electrode, a second electrode above the organic functional layer structure and at least one contact section for electrically contacting the organic optoelectronic component. The contact portion is electrically connected to one of the electrodes. In addition, the organic optoelectronic component has an electrically conductive elastomer connector which is arranged above the contact section and is electrically connected to the contact section.The elastomer connector is arranged for the electrical contacting of the electrode electrically connected to the contact section. The elastomer connector makes it possible to test and / or measure the organic optoelectronic components already in the wafer composite. Singulation of the organic optoelectronic component from the wafer composite is therefore no longer absolutely necessary for testing or measurement. In addition, the elastomer connector results in a robust construction of the organic optoelectronic component with defined contact regions. Furthermore, in the field of application of the organic optoelectronic component, it is possible to provide a re-detachable connection by means of the elastomer connector. The connection to the elastomer connector also makes it possible to withstand aggressive media, such as corrosive gases, for example, resists the effects of temperature / moisture in the user sector, and / or is distinguished by its robust properties.The first electrode and the second electrode are arranged to electrically contact the organic functional layer structure. For example, the first electrode and the second electrode are each formed as an electrically conductive electrode layer or as part of an electrically conductive electrode layer.The organic functional layer structure is configured to convert electrical energy into light or light into electrical energy. For example, the organic optoelectronic component is an OLED and the organic functional layer structure is an optically active region of the OLED.The contact section is configured for electrically contacting the organic optoelectronic component. For example, the contact section is an open region of one of the electrodes, on which an external connection can be applied. Specifically, the contact portion is electrically connected to the first electrode or the second electrode. For example, the contact section is an electrically conductive partial layer, for example a metal layer arranged in regions, which is arranged on or under the one electrode and is directly electrically and / or physically connected to the latter.The elastomer connector is a connecting element which is rigid in shape but elastically deformable. For example, the elastomer connector contains at least one plastic, the glass transition point of which is below the use temperature. The plastic can elastically deform under tensile and compressive loads and, after releasing the tensile or compressive load, resumes its original, undeformed shape. For example, the plastic of the elastomer connector comprises or is formed from natural rubber or silicone rubber.The elastomer connector is electrically conductive. For this purpose, the material of the elastomer connector is designed to be electrically conductive overall, or the elastomer connector has at least one material, such as a layer and / or components, which have electrically conductive properties. The fact that the material is electrically conductive or has electrically conductive properties means that the material is not an insulator.According to a further development, the elastomer connector is elastic and has an elastic modulus of 1 N / mm 2 to 10 N / mm 2, in particular of 2.5 N / mm 2 to 7.5 N / mm 2.Due to the elastic properties and an elastic modulus in the aforementioned range, it is possible in particular to arrange a robust and / or releasable, external electrically conductive connection on the elastomer connector without damaging or even destroying electrically conductive components in the process. Elastic is to be understood in particular to mean that the elastomer connector can react reversibly to an acting force. The modulus of elasticity in the stated range enables a desired and / or reversible deformation of the elastomer connector.According to one refinement, the elastomer connector has electrically conductive material and electrically insulating material. The electrically conductive material is designed and distributed in the elastomer connector in such a way that an electrical conductivity is provided by the elastomer connector for external electrical contacting.By the combination of electrically conductive material and electrically insulating material, in particular favorable and desired properties of different materials can be provided and combined. For example, the electrical conductivity and at the same time the elastic properties of the elastomer connector can be produced in this way.For example, the elastomer connector comprises carbon, a polymer, a metal, rubber and / or silicone as material.According to one refinement, the elastomer connector has alternating electrically conductive and electrically insulating layers which extend perpendicularly to a lateral extent of the organically functional layer structure, the electrically conductive layers being electrically connected to the contact section.The vertically arranged, electrically conductive layers allow electrical conductivity of the elastomer connector to be realized in a direction perpendicular to the organic functional layer structure. At the same time, the vertically arranged electrically insulating layers can allow elastic deformation, for example also in the direction perpendicular to the organic functional layer structure.The perpendicular direction relates in particular to a lateral extent of the individual layers of the organic optoelectronic component and / or to a lateral extent of the organic optoelectronic component as a whole.According to one refinement, the elastomer connector has an electrically insulating carrier material, in which electrically conductive structures are embedded.For example, the electrically insulating carrier material is a carbon matrix, a silicone, a polymer and / or a rubber. The embedded, electrically conductive structures are, for example, electrically conductive threads, electrically conductive particles, for example silver particles, electrically conductive nanowires, for example Ag nanowires, or carbon nanotubes. In this case, in particular, the percolation threshold, i.e. the formation of contiguous regions of the electrically conductive structures in the electrically insulating carrier material, is exceeded, so that overall a sufficient electrical conductivity of the elastomer connector is provided.According to a development, the elastomer connector has an electrically insulating elastic main body, which is wound around with an electrically conductive wire, wherein an axis of the main body, around which the wire is wound, extends in the lateral direction.For example, the base body is a silicone body, which is wound around with the wire. By means of the winding, in particular an electrical conductivity can be generated from the contact section to an opposite side of the elastomer connector.According to one development, a contact pin is arranged in the elastomer connector for the electrical contacting of the organic optoelectronic component and is connected to the elastomer connector in a force-fit manner. The contact pin can be arranged in the elastomer connector in a direction perpendicular to the lateral extent of the organic functional layer structure. The contact pin can be formed pointed and / or needle-shaped, so that it can be easily pierced into the material of the elastomer connector.A simple, robust and / or releasable external electrically conductive contact can be realized by the contact pin. For external contacting, only the contact pin is to be introduced into the elastomer connector. Due to the elastic properties of the elastomer connector, a force-fit connection between contact pin and elastomer connector is possible. The force-fit connection arises because, when the contact pin is inserted, the material of the elastomer connector is displaced by the contact pin and the material exerts a counterpressure on the contact pin on account of its elastic properties. A secure and robust connection is produced which, for example, also resists possible vibrations on and around the organic optoelectronic component. In addition, favorable and desired requirements are made possible with regard to the penetration of aggressive media and moisture and with regard to the withstanding of undesired temperatures.According to a further development, the contact pin has a barb which is arranged in the elastomer connector, wherein the contact pin is connected with the barb in a positively locking manner to the elastomer connector.The barb of the contact pin, which is introduced into the elastomer connector and connected thereto in a form-fitting manner, enables a particularly robust and / or permanent connection for external electrical contacting. The form-fit connection arises because, when the contact pin is inserted, the material of the elastomer connector is displaced by the contact pin and the barb and the material closes again at least partially on account of its elastic properties, with the result that the barb hooks therein. Easy and possibly unintentional removal of the contact pin from the elastomer connector is made more difficult due to the barb. The barb can be formed, for example, at the end of the contact pin and / or have a tip which points counter to the direction of a tip of the contact pin.According to a further development, a metal layer is formed over the second electrode, which metal layer has at least one recess for the passage of the contact pin into the elastomer connector.The metal layer serves as a final layer of the organic optoelectronic component, in particular as a cover, for example as a foil cover. In this case, the metal layer can additionally be provided for fastening, mounting and / or clamping the elastomer connector to the contact section. The metal layer preferably extends over the entire lateral extent of the organic optoelectronic component, with the exception of necessary, formed spacings and / or gaps for electrical insulation between individual subareas of the organic optoelectronic component and with the exception of the cutout for the passage of the contact pin.According to one development, a first recess for electrically contacting the organic optoelectronic component in the wafer composite and a second recess for electrically contacting the organic optoelectronic component in the isolated state of the organic optoelectronic component are formed in the metal layer for test operation.By arranging two recesses, in particular formed for the test operation and the application operation, an intact interface of the organic optoelectronic component can be provided to the customer or the user despite the test operation carried out in the wafer assemblage.The contact pin, which is introduced into the first recess in the test operation, can remain in the first recess and in the elastomer connector after the test operation. Alternatively, it is possible to remove the contact pin required for this purpose after the test operation. In both cases, the second recess remains intact and undamaged, so that an intact region of the elastomer connector is available for use.As an alternative to two recesses, it is possible to realize a large-area test contact on the metal layer by conductive coupling of the elastomer connector to the metal layer. This allows a test operation that can be carried out easily. Furthermore, it is possible to use a flattened and / or wide contact pin without a tip in test operation for contacting the elastomer connector, wherein the corresponding contact pin is merely brought into physical contact with the elastomer connector and is not inserted therein.The organic optoelectronic component comprises:a first electrode,an organic functional layer structure over the first electrode,a second electrode over the organic functional layer structure,at least one contact section for electrically contacting the organic optoelectronic component, wherein the contact section is electrically connected to one of the electrodes, andan electrically conductive elastomer connector disposed over the contact portion and electrically connected to the contact portion.The object is further achieved by a method for producing an organic optoelectronic component, for example the organic optoelectronic component explained above. In the method, the first electrode is formed, the organic functional layer structure is formed over the first electrode, the second electrode is formed over the organic functional layer structure, and at least the one contact section for electrically contacting the organic optoelectronic component is formed, wherein the contact section is electrically connected to the corresponding electrodes. Furthermore, the electrically conductive elastomer connector is arranged over the contact section and electrically connected to the contact section.The production method is distinguished by a conventional, known production of the layer structure of the organic optoelectronic component including possibly necessary exposure of the contact region. Subsequently, in a modification to the usual production method, the elastomer connector is applied to the contact section, for example by means of a conductive adhesive.The method is distinguished in particular by its simple and cost-effective implementation and by its possible external electrical contacting in the wafer composite and / or its produced, detachable external electrical contacting.Alternative embodiments and / or advantages relating to the elastomer connector, the organic functional layer structure, the organic optoelectronic component and / or respective components thereof have already been set out in connection with the respective product further above in the application and are of course used accordingly in the production method without being explicitly mentioned again here.According to a development, the metal layer is formed over the elastomer connector, wherein at least the one recess is formed in the metal layer for external electrical contacting of the corresponding contact section.The elastomer connector can be applied to the contact section in a self-adhesive manner, for example by means of conductive adhesives. Alternatively, the elastomer connector can be clamped under the metal layer. The metal layer thus serves as a cover, for example as a foil cover, and seals off the organic optoelectronic component from its environment.According to one development, for the electrical contacting of the organic optoelectronic component, at least the one contact pin is guided through the recess and inserted into the elastomer connector. The contact pin serves for external electrical contacting. Therefore, the contact pin is designed to be electrically conductive and is electrically conductively connected to the elastomer connector.The contact pin can allow simple, but nevertheless robust and in particular releasable contacting. Rapid contacting of the organic optoelectronic component is thus made possible.According to one development, the organic optoelectronic component is produced in a wafer composite, wherein the organic optoelectronic component is tested in the wafer composite before singulating the corresponding optoelectronic components from the wafer composite.For testing, in test operation, a contact pin is inserted into the elastomer connector in a wafer composite and electrically conductively connected to the latter. After the test operation, this contact pin can remain in the elastomer connector or alternatively be removed without substantial damage to the elastomer connector due to the detachable connection between contact pin and elastomer connector.According to one development, the organic optoelectronic component is singulated from the wafer composite after the test and provided in particular for an application operation. In use, simple external electrical contacting with the contact pin can be realized.In the method for producing an organic optoelectronic component, a first electrode is formed, an organic functional layer structure is formed over the first electrode, a second electrode is formed over the organic functional layer structure, at least one contact section is formed for electrically contacting the organic optoelectronic component, wherein the contact section is electrically connected to one of the electrodes, and an electrically conductive elastomer connector is arranged over the contact section and electrically connected to the contact section, a metal layer is formed over the elastomer connector, and at least one recess is formed in the metal layer for external electrical contacting of the corresponding contact section.Exemplary embodiments of the invention are illustrated in the figures and are explained in more detail below.The following are shown: FIG. 1 shows a lateral sectional illustration of a conventional organic optoelectronic component; FIG. 2A shows a lateral sectional illustration of an exemplary embodiment of an organic optoelectronic component; FIG. 2B shows a plan view of the exemplary embodiment of the organic optoelectronic component of FIG. 2A in the wafer composite; FIG. 3A shows a lateral sectional illustration of an exemplary embodiment of an organic optoelectronic component; FIG. 3B shows a plan view of the exemplary embodiment of the organic optoelectronic component of FIG. 3A ; FIG. 4 shows a lateral sectional illustration of an exemplary embodiment of an organic optoelectronic component.In the following detailed description, reference is made to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology such as "top", "bottom", "front", "back", "front", "rear", etc. is used with reference to the orientation of the figure(s) described. Since components of embodiments may be positioned in a number of different orientations, the direction terminology is for the purpose of illustration and is in no way limiting. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. It is understood that the features of the various embodiments described herein may be combined with each other, unless specifically stated otherwise. The following detailed description is therefore not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.In the context of this description, the terms "connected", "connected" and "coupled" are used to describe both a direct and an indirect connection, a direct or indirect connection and a direct or indirect coupling. In the figures, identical or similar elements are provided with identical reference numerals, as appropriate.An organic optoelectronic component can be an organic electromagnetic radiation-emitting component or an organic electromagnetic radiation-absorbing component. An organic electromagnetic radiation-absorbing component can be, for example, an organic solar cell or an organic photocell. In various exemplary embodiments, an organic electromagnetic radiation-emitting component can be formed as an organic light-emitting diode (OLED) or as an organic electromagnetic radiation-emitting transistor. The radiation can be, for example, light in the visible range, UV light and / or infrared light. In various embodiments, the organic light-emitting component may be part of an integrated circuit. Furthermore, a plurality of organic light-emitting components can be provided, for example accommodated in a common housing.FIG. 1 shows a conventional organic optoelectronic component 1. the organic optoelectronic component 1 has a carrier 12. The carrier 12 can be translucent or transparent. The carrier 12 serves as a carrier element for electronic elements or layers, for example light-emitting elements. The carrier 12 can comprise or be formed from, for example, plastic, metal, glass, quartz and / or a semiconductor material.Furthermore, the carrier 12 can comprise or be formed from a plastic film or a laminate with one or more plastic films. The carrier 12 can be designed to be mechanically rigid or mechanically flexible.An optoelectronic layer structure is formed on the carrier 12. The optoelectronic layer structure comprises a first electrode layer 14 comprising a first contact portion 16, a second contact portion 18 and a first electrode 20. The carrier 12 with the first electrode layer 14 can also be referred to as a substrate. Between the carrier 12 and the first electrode layer 14, a first barrier layer, not shown, for example a first barrier thin layer, can be formed.The first electrode 20 is electrically insulated from the first contact portion 16 by means of an electrical insulation barrier 21. The second contact section 18 is electrically coupled to the first electrode 20 of the optoelectronic layer structure. The first electrode 20 can be designed as an anode or as a cathode. The first electrode 20 can be translucent or transparent. The first electrode 20 comprises an electrically conductive material, for example metal and / or a conductive transparent oxide (TCO) or a layer stack of a plurality of layers comprising metals or TCOs. The first electrode 20 may include, for example, a layer stack of a combination of a layer of a metal on a layer of a TCO, or vice versa. An example is a silver layer applied on an indium tin oxide (ITO) layer (Ag on ITO) or ITO-Ag-ITO multilayers. The first electrode 20 can alternatively or additionally comprise the materials mentioned: networks of metallic nanowires and particles, for example of Ag, networks of carbon nanotubes, graphene particles and layers and / or networks of semiconducting nanowires.An optically functional layer structure, for example an organic functional layer structure 22, of the optoelectronic layer structure is formed above the first electrode 20. The organic functional layer structure 22 can have, for example, one, two or more sublayers. For example, the organic functional layer structure 22 may include a hole injection layer, a hole transport layer, an emitter layer, an electron transport layer and / or an electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and the hole transport layer. In the hole transport layer, the hole conductivity is larger than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is greater than the hole conductivity. The electron transport layer serves to transport the holes. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 can comprise one, two or more functional layer structure units, each of which comprises the partial layers mentioned and / or further intermediate layers.Above the organic functional layer structure 22, a second electrode 23 of the optoelectronic layer structure is formed, which is electrically coupled to the first contact section 16. The second electrode 23 can be formed according to one of the configurations of the first electrode 20, wherein the first electrode 20 and the second electrode 23 can be formed identically or differently. The first electrode 20 serves, for example, as an anode or cathode of the optoelectronic layer structure. The second electrode 23 serves, corresponding to the first electrode, as cathode or anode of the optoelectronic layer structure.The optoelectronic layer structure is an electrically and / or optically active region. The active region is, for example, the region of the optoelectronic component in which electric current for operating the optoelectronic component flows and / or in which electromagnetic radiation is generated or absorbed. A getter structure (not shown) may be arranged on or above the active region. The getter layer can be translucent, transparent or opaque. The getter layer may comprise or be formed from a material that absorbs and binds substances that are harmful to the active region.Formed over the second electrode 23 and partially over the first contact section 16 and partially over the second contact section 18 is an encapsulation layer 24 of the optoelectronic layer structure, which encapsulates the optoelectronic layer structure. The encapsulation layer 24 can be formed as a second barrier layer, for example as a second barrier thin film. The encapsulation layer 24 can also be referred to as thin-film encapsulation. The encapsulation layer 24 forms a barrier with respect to chemical contaminants or atmospheric substances, in particular with respect to water (moisture) and oxygen. The encapsulation layer 24 can be formed as a single layer, a layer stack or a layer structure. The encapsulation layer 24 may include or be formed from: aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride,Indium tin oxide, indium zinc oxide, aluminum doped zinc oxide, poly(p-phenylene terephthalamide), nylon 66, and mixtures and alloys thereof. Optionally, the first barrier layer can be formed on the carrier 12 in a manner corresponding to a configuration of the encapsulation layer 24.A first recess of the encapsulation layer 24 is formed in the encapsulation layer 24 above the first contact section 16 and a second recess of the encapsulation layer 24 above the second contact section 18. A first contact region 32 is exposed in the first recess of the encapsulation layer 24, and a second contact region 34 is exposed in the second recess of the encapsulation layer 24. The first contact region 32 serves for electrically contacting the first contact portion 16 and the second contact region 34 serves for electrically contacting the second contact portion 18.An adhesive layer 36 is formed over the encapsulation layer 24. The adhesive layer 36 comprises, for example, an adhesive, for example an adhesive, for example a laminating adhesive, a lacquer and / or a resin. The adhesive layer 36 can have particles, for example, which scatter electromagnetic radiation, for example light-scattering particles.Over the adhesive layer 36, a cover body 38 is formed. The adhesive layer 36 serves for fastening the cover body 38 to the encapsulation layer 24. For example, the cover body 38 can be formed substantially from glass and have a thin metal layer, for example a metal foil, and / or a graphite layer, for example a graphite laminate, on the glass body. The cover body 38 serves to protect the conventional optoelectronic component 1, for example, from mechanical actions of force from the outside. Furthermore, the cover body 38 may serve for distributing and / or dissipating heat generated in the conventional optoelectronic component 1. For example, the glass of the cover body 38 can serve as a protection against external influences and the metal layer of the cover body 38 can serve for distributing and / or dissipating the heat generated during operation of the conventional optoelectronic component 1.FIG. 2A shows an exemplary embodiment of an organic optoelectronic component 1, which may largely correspond to the organic optoelectronic component 1 shown in FIG. 1, for example. The organic optoelectronic component 1 comprises the carrier 12, which is in particular formed as a glass substrate, the first electrode 20 above the carrier 12, which is in particular a TCO layer and in particular serves as an anode, the organic functional layer structure 22 on the first electrode 20, the second electrode 23 on the organic functional layer structure 22, which in particular serves as a cathode, an encapsulation layer 24, which is in particular a TFE layer, on the second electrode 23, a cladding layer 25 on the encapsulation layer 24, the adhesive layer 36 on the cladding layer 25, and the covering body 38. The cladding layer 25 serves as another diffusion layer and as a protective layer for the encapsulation layer.The carrier 12 serves as a carrier element for the further layers arranged thereon.The organic functional layer structure 22 may include one, two or more sublayers. For example, the organic functional layer structure 22 may include the hole injection layer, the hole transport layer, the emitter layer, the electron transport layer and / or the electron injection layer. The hole injection layer serves to reduce the band gap between the first electrode and the hole transport layer. In the hole transport layer, the hole conductivity is larger than the electron conductivity. The hole transport layer serves to transport the holes. In the electron transport layer, the electron conductivity is greater than the hole conductivity. The electron transport layer serves to transport the holes. The electron injection layer serves to reduce the band gap between the second electrode and the electron transport layer. Furthermore, the organic functional layer structure 22 can comprise one, two or more functional layer structure units, each of which comprises the partial layers mentioned and / or further intermediate layers.The encapsulation layer 24 can be formed as a barrier layer, for example as a barrier thin layer. The encapsulation layer 24 can also be referred to as thin-film encapsulation. The encapsulation layer 24 forms a barrier with respect to chemical contaminants or atmospheric substances, in particular with respect to water (moisture) and oxygen. The encapsulation layer 24 can be formed as a single layer, a layer stack or a layer structure. The encapsulation layer 24 may include or be formed from aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, tantalum oxide, lanthanum oxide, silicon oxide, silicon nitride, silicon oxynitride, indium tin oxide, indium zinc oxide, aluminum-doped zinc oxide, poly(p-phenylene terephthalamide), nylon 66, as well as mixtures and alloys thereof or tetrafluoroethylene (TFE).The adhesive layer 36 comprises, for example, an adhesive, for example an adhesive, for example a laminating adhesive and / or PSA (Pressure Sensitive Adhesive), a lacquer and / or a resin. The adhesive layer 36 can have particles, for example, which scatter electromagnetic radiation, for example light-scattering particles. The adhesive layer 36 serves for fastening the cover body 38 to the encapsulation layer 24. the cover body 38 serves for protecting the organic optoelectronic component 1, for example from mechanical actions of force from the outside. Furthermore, the cover body 38 may serve for distributing and / or dissipating heat generated in the organic optoelectronic component 1. The covering body 38 can have or be, in particular, a metal layer or a metal foil.The first electrode 20 has the contact section 18, which is configured for external electrical contact with the organic optoelectronic component 1. For this purpose, the contact section 18 is electrically conductively connected to the first electrode 20. In particular, the contact section 18 is a partial region of the first electrode layer 14 and the first electrode 20 is a partial region of the first electrode layer 14 adjoining the latter.A metal contact 26, for example a layer sequence of a chromium layer, an aluminum layer and a further chromium layer, is arranged on the contact section 18. A conductive adhesive 27, for example made of nickel and / or silver, is applied to this metal contact 26. An elastomer connector 28 is arranged on the conductive adhesive, which has at least one exposed partial region for external electrical contacting.The elastomer connector has elastic, dimensionally stable and electrically conductive properties, so that electrical contacting of the first electrode 20 is possible by means of the elastomer connector 28, the conductive adhesive 27 and the metal contact 26. For example, the elastomer connector has an elastic modulus of 1 N / mm 2 to 10 N / mm 2, in particular of 2.5 N / mm 2 to 7.5 N / mm 2. In particular, the elastomer connector has electrically conductive and electrically non-conductive layers made of silicone rubber arranged alternately, which extend in the vertical direction to the lateral extent of the organic functional layer structure 22.An electrically conductive contact pin 29, for example a contact pin, is introduced, inserted and / or inserted into the elastomer connector 28 for external electrical contacting, as schematically illustrated in FIG. 2A. The contact pin 29 has a base plate and a pin or pin projecting therefrom. The pin or pin is preferably needle-shaped and / or pointed. Subsequently, the contact pin 29 is inserted, inserted or inserted into the elastomer connector 28 and enclosed by it. The contact pin 29 displaces the material of the elastomer connector 28 and forms a hole in the elastomer connector 28. Due to its elastic properties, the material of the elastomer connector 28 exerts a counterforce on the contact pin 29, as a result of which a force-fit connection is produced between the contact pin 29 and the elastomer connector 28. The contacting with the elastomer connector 28 and the contact pin 29 enables a robust, re-detachable external connection, which in particular allows an external connection of the organic optoelectronic component 1 in the wafer composite. This is discussed in more detail in connection with FIG. 2B.In order to be able to introduce the contact pin 29 into the elastomer connector 28, the covering body 38 and the adhesive layer 36 each have a recess in the region to be passed through. For example, the cover body 38 designed as a metal layer has pre-punched holes or holes subsequently introduced, for example, by means of a laser.The base plate of the contact pin 29 can be arranged above the recess of the cover body 38 in the contacted state. This means that the lateral extent of the base plate of the contact pin 29 is greater than the lateral extent of the recess of the cover body 38.As an alternative to the elastomer connector 28 discussed above, it can be formed as an elastic body, for example silicone body, with wound-on wire, wherein axes of the body and / or of the windings are aligned in the lateral direction. Alternatively, the elastomeric connector 29 may include and be formed from a carbon matrix with embedded metal filaments.Further alternatively, the elastomer connector cannot be fastened to the metal contact 26 via the conductive adhesive 27, but rather can be clamped under the covering body 38, in particular the metal layer. In this case, the conductive adhesive 27 is optional.FIG. 2B shows the exemplary embodiment of the organic optoelectronic component 1 of FIG. 2A in the wafer assemblage 100, in particular in plan view of the organic optoelectronic component 1. In this case, in plan view, the cover body 38, in particular the metal layer, is visible in each case, wherein organic optoelectronic components 1 adjacent to one another are separated from one another by means of a gap.The cover body 38 of each organic optoelectronic component 1 has a first recess 30, a second recess 31 and a further recess 15. The further recess 15 serves for external electrical contacting of the corresponding second electrode 23. the first recess 30 serves for external electrical contacting of the corresponding first electrode 20 in test operation of the organic optoelectronic component 1 in wafer composite. The second recess 31 serves for external electrical contacting of the corresponding first electrode 20 in the application mode of the organic optoelectronic component 1 in the isolated state.The plurality of recesses 30, 31 in the cover body 38 enable the test operation in wafer composite and the application operation in the isolated state of the organic optoelectronic component 1, wherein an intact interface, for example an interface, can be provided in the application operation. A measurement of the organic optoelectronic components 1 produced in wafer assemblage in wafer assemblage is thus made possible without causing any substantial damage to the external contacting and / or restriction for the user.FIG. 3A shows an exemplary embodiment of an organic optoelectronic component 1, in which the adhesive layer 36 has electrically conductive properties, in particular is an electrically conductively set PSA layer. Electrical insulation to individual regions of the cover body 38, in particular the metal layer, is provided by means of plastic deposits, so-called plastic inserts, or by means of separating the cover body 38 in an external contacting region provided, for example by means of a gap 17.FIG. 3B shows the exemplary embodiment of the organic optoelectronic component 1 of FIG. 3A in plan view. The cover body 38 has three regions which are electrically insulated from one another and are in each case separated from one another by gaps 17. In one region, the first recess 30 and the second recess 31 are arranged for electrically contacting the first electrode 20, in particular for test operation and for application operation. In an adjacent region, a further recess 15 for contacting the second electrode 23 is arranged. The last region is not provided for electrical contacting and serves for covering the layers of the organic optoelectronic component 1.FIG. 4 shows an exemplary embodiment of an organic optoelectronic component 1, in which the contact pin 29 has a barb 40. The barb 40 enables a positive connection between the contact pin 29 and the elastomer connector 28. Easy removal of the contact pin from the elastomer connector 28 is thus made more difficult.The invention is not limited to the exemplary embodiments given. For example, the organic optoelectronic component 1, in particular the organic functional layer structure 22, can be configured in segmented fashion. Alternatively or additionally, a plurality of organic optoelectronic components 1 can be arranged next to one another to form an organic optoelectronic assembly.

Claims

Organic optoelectronic component (1) having a first electrode (20), an organic functional layer structure (22) above the first electrode (20), a second electrode (23) above the organic functional layer structure (22), at least one contact section (18) for electrically contacting the organic optoelectronic component (1), wherein the contact section (18) is electrically connected to one of the electrodes (20, 23), and an electrically conductive elastomer connector (28) which is arranged above the contact section (18) and is electrically connected to the contact section (18), wherein, for the releasable electrical contacting of the organic optoelectronic component (1), a contact pin (29) is arranged in the elastomer connector (28) and is connected in a force-fitting manner to the elastomer connector (28).Organic optoelectronic component (1) comprising a first electrode (20), an organic functional layer structure (22) over the first electrode (20), a second electrode (23) over the organic functional layer structure (22), at least one contact section (18) for electrically contacting the organic optoelectronic component (1), wherein the contact section (18) is electrically connected to one of the electrodes (20, 23), and an electrically conductive elastomer connector (28) which is arranged over the contact section (18) and is electrically connected to the contact section (18), wherein a metal layer is formed over the second electrode (23), which metal layer comprises at least one recess (30, 31) for passing a contact pin (29) into the elastomer connector (28).Organic optoelectronic component (1) according to one of the preceding claims, wherein the elastomer connector (28) is elastic and has an elastic modulus of 1 N / mm 2 to 10 N / mm 2, in particular of 2.5 N / mm 2 to 7.5 N / mm 2.Organic optoelectronic component (1) according to one of the preceding claims, wherein the elastomer connector (28) comprises electrically conductive material and electrically insulating material.Organic optoelectronic component (1) according to claim 4, wherein the elastomer connector (28) alternately comprises electrically conductive and electrically insulating layers which extend perpendicularly to a lateral extent of the organic functional layer structure (22), wherein the electrically conductive layers are electrically connected to the contact section (18).Organic optoelectronic component (1) according to claim 4, wherein the elastomer connector (28) comprises an electrically insulating carrier material in which electrically conductive structures are embedded.Organic optoelectronic component (1) according to claim 4, wherein the elastomer connector (28) has an electrically insulating elastic main body which is wound with an electrically conductive wire, wherein an axis of the main body, around which the wire is wound, extends in the lateral direction.Organic optoelectronic component according to claim 1, wherein the contact pin (29) has a barb (40) which is arranged in the elastomer connector (28), wherein the contact pin (29) is connected to the barb (40) in a positively locking manner to the elastomer connector (28).Organic optoelectronic component (1) according to claim 2, wherein a first recess (3) for electrically contacting the organic optoelectronic component (1) in the wafer composite (100) is formed in the metal layer for a test operation and a second recess (31) for electrically contacting the organic optoelectronic component (1) in the isolated state of the organic optoelectronic component (1) is formed for an application operation.Method for producing an organic optoelectronic component (1), in which a first electrode (20) is formed, an organic functional layer structure (22) is formed over the first electrode (20), a second electrode (23) is formed over the organic functional layer structure (22), at least one contact section (18) is formed for electrically contacting the organic optoelectronic component (1), wherein the contact section (18) is electrically connected to one of the electrodes (20, 23), and an electrically conductive elastomer connector (28) is arranged over the contact section (18) and is electrically connected to the contact section (18), a metal layer is formed over the elastomer connector (28) and at least one recess (30, 31) is formed in the metal layer for externally electrically contacting the corresponding contact section (18).Method according to Claim 10, in which, for the electrical contacting of the organic optoelectronic component (1), at least one contact pin (29) is guided through the recess (30, 31) and is plugged into the elastomer connector (28).Method according to one of the preceding claims 10 to 11, wherein the organic optoelectronic component (1) is produced in the wafer composite (100) and the organic optoelectronic component (1) is tested in the wafer composite (100) before singulating the corresponding optoelectronic components from the wafer composite (100).Method according to Claim 12, wherein the organic optoelectronic component (1) is singulated from the wafer composite (100) after the test.

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